BE851892A - Procede de masticage de disques semi-conducteurs - Google Patents
Procede de masticage de disques semi-conducteursInfo
- Publication number
- BE851892A BE851892A BE175315A BE175315A BE851892A BE 851892 A BE851892 A BE 851892A BE 175315 A BE175315 A BE 175315A BE 175315 A BE175315 A BE 175315A BE 851892 A BE851892 A BE 851892A
- Authority
- BE
- Belgium
- Prior art keywords
- sealing process
- semiconductor discs
- discs sealing
- semiconductor
- sealing
- Prior art date
Links
- 238000000034 method Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
- Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
- Y10T156/1092—All laminae planar and face to face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Laminated Bodies (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE2608427A DE2608427C2 (de) | 1976-03-01 | 1976-03-01 | Verfahren zum Aufkitten von Halbleiterscheiben |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE851892A true BE851892A (fr) | 1977-08-29 |
Family
ID=5971267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE175315A BE851892A (fr) | 1976-03-01 | 1977-02-28 | Procede de masticage de disques semi-conducteurs |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US4300965A (ar) |
| JP (1) | JPS52106683A (ar) |
| BE (1) | BE851892A (ar) |
| CA (1) | CA1075579A (ar) |
| DE (1) | DE2608427C2 (ar) |
| FR (1) | FR2343330A1 (ar) |
| GB (1) | GB1505488A (ar) |
| IT (1) | IT1083481B (ar) |
| NL (1) | NL7614209A (ar) |
| SE (1) | SE7702273L (ar) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2809274A1 (de) * | 1978-03-03 | 1979-09-13 | Wacker Chemitronic | Verfahren zur vergleichmaessigung des polierabtrages von scheiben beim polieren |
| US4517041A (en) * | 1982-09-30 | 1985-05-14 | Magnetic Peripherals Inc. | Method for attaching a workpiece to a workpiece carrier |
| US4530138A (en) * | 1982-09-30 | 1985-07-23 | Westinghouse Electric Corp. | Method of making a transducer assembly |
| EP0256150B1 (en) * | 1986-08-13 | 1990-04-04 | Kabushiki Kaisha Toshiba | Apparatus for bonding semiconductor wafers |
| JP3537688B2 (ja) * | 1998-11-24 | 2004-06-14 | 富士通株式会社 | 磁気ヘッドの加工方法 |
| DE10052293A1 (de) * | 2000-10-20 | 2002-04-25 | B L E Lab Equipment Gmbh | Verfahren zum Aufbringen eines Substrats |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1950468A (en) * | 1930-04-18 | 1934-03-13 | Nat Aniline & Chem Co Inc | Alkyd resinous composition |
| US2394689A (en) * | 1944-01-07 | 1946-02-12 | American Viscose Corp | Method of dyeing |
| US3335087A (en) * | 1965-12-20 | 1967-08-08 | Pennsalt Chemical Corp | Method of stripping resins |
| US3452133A (en) * | 1966-03-07 | 1969-06-24 | Schjeldahl Co G T | Annealing of metal-plastic laminates |
| US3475867A (en) * | 1966-12-20 | 1969-11-04 | Monsanto Co | Processing of semiconductor wafers |
| US3449870A (en) * | 1967-01-24 | 1969-06-17 | Geoscience Instr Corp | Method and apparatus for mounting thin elements |
| US3586559A (en) * | 1968-07-01 | 1971-06-22 | Rohr Corp | Method of temporarily securing a workpiece to a workholder |
| JPS5121334B2 (ar) * | 1971-08-27 | 1976-07-01 | ||
| DE2247067C3 (de) * | 1972-09-26 | 1979-08-09 | Wacker-Chemitronic Gesellschaft Fuer Elektronik-Grundstoffe Mbh, 8263 Burghausen | Verwendung einer Poliersuspension zum schleierfreien Polieren von Halbleiteroberflächen |
| US3888053A (en) * | 1973-05-29 | 1975-06-10 | Rca Corp | Method of shaping semiconductor workpiece |
-
1976
- 1976-03-01 DE DE2608427A patent/DE2608427C2/de not_active Expired
- 1976-12-21 NL NL7614209A patent/NL7614209A/xx not_active Application Discontinuation
-
1977
- 1977-01-20 GB GB2317/77A patent/GB1505488A/en not_active Expired
- 1977-02-07 US US05/766,457 patent/US4300965A/en not_active Expired - Lifetime
- 1977-02-08 CA CA271,285A patent/CA1075579A/en not_active Expired
- 1977-02-25 IT IT48216/77A patent/IT1083481B/it active
- 1977-02-28 BE BE175315A patent/BE851892A/xx not_active IP Right Cessation
- 1977-02-28 FR FR7705766A patent/FR2343330A1/fr active Granted
- 1977-03-01 JP JP2213677A patent/JPS52106683A/ja active Granted
- 1977-03-01 SE SE7702273A patent/SE7702273L/xx not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| GB1505488A (en) | 1978-03-30 |
| CA1075579A (en) | 1980-04-15 |
| JPS5641167B2 (ar) | 1981-09-26 |
| NL7614209A (nl) | 1977-09-05 |
| FR2343330B1 (ar) | 1978-10-20 |
| FR2343330A1 (fr) | 1977-09-30 |
| DE2608427C2 (de) | 1984-07-19 |
| DE2608427A1 (de) | 1977-09-08 |
| IT1083481B (it) | 1985-05-21 |
| JPS52106683A (en) | 1977-09-07 |
| SE7702273L (sv) | 1977-09-02 |
| US4300965A (en) | 1981-11-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| RE | Patent lapsed |
Owner name: WACKER-CHEMITRONIC GESELLSCHAFT FUR ELEKTRONIK GR Effective date: 19840228 |