BE849065A - Procede pour realiser des angles de talus determines pour des bords de structures realisees par attaque chimique - Google Patents

Procede pour realiser des angles de talus determines pour des bords de structures realisees par attaque chimique

Info

Publication number
BE849065A
BE849065A BE172972A BE172972A BE849065A BE 849065 A BE849065 A BE 849065A BE 172972 A BE172972 A BE 172972A BE 172972 A BE172972 A BE 172972A BE 849065 A BE849065 A BE 849065A
Authority
BE
Belgium
Prior art keywords
edges
chemical attack
slope angles
determined slope
structures achieved
Prior art date
Application number
BE172972A
Other languages
English (en)
French (fr)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE849065A publication Critical patent/BE849065A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02057—Cleaning during device manufacture
    • H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
    • H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/311—Etching the insulating layers by chemical or physical means
    • H01L21/31105—Etching inorganic layers
    • H01L21/31111—Etching inorganic layers by chemical means
    • H01L21/31116—Etching inorganic layers by chemical means by dry-etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics
    • H01L21/76804—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics by forming tapered via holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Plasma & Fusion (AREA)
  • Weting (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
BE172972A 1975-12-04 1976-12-03 Procede pour realiser des angles de talus determines pour des bords de structures realisees par attaque chimique BE849065A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752554638 DE2554638A1 (de) 1975-12-04 1975-12-04 Verfahren zur erzeugung definierter boeschungswinkel bei einer aetzkante

Publications (1)

Publication Number Publication Date
BE849065A true BE849065A (fr) 1977-04-01

Family

ID=5963486

Family Applications (1)

Application Number Title Priority Date Filing Date
BE172972A BE849065A (fr) 1975-12-04 1976-12-03 Procede pour realiser des angles de talus determines pour des bords de structures realisees par attaque chimique

Country Status (7)

Country Link
JP (1) JPS5269576A (xx)
BE (1) BE849065A (xx)
DE (1) DE2554638A1 (xx)
FR (1) FR2334199A1 (xx)
GB (1) GB1551290A (xx)
IT (1) IT1065165B (xx)
NL (1) NL7613275A (xx)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DD136670A1 (de) * 1976-02-04 1979-07-18 Rudolf Sacher Verfahren und vorrichtung zur herstellung von halbleiterstrukturen
DE2754549A1 (de) * 1977-12-07 1979-06-13 Siemens Ag Optoelektronischer sensor nach dem prinzip der ladungsinjektion
DE2837485A1 (de) * 1978-08-28 1980-04-17 Siemens Ag Verfahren zur herstellung einer ladungsgekoppelten anordnung fuer sensoren und speicher
JPS55157234A (en) * 1979-05-25 1980-12-06 Chiyou Lsi Gijutsu Kenkyu Kumiai Manufacture of semiconductor device
JPS60128622A (ja) * 1983-12-16 1985-07-09 Hitachi Ltd エツチング法
GB2165692B (en) * 1984-08-25 1989-05-04 Ricoh Kk Manufacture of interconnection patterns
DE68925774T2 (de) * 1988-10-02 1996-08-08 Canon Kk Feinbearbeitungsmethode für kristallines Material
DE4140330C1 (xx) * 1991-12-06 1993-03-18 Texas Instruments Deutschland Gmbh, 8050 Freising, De
DE19837395C2 (de) 1998-08-18 2001-07-19 Infineon Technologies Ag Verfahren zur Herstellung eines eine strukturierte Isolationsschicht enthaltenden Halbleiterbauelements
US6352934B1 (en) * 1999-08-26 2002-03-05 Infineon Technologies Ag Sidewall oxide process for improved shallow junction formation in support region
US20060175670A1 (en) * 2005-02-10 2006-08-10 Nec Compound Semiconductor Device, Ltd. Field effect transistor and method of manufacturing a field effect transistor
JP2011243657A (ja) * 2010-05-14 2011-12-01 Mitsumi Electric Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
GB1551290A (en) 1979-08-30
NL7613275A (nl) 1977-06-07
FR2334199A1 (fr) 1977-07-01
FR2334199B1 (xx) 1979-04-06
DE2554638A1 (de) 1977-06-16
JPS5269576A (en) 1977-06-09
IT1065165B (it) 1985-02-25

Similar Documents

Publication Publication Date Title
FR2320275A1 (fr) Procede perfectionne pour l'attaque chimique du verre
RO75757A (ro) Procedeu de purificare a compusilor vinilaromatici
RO74936A (fr) Procede pour la preparation des mercaptoazetidiones
FR2325668A1 (fr) Procede pour la preparation de polyurethannes
BE838754A (fr) Procede ameliore pour la preparation de dimethylol-2, 2-alcanals
BE849065A (fr) Procede pour realiser des angles de talus determines pour des bords de structures realisees par attaque chimique
RO70525A (ro) Procedeu de preparare a unor bifeniloxi-derivati
RO70581A (ro) Procedeu de preparare a unor amidoxime
FR2319607A1 (fr) Procede pour la chloration dirigee des alcoylbenzenes
BE825861A (fr) Procede pour isoler des tuyaux
BE846883A (fr) Procede pour l'elimination de mercure metallique,
BE842584A (fr) Procede pour la preparation de dihalogenures gemines
FR2274686A1 (fr) Procede pour la preparation de cholesterol esterase
RO70079A (ro) Procedeu pentru prepararea unor n-aril-n-(4-piperidinil)-arilacetamide
BE826238A (fr) Procede pour la preparation de bischlorocarbonates de bisphenol
BE827021A (fr) Procede pour la fabrication de tubes cathodiques
PT64718A (fr) Procede pour la preparation de phenyalcoylamines
RO69403A2 (ro) Procedeu de purificare a extractelor continind substante de evacuare a uterului
FR2336360A1 (fr) Procede pour rendre hydrophobes des materiaux de construction
FR2334623A1 (fr) Procede pour la preparation du soufre
PT64699A (fr) Procede pour eviter l incrustation des reacteurs de polimerisation
RO72558A (ro) Procedeu pentru prepararea unor cicloalcanpirazoli
BE839877A (fr) Procede d'inhibition du retrait d'une composition de ciment
FR2322133A1 (fr) Procede pour produire des acyl-taurides
RO72510A (ro) Procedeu de preparare a unor fenilpirazine