BE799693A - Procede et dispositif de montage de contacts electriques, - Google Patents

Procede et dispositif de montage de contacts electriques,

Info

Publication number
BE799693A
BE799693A BE131245A BE131245A BE799693A BE 799693 A BE799693 A BE 799693A BE 131245 A BE131245 A BE 131245A BE 131245 A BE131245 A BE 131245A BE 799693 A BE799693 A BE 799693A
Authority
BE
Belgium
Prior art keywords
electrical contacts
mounting electrical
mounting
contacts
electrical
Prior art date
Application number
BE131245A
Other languages
English (en)
French (fr)
Inventor
E F Shultz
R E Katzaman
Original Assignee
Amp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amp Inc filed Critical Amp Inc
Publication of BE799693A publication Critical patent/BE799693A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H01R43/205Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0447Hand tools therefor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0478Simultaneously mounting of different components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147Assembling terminal to base
    • Y10T29/49149Assembling terminal to base by metal fusion bonding
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/53Means to assemble or disassemble
    • Y10T29/5313Means to assemble electrical device
    • Y10T29/53174Means to fasten electrical component to wiring board, base, or substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Jigs For Machine Tools (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
BE131245A 1972-05-19 1973-05-17 Procede et dispositif de montage de contacts electriques, BE799693A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US25523972A 1972-05-19 1972-05-19

Publications (1)

Publication Number Publication Date
BE799693A true BE799693A (fr) 1973-11-19

Family

ID=22967449

Family Applications (1)

Application Number Title Priority Date Filing Date
BE131245A BE799693A (fr) 1972-05-19 1973-05-17 Procede et dispositif de montage de contacts electriques,

Country Status (12)

Country Link
US (1) US3800416A (de)
JP (1) JPS4941856A (de)
AR (1) AR196529A1 (de)
AU (1) AU5530273A (de)
BE (1) BE799693A (de)
BR (1) BR7303695D0 (de)
CA (1) CA969676A (de)
DE (1) DE2323668A1 (de)
FR (1) FR2185872A1 (de)
GB (1) GB1377911A (de)
IT (1) IT992550B (de)
NL (1) NL7306805A (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698271A (zh) * 2022-05-16 2022-07-01 四川英创力电子科技股份有限公司 一种在印制电路板双面成型高频层的成型装置及方法

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3946477A (en) * 1974-03-28 1976-03-30 Amp Incorporated Apparatus for aligning and inserting pins into holes of a substrate
CA1031138A (en) * 1974-03-28 1978-05-16 Amp Incorporated Terminal insertion apparatus
DE2814334B2 (de) * 1977-05-03 1981-01-29 Litton Systems, Inc., Beverly Hills, Calif. (V.St.A.) Verfahren zum Montieren eines Steckverbinders auf einer gedruckten Schaltung sowie Werkzeug und Steckverbinder zur Durchführung des Verfahrens
US4089104A (en) * 1977-05-03 1978-05-16 Litton Systems, Inc. Method and apparatus for preassembling a printed circuit board connector
US4215469A (en) * 1977-09-29 1980-08-05 Fuji Mgf. Co., Ltd. Method of inserting electronic components to a printed circuit board
US4418475A (en) * 1979-11-19 1983-12-06 Elfab Corporation Method of manufacturing a printed circuit card edge connector having a pull through bellows contact a lay-over insulator
US4398628A (en) * 1980-09-30 1983-08-16 Western Electric Company, Inc. Methods of inserting pins into an apparatus and a pin supporting shuttle used therefor
JPS5678085A (en) * 1980-12-01 1981-06-26 Yamaichi Electric Mfg Method of implanting male contactor for connector
JPS6022479B2 (ja) * 1980-12-01 1985-06-01 山一電機工業株式会社 雄コネクタにおける接触部と脚部とが直角をなす雄接触子の植込方法
US4378632A (en) * 1980-12-23 1983-04-05 Elfab Corporation Method of and apparatus for pull-fitting contacts
US4380118A (en) * 1981-08-13 1983-04-19 Amp Incorporated Terminal insertion tool
US4515354A (en) * 1982-09-13 1985-05-07 At&T Technologies, Inc. Fixture for assembling pins into a shuttle
US4753601A (en) * 1983-10-14 1988-06-28 Amp Incorporated Circuit board thickness compensator
US4769905A (en) * 1987-05-15 1988-09-13 Amp Incorporated Apparatus and method for loading semiconductor chip carriers into sockets
DE102014107998B3 (de) * 2014-06-06 2015-09-10 Neuschäfer Elektronik GmbH Montagehilfe für hochpolige Leiterplattenverbinder
CN112809607A (zh) * 2021-02-01 2021-05-18 国网湖北省电力有限公司宜昌供电公司 电控柜pcb板元器件插装工具及使用方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3545606A (en) * 1968-06-11 1970-12-08 Benny Morris Bennett Flexible tape terminal assembly
US3676926A (en) * 1970-05-20 1972-07-18 Elfab Corp Method for manufacturing connector terminals

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114698271A (zh) * 2022-05-16 2022-07-01 四川英创力电子科技股份有限公司 一种在印制电路板双面成型高频层的成型装置及方法
CN114698271B (zh) * 2022-05-16 2023-05-02 四川英创力电子科技股份有限公司 一种在印制电路板双面成型高频层的成型装置及方法

Also Published As

Publication number Publication date
FR2185872A1 (de) 1974-01-04
DE2323668A1 (de) 1973-12-06
JPS4941856A (de) 1974-04-19
US3800416A (en) 1974-04-02
BR7303695D0 (pt) 1974-07-11
GB1377911A (en) 1974-12-18
NL7306805A (de) 1973-11-21
AU5530273A (en) 1974-11-07
CA969676A (en) 1975-06-17
IT992550B (it) 1975-09-30
AR196529A1 (es) 1974-02-06

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