Classifications

• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/22—Secondary treatment of printed circuits
  • H05K3/24—Reinforcing the conductive pattern
  • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
• • C—CHEMISTRY; METALLURGY
  • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
  • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
  • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
  • C25D5/18—Electroplating using modulated, pulsed or reversing current
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
  • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
  • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
  • H01L21/4814—Conductive parts
  • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K3/00—Apparatus or processes for manufacturing printed circuits
  • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
  • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

• Engineering & Computer Science (AREA)
• Manufacturing & Machinery (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Electrochemistry (AREA)
• Materials Engineering (AREA)
• Metallurgy (AREA)
• Organic Chemistry (AREA)
• Ceramic Engineering (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Power Engineering (AREA)
• Electroplating Methods And Accessories (AREA)
• Electroplating And Plating Baths Therefor (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=22768127

Family Applications (1)

Country Status (9)

Families Citing this family (7)

Family Cites Families (5)

• 0
  • BE BE789028D patent/BE789028A/fr unknown
• 1971
  • 1971-12-10 US US00206822A patent/US3770594A/en not_active Expired - Lifetime
• 1972
  • 1972-08-21 CA CA149,862A patent/CA982080A/en not_active Expired
  • 1972-08-22 GB GB3897372A patent/GB1366419A/en not_active Expired
  • 1972-10-03 DE DE19722248431 patent/DE2248431A1/de not_active Ceased
  • 1972-10-17 JP JP10327872A patent/JPS5632400B2/ja not_active Expired
  • 1972-10-26 FR FR7238049A patent/FR2162362B1/fr not_active Expired
  • 1972-11-22 IT IT31963/72A patent/IT971103B/it active
  • 1972-12-01 NL NL7216355A patent/NL7216355A/xx not_active Application Discontinuation

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