BE763007A - Procede et appareil pour la division de bases portant des circuits - Google Patents
Procede et appareil pour la division de bases portant des circuitsInfo
- Publication number
- BE763007A BE763007A BE763007A BE763007A BE763007A BE 763007 A BE763007 A BE 763007A BE 763007 A BE763007 A BE 763007A BE 763007 A BE763007 A BE 763007A BE 763007 A BE763007 A BE 763007A
- Authority
- BE
- Belgium
- Prior art keywords
- division
- bases bearing
- bearing circuits
- circuits
- bases
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
- C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/221—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising by thermic methods
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S65/00—Glass manufacturing
- Y10S65/04—Electric heat
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Thermal Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Mining & Mineral Resources (AREA)
- Laser Beam Processing (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1266770A | 1970-02-19 | 1970-02-19 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE763007A true BE763007A (fr) | 1971-07-16 |
Family
ID=21756114
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE763007A BE763007A (fr) | 1970-02-19 | 1971-02-16 | Procede et appareil pour la division de bases portant des circuits |
Country Status (8)
Country | Link |
---|---|
US (1) | US3610871A (fr) |
JP (1) | JPS5217279B1 (fr) |
BE (1) | BE763007A (fr) |
DE (1) | DE2107740C3 (fr) |
FR (1) | FR2081018B1 (fr) |
GB (1) | GB1324903A (fr) |
NL (1) | NL7102159A (fr) |
SE (1) | SE363807B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103394810A (zh) * | 2013-08-12 | 2013-11-20 | 苏州德龙激光股份有限公司 | 激光切割方法及其装置 |
Families Citing this family (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4020317A (en) * | 1971-12-10 | 1977-04-26 | New Mexico Tech Research Foundation | Method of mining rock with an electron beam |
FR2228040B1 (fr) * | 1973-05-04 | 1977-04-29 | Commissariat Energie Atomique | |
US3970819A (en) * | 1974-11-25 | 1976-07-20 | International Business Machines Corporation | Backside laser dicing system |
DE2521530C3 (de) * | 1975-05-14 | 1981-07-30 | Winkler & Dünnebier, Maschinenfabrik und Eisengießerei GmbH & Co KG, 5450 Neuwied | Vorrichtung zum Schneiden von Briefumschlagzuschnitten |
US4092518A (en) * | 1976-12-07 | 1978-05-30 | Laser Technique S.A. | Method of decorating a transparent plastics material article by means of a laser beam |
DE2816445C2 (de) * | 1978-04-15 | 1982-03-04 | Telefonbau Und Normalzeit Gmbh, 6000 Frankfurt | Einrichtung zum Brechen von Substraten |
JPS5659558U (fr) * | 1979-10-12 | 1981-05-21 | ||
US4328411A (en) * | 1980-04-28 | 1982-05-04 | General Electric Company | Cutting amorphous metal by crystallization with a laser or electron beam |
US4401876A (en) | 1980-05-20 | 1983-08-30 | Martin Cooper | Working gemstones |
DE3129909A1 (de) * | 1981-07-24 | 1983-02-10 | Schering Ag, 1000 Berlin Und 4619 Bergkamen | Schraub- und bestueckungsvorrichtung zum befestigen und loesen von leiterplatten fuer gedruckte schaltungen an einem galvanik-gestell |
DE3231345C3 (de) * | 1982-08-24 | 1994-11-17 | Bosch Gmbh Robert | Verfahren zur Herstellung von Sonden zur Messung der Masse und/oder Temperatur eines strömenden Mediums |
US4562333A (en) * | 1984-09-04 | 1985-12-31 | General Electric Company | Stress assisted cutting of high temperature embrittled materials |
DE3442062A1 (de) * | 1984-11-17 | 1986-05-22 | Standard Elektrik Lorenz Ag, 7000 Stuttgart | Verfahren und vorrichtung zum zerteilen von bestueckten keramischen schaltungsplatten |
NL8800334A (nl) * | 1988-02-11 | 1989-09-01 | Philips Nv | Werkwijze voor het in tweeen delen van een voorwerp vervaardigd van een bros materiaal in het bijzonder een ringkern van ferromagnetisch materiaal voor een afbuigeenheid voor een beeldbuis en afbuigeenheid voor een beeldbuis voorzien van een ringkern gedeeld volgens zulk een werkwijze. |
RU2024441C1 (ru) * | 1992-04-02 | 1994-12-15 | Владимир Степанович Кондратенко | Способ резки неметаллических материалов |
US5637244A (en) * | 1993-05-13 | 1997-06-10 | Podarok International, Inc. | Method and apparatus for creating an image by a pulsed laser beam inside a transparent material |
US5521352A (en) * | 1993-09-23 | 1996-05-28 | Laser Machining, Inc. | Laser cutting apparatus |
US5578229A (en) * | 1994-10-18 | 1996-11-26 | Michigan State University | Method and apparatus for cutting boards using opposing convergent laser beams |
US5871134A (en) * | 1994-12-27 | 1999-02-16 | Asahi Glass Company Ltd. | Method and apparatus for breaking and cutting a glass ribbon |
KR100447786B1 (ko) * | 1995-08-31 | 2004-11-06 | 코닝 인코포레이티드 | 취성물질절단방법및그장치 |
US5932119A (en) | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
US6252197B1 (en) | 1998-12-01 | 2001-06-26 | Accudyne Display And Semiconductor Systems, Inc. | Method and apparatus for separating non-metallic substrates utilizing a supplemental mechanical force applicator |
US6259058B1 (en) | 1998-12-01 | 2001-07-10 | Accudyne Display And Semiconductor Systems, Inc. | Apparatus for separating non-metallic substrates |
US6420678B1 (en) | 1998-12-01 | 2002-07-16 | Brian L. Hoekstra | Method for separating non-metallic substrates |
US6489588B1 (en) | 1999-11-24 | 2002-12-03 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
DE10027732A1 (de) * | 2000-06-03 | 2001-12-06 | Kem Tec Service Gmbh | Mehrfachnutzenleiterplatte mit beidseitigen Ritzlinien mittels Laserstrahlen und Anlage zur Herstellung |
JP4659300B2 (ja) * | 2000-09-13 | 2011-03-30 | 浜松ホトニクス株式会社 | レーザ加工方法及び半導体チップの製造方法 |
JP4512786B2 (ja) * | 2000-11-17 | 2010-07-28 | 独立行政法人産業技術総合研究所 | ガラス基板の加工方法 |
CN100355031C (zh) | 2002-03-12 | 2007-12-12 | 浜松光子学株式会社 | 基板的分割方法 |
TWI326626B (en) | 2002-03-12 | 2010-07-01 | Hamamatsu Photonics Kk | Laser processing method |
US7749867B2 (en) | 2002-03-12 | 2010-07-06 | Hamamatsu Photonics K.K. | Method of cutting processed object |
TWI520269B (zh) | 2002-12-03 | 2016-02-01 | Hamamatsu Photonics Kk | Cutting method of semiconductor substrate |
FR2852250B1 (fr) | 2003-03-11 | 2009-07-24 | Jean Luc Jouvin | Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau |
WO2004080643A1 (fr) * | 2003-03-12 | 2004-09-23 | Hamamatsu Photonics K.K. | Methode d'usinage par faisceau laser |
JP4563097B2 (ja) * | 2003-09-10 | 2010-10-13 | 浜松ホトニクス株式会社 | 半導体基板の切断方法 |
US20060021977A1 (en) * | 2004-07-30 | 2006-02-02 | Menegus Harry E | Process and apparatus for scoring a brittle material incorporating moving optical assembly |
US7820941B2 (en) * | 2004-07-30 | 2010-10-26 | Corning Incorporated | Process and apparatus for scoring a brittle material |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL299821A (fr) * | 1962-10-31 | 1900-01-01 | ||
DE1244346B (de) * | 1964-10-19 | 1967-07-13 | Menzel Gerhard Glasbearbeitung | Verfahren zum Schneiden von Glas |
US3629545A (en) * | 1967-12-19 | 1971-12-21 | Western Electric Co | Laser substrate parting |
-
1970
- 1970-02-19 US US12667A patent/US3610871A/en not_active Expired - Lifetime
-
1971
- 1971-02-16 BE BE763007A patent/BE763007A/fr unknown
- 1971-02-18 SE SE02119/71A patent/SE363807B/xx unknown
- 1971-02-18 DE DE2107740A patent/DE2107740C3/de not_active Expired
- 1971-02-18 NL NL7102159A patent/NL7102159A/xx unknown
- 1971-02-18 FR FR717105620A patent/FR2081018B1/fr not_active Expired
- 1971-02-19 JP JP46007453A patent/JPS5217279B1/ja active Pending
- 1971-04-19 GB GB2183571A patent/GB1324903A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103394810A (zh) * | 2013-08-12 | 2013-11-20 | 苏州德龙激光股份有限公司 | 激光切割方法及其装置 |
Also Published As
Publication number | Publication date |
---|---|
SE363807B (fr) | 1974-02-04 |
US3610871A (en) | 1971-10-05 |
FR2081018A1 (fr) | 1971-11-26 |
GB1324903A (en) | 1973-07-25 |
NL7102159A (fr) | 1971-08-23 |
DE2107740A1 (de) | 1971-09-23 |
DE2107740B2 (de) | 1973-08-09 |
FR2081018B1 (fr) | 1974-02-15 |
DE2107740C3 (de) | 1974-03-14 |
JPS5217279B1 (fr) | 1977-05-14 |
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