BE749796A - - Google Patents

Info

Publication number
BE749796A
BE749796A BE749796DA BE749796A BE 749796 A BE749796 A BE 749796A BE 749796D A BE749796D A BE 749796DA BE 749796 A BE749796 A BE 749796A
Authority
BE
Belgium
Application number
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE749796A publication Critical patent/BE749796A/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/922—Static electricity metal bleed-off metallic stock
    • Y10S428/9335—Product by special process
    • Y10S428/938—Vapor deposition or gas diffusion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49099—Coating resistive material on a base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
    • Y10T428/12819—Group VB metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12944—Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Non-Adjustable Resistors (AREA)
  • Acyclic And Carbocyclic Compounds In Medicinal Compositions (AREA)
BE749796D 1969-05-05 1970-04-30 BE749796A (cs)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82184469A 1969-05-05 1969-05-05

Publications (1)

Publication Number Publication Date
BE749796A true BE749796A (cs) 1970-10-01

Family

ID=25234437

Family Applications (1)

Application Number Title Priority Date Filing Date
BE749796D BE749796A (cs) 1969-05-05 1970-04-30

Country Status (7)

Country Link
US (1) US3607679A (cs)
BE (1) BE749796A (cs)
DE (1) DE2021264B2 (cs)
FR (1) FR2042411A1 (cs)
GB (1) GB1276934A (cs)
NL (1) NL153031B (cs)
SE (2) SE376144B (cs)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3862017A (en) * 1970-02-04 1975-01-21 Hideo Tsunemitsu Method for producing a thin film passive circuit element
US3726733A (en) * 1970-02-10 1973-04-10 Fujitsu Ltd Method of manufacturing thin-film integrated circuits
US3753816A (en) * 1971-11-18 1973-08-21 Rca Corp Method of repairing or depositing a pattern of metal plated areas on an insulating substrate
US3895147A (en) * 1971-12-27 1975-07-15 Ibm Fabrication mask using divalent rare earth element
US3778689A (en) * 1972-05-22 1973-12-11 Hewlett Packard Co Thin film capacitors and method for manufacture
US3864825A (en) * 1972-06-12 1975-02-11 Microsystems Int Ltd Method of making thin-film microelectronic resistors
GB1424980A (en) * 1973-06-20 1976-02-11 Siemens Ag Thin-film electrical circuits
US3997411A (en) * 1973-06-20 1976-12-14 Siemens Aktiengesellschaft Method for the production of a thin film electric circuit
US3969197A (en) * 1974-02-08 1976-07-13 Texas Instruments Incorporated Method for fabricating a thin film capacitor
DE2513859C2 (de) * 1975-03-27 1981-11-12 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Herstellen eines Kondensator-Widerstands-Netzwerks
DE2513858C3 (de) * 1975-03-27 1981-08-06 Siemens AG, 1000 Berlin und 8000 München Verfahren zur Herstellung eines Tantal-Dünnschichtkondensators
DE2546675C3 (de) * 1975-10-17 1979-08-02 Siemens Ag, 1000 Berlin Und 8000 Muenchen Verfahren zum Herstellen einer Dünnschichtschaltung
JPS5375472A (en) * 1976-12-17 1978-07-04 Hitachi Ltd Method of producing thin film resistive ic
US4251326A (en) * 1978-12-28 1981-02-17 Western Electric Company, Inc. Fabricating an RC network utilizing alpha tantalum
US4410867A (en) * 1978-12-28 1983-10-18 Western Electric Company, Inc. Alpha tantalum thin film circuit device
US4200502A (en) * 1979-03-12 1980-04-29 Siemens Aktiengesellschaft Method for producing an electrical thin layer circuit
US4385966A (en) * 1980-10-07 1983-05-31 Bell Telephone Laboratories, Incorporated Fabrication of thin film resistors and capacitors
US4344223A (en) * 1980-11-26 1982-08-17 Western Electric Company, Inc. Monolithic hybrid integrated circuits
US4374159A (en) * 1981-07-27 1983-02-15 Bell Telephone Laboratories, Incorporated Fabrication of film circuits having a thick film crossunder and a thin film capacitor
JPS59144162A (ja) * 1983-02-08 1984-08-18 Nec Corp 薄膜回路の製造方法
JPS62262385A (ja) * 1986-05-07 1987-11-14 日本碍子株式会社 発熱抵抗体
DE69125323T2 (de) * 1990-07-24 1997-09-25 Semiconductor Energy Lab Verfahren zum Herstellen isolierender Filme, Kapazitäten und Halbleiteranordnungen
US7335570B1 (en) 1990-07-24 2008-02-26 Semiconductor Energy Laboratory Co., Ltd. Method of forming insulating films, capacitances, and semiconductor devices
JPH08115851A (ja) * 1994-10-14 1996-05-07 Ngk Spark Plug Co Ltd 薄膜コンデンサ付きセラミック基板および その製造方法
US6395148B1 (en) 1998-11-06 2002-05-28 Lexmark International, Inc. Method for producing desired tantalum phase
DE10039710B4 (de) * 2000-08-14 2017-06-22 United Monolithic Semiconductors Gmbh Verfahren zur Herstellung passiver Bauelemente auf einem Halbleitersubstrat

Also Published As

Publication number Publication date
SE371558B (cs) 1974-11-18
US3607679A (en) 1971-09-21
FR2042411A1 (cs) 1971-02-12
DE2021264A1 (de) 1970-11-12
NL153031B (nl) 1977-04-15
NL7006198A (cs) 1970-11-09
SE376144B (cs) 1975-05-05
DE2021264B2 (de) 1972-09-21
GB1276934A (en) 1972-06-07

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