BE741287A - - Google Patents
Info
- Publication number
- BE741287A BE741287A BE741287DA BE741287A BE 741287 A BE741287 A BE 741287A BE 741287D A BE741287D A BE 741287DA BE 741287 A BE741287 A BE 741287A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/40—Leadframes
- H10W70/421—Shapes or dispositions
- H10W70/435—Shapes or dispositions of insulating layers on leadframes, e.g. bridging members
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/811—Multiple chips on leadframes
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| IT5375968 | 1968-11-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE741287A true BE741287A (https=) | 1970-05-05 |
Family
ID=11285001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE741287D BE741287A (https=) | 1968-11-06 | 1969-11-05 |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US3673309A (https=) |
| JP (1) | JPS493230B1 (https=) |
| BE (1) | BE741287A (https=) |
| CA (1) | CA924021A (https=) |
| CH (1) | CH526203A (https=) |
| DE (1) | DE1956501C3 (https=) |
| FR (1) | FR2022698B1 (https=) |
| GB (2) | GB1288982A (https=) |
| NL (1) | NL6916792A (https=) |
| SE (1) | SE362166B (https=) |
| SU (1) | SU462366A3 (https=) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3872583A (en) * | 1972-07-10 | 1975-03-25 | Amdahl Corp | LSI chip package and method |
| GB2079534A (en) * | 1980-07-02 | 1982-01-20 | Fairchild Camera Instr Co | Package for semiconductor devices |
| DE3512628A1 (de) * | 1984-04-11 | 1985-10-17 | Moran, Peter, Cork | Packung fuer eine integrierte schaltung |
| JPS6132452A (ja) * | 1984-07-25 | 1986-02-15 | Hitachi Ltd | リ−ドフレ−ムとそれを用いた電子装置 |
| US4809135A (en) * | 1986-08-04 | 1989-02-28 | General Electric Company | Chip carrier and method of fabrication |
| US4791075A (en) * | 1987-10-05 | 1988-12-13 | Motorola, Inc. | Process for making a hermetic low cost pin grid array package |
| US5061822A (en) * | 1988-09-12 | 1991-10-29 | Honeywell Inc. | Radial solution to chip carrier pitch deviation |
| US5122621A (en) * | 1990-05-07 | 1992-06-16 | Synergy Microwave Corporation | Universal surface mount package |
| US5160810A (en) * | 1990-05-07 | 1992-11-03 | Synergy Microwave Corporation | Universal surface mount package |
| US5229329A (en) * | 1991-02-28 | 1993-07-20 | Texas Instruments, Incorporated | Method of manufacturing insulated lead frame for integrated circuits |
| US5403784A (en) * | 1991-09-03 | 1995-04-04 | Microelectronics And Computer Technology Corporation | Process for manufacturing a stacked multiple leadframe semiconductor package using an alignment template |
| DE4225154A1 (de) * | 1992-07-30 | 1994-02-03 | Meyerhoff Dieter | Chip-Modul |
| JP3619085B2 (ja) * | 1999-02-18 | 2005-02-09 | キヤノン株式会社 | 画像形成装置、その製造方法及び記憶媒体 |
| US8212351B1 (en) * | 2006-10-02 | 2012-07-03 | Newport Fab, Llc | Structure for encapsulating microelectronic devices |
| RU2331138C1 (ru) * | 2006-12-26 | 2008-08-10 | Закрытое акционерное общество "Научно-производственное объединение "НИИТАЛ" (ЗАО "НПО "НИИТАЛ") | Корпус интегральной схемы |
| US8309388B2 (en) * | 2008-04-25 | 2012-11-13 | Texas Instruments Incorporated | MEMS package having formed metal lid |
| WO2019075289A1 (en) * | 2017-10-13 | 2019-04-18 | Kulicke And Soffa Industries, Inc. | CONDUCTIVE TERMINALS, OMNIBUS BARS, AND METHODS OF PREPARING THE SAME, AND METHODS OF ASSEMBLING POWER MODULES THEREOF |
| CN110854080B (zh) * | 2019-11-26 | 2021-10-19 | 合肥圣达电子科技实业有限公司 | 一种多引线陶瓷组件封装外壳及其加工方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3331125A (en) * | 1964-05-28 | 1967-07-18 | Rca Corp | Semiconductor device fabrication |
| US3312771A (en) * | 1964-08-07 | 1967-04-04 | Nat Beryllia Corp | Microelectronic package |
| US3374437A (en) * | 1964-08-26 | 1968-03-19 | Heath Co | Squelch system for radio receivers |
| US3374537A (en) * | 1965-03-22 | 1968-03-26 | Philco Ford Corp | Method of connecting leads to a semiconductive device |
| US3317653A (en) * | 1965-05-07 | 1967-05-02 | Cts Corp | Electrical component and method of making the same |
| US3371148A (en) * | 1966-04-12 | 1968-02-27 | Radiation Inc | Semiconductor device package and method of assembly therefor |
| US3404215A (en) * | 1966-04-14 | 1968-10-01 | Sprague Electric Co | Hermetically sealed electronic module |
| US3560256A (en) * | 1966-10-06 | 1971-02-02 | Western Electric Co | Combined thick and thin film circuits |
| US3469148A (en) * | 1967-11-08 | 1969-09-23 | Gen Motors Corp | Protectively covered hybrid microcircuits |
| US3495023A (en) * | 1968-06-14 | 1970-02-10 | Nat Beryllia Corp | Flat pack having a beryllia base and an alumina ring |
-
1969
- 1969-11-03 CH CH1635969A patent/CH526203A/it not_active IP Right Cessation
- 1969-11-03 GB GB1288982D patent/GB1288982A/en not_active Expired
- 1969-11-03 GB GB1288983D patent/GB1288983A/en not_active Expired
- 1969-11-03 US US873499A patent/US3673309A/en not_active Expired - Lifetime
- 1969-11-04 CA CA066570A patent/CA924021A/en not_active Expired
- 1969-11-05 DE DE1956501A patent/DE1956501C3/de not_active Expired
- 1969-11-05 FR FR6938057A patent/FR2022698B1/fr not_active Expired
- 1969-11-05 SE SE15156/69A patent/SE362166B/xx unknown
- 1969-11-05 BE BE741287D patent/BE741287A/xx unknown
- 1969-11-06 SU SU1373742A patent/SU462366A3/ru active
- 1969-11-06 NL NL6916792A patent/NL6916792A/xx unknown
- 1969-11-06 JP JP44088469A patent/JPS493230B1/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| DE1956501A1 (de) | 1970-06-11 |
| DE1956501B2 (de) | 1980-06-04 |
| JPS493230B1 (https=) | 1974-01-25 |
| CH526203A (it) | 1972-07-31 |
| SU462366A3 (ru) | 1975-02-28 |
| US3673309A (en) | 1972-06-27 |
| GB1288982A (https=) | 1972-09-13 |
| DE1956501C3 (de) | 1983-04-07 |
| GB1288983A (https=) | 1972-09-13 |
| CA924021A (en) | 1973-04-03 |
| NL6916792A (https=) | 1970-05-11 |
| FR2022698A1 (https=) | 1970-08-06 |
| SE362166B (https=) | 1973-11-26 |
| FR2022698B1 (https=) | 1975-11-07 |