BE722669A - - Google Patents
Info
- Publication number
- BE722669A BE722669A BE722669DA BE722669A BE 722669 A BE722669 A BE 722669A BE 722669D A BE722669D A BE 722669DA BE 722669 A BE722669 A BE 722669A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
- H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/08—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs
- H10W70/09—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers by depositing layers on the chip or wafer, e.g. "chip-first" RDLs extending onto an encapsulation that laterally surrounds the chip or wafer, e.g. fan-out wafer level package [FOWLP] RDLs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/9413—Dispositions of bond pads on encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/90—Bond pads, in general
- H10W72/941—Dispositions of bond pads
- H10W72/944—Dispositions of multiple bond pads
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/01—Manufacture or treatment
- H10W74/019—Manufacture or treatment using temporary auxiliary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/10—Configurations of laterally-adjacent chips
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL6714336A NL6714336A (https=) | 1967-10-21 | 1967-10-21 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE722669A true BE722669A (https=) | 1969-04-21 |
Family
ID=19801524
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE722669D BE722669A (https=) | 1967-10-21 | 1968-10-21 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US3579056A (https=) |
| BE (1) | BE722669A (https=) |
| BR (1) | BR6803288D0 (https=) |
| CH (1) | CH496322A (https=) |
| DE (1) | DE1803138A1 (https=) |
| ES (1) | ES359345A1 (https=) |
| FR (1) | FR1591647A (https=) |
| GB (1) | GB1250815A (https=) |
| NL (1) | NL6714336A (https=) |
| SE (1) | SE352480B (https=) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3777220A (en) * | 1972-06-30 | 1973-12-04 | Ibm | Circuit panel and method of construction |
| JPS51150068A (en) * | 1975-06-19 | 1976-12-23 | Citizen Watch Co Ltd | Electronic circuit block |
| JPS54158669A (en) * | 1978-06-05 | 1979-12-14 | Matsushita Electric Industrial Co Ltd | Printed circuit board |
| DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
| US5344795A (en) * | 1992-09-22 | 1994-09-06 | Microelectronics And Computer Technology Corporation | Method for encapsulating an integrated circuit using a removable heatsink support block |
| DE20117575U1 (de) * | 2001-10-26 | 2002-03-28 | Moser, Helmut, Dipl.-Volkswirt, 76646 Bruchsal | Sandwichplatte mit beidseitigen Leuchtfeldern |
| DE10164800B4 (de) | 2001-11-02 | 2005-03-31 | Infineon Technologies Ag | Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips |
| DE10153609C2 (de) * | 2001-11-02 | 2003-10-16 | Infineon Technologies Ag | Verfahren zur Herstellung eines elektronischen Bauelements mit mehreren übereinander gestapelten und miteinander kontaktierten Chips |
| DE10250621B4 (de) * | 2002-10-30 | 2004-09-02 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren zum Erzeugen verkapselter Chips und zum Erzeugen eines Stapels aus den verkapselten Chips |
| TW200507131A (en) * | 2003-07-02 | 2005-02-16 | North Corp | Multi-layer circuit board for electronic device |
| US7768117B2 (en) * | 2007-05-30 | 2010-08-03 | Tessera, Inc. | Microelectronic package having interconnected redistribution paths |
| US8237259B2 (en) | 2007-06-13 | 2012-08-07 | Infineon Technologies Ag | Embedded chip package |
| US7968378B2 (en) * | 2008-02-06 | 2011-06-28 | Infineon Technologies Ag | Electronic device |
| DE102010039156A1 (de) | 2010-08-10 | 2012-02-16 | Robert Bosch Gmbh | Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung |
| DE102010040704A1 (de) * | 2010-09-14 | 2012-03-15 | Robert Bosch Gmbh | Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung |
| EP2794814B1 (de) | 2011-12-19 | 2017-10-18 | InovisCoat GmbH | Leuchtelemente mit einer elektrolumineszenzanordnung sowie verfahren zur herstellung eines leuchtelements |
| DE112012005313A5 (de) | 2011-12-19 | 2015-04-23 | Inoviscoat Gmbh | Leuchtbild |
| DE102012005192A1 (de) * | 2011-12-19 | 2013-06-20 | Inoviscoat Gmbh | Leuchtbild |
| US9129959B2 (en) | 2012-08-21 | 2015-09-08 | Infineon Technologies Ag | Method for manufacturing an electronic module and an electronic module |
| RU2642170C2 (ru) | 2013-12-19 | 2018-01-24 | Интел Корпорейшн | Гибко оборачиваемый кристалл интегральной схемы |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3040416A (en) * | 1959-05-13 | 1962-06-26 | Hoffman Electronics Corp | Method of making a large area solar cell panel |
| US3121177A (en) * | 1962-01-23 | 1964-02-11 | Robert H Davis | Active thin-film devices controlling current by modulation of a quantum mechanical potential barrier |
| DE1514460A1 (de) * | 1965-05-11 | 1969-05-22 | Siemens Ag | Verfahren zum Herstellen von Halbleiterschaltungen |
| US3411050A (en) * | 1966-04-28 | 1968-11-12 | Air Force Usa | Flexible storable solar cell array |
| US3402331A (en) * | 1966-08-02 | 1968-09-17 | Philips Corp | Solid-state active electronic device and microcircuits containing same |
| US3483038A (en) * | 1967-01-05 | 1969-12-09 | Rca Corp | Integrated array of thin-film photovoltaic cells and method of making same |
| US3433677A (en) * | 1967-04-05 | 1969-03-18 | Cornell Aeronautical Labor Inc | Flexible sheet thin-film photovoltaic generator |
-
1967
- 1967-10-21 NL NL6714336A patent/NL6714336A/xx unknown
-
1968
- 1968-10-10 US US767062A patent/US3579056A/en not_active Expired - Lifetime
- 1968-10-15 DE DE19681803138 patent/DE1803138A1/de active Pending
- 1968-10-17 FR FR1591647D patent/FR1591647A/fr not_active Expired
- 1968-10-18 CH CH1565468A patent/CH496322A/de not_active IP Right Cessation
- 1968-10-18 BR BR203288/68A patent/BR6803288D0/pt unknown
- 1968-10-18 GB GB1250815D patent/GB1250815A/en not_active Expired
- 1968-10-18 SE SE14114/68A patent/SE352480B/xx unknown
- 1968-10-19 ES ES359345A patent/ES359345A1/es not_active Expired
- 1968-10-21 BE BE722669D patent/BE722669A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| SE352480B (https=) | 1972-12-27 |
| US3579056A (en) | 1971-05-18 |
| BR6803288D0 (pt) | 1973-01-04 |
| CH496322A (de) | 1970-09-15 |
| GB1250815A (https=) | 1971-10-20 |
| ES359345A1 (es) | 1970-08-16 |
| FR1591647A (https=) | 1970-05-04 |
| NL6714336A (https=) | 1969-04-23 |
| DE1803138A1 (de) | 1969-06-04 |