BE715441A - - Google Patents

Info

Publication number
BE715441A
BE715441A BE715441DA BE715441A BE 715441 A BE715441 A BE 715441A BE 715441D A BE715441D A BE 715441DA BE 715441 A BE715441 A BE 715441A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE715441A publication Critical patent/BE715441A/xx

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291Oxides or nitrides or carbides, e.g. ceramics, glass
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
BE715441D 1967-05-18 1968-05-20 BE715441A (xx)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL6706868A NL6706868A (xx) 1967-05-18 1967-05-18

Publications (1)

Publication Number Publication Date
BE715441A true BE715441A (xx) 1968-11-20

Family

ID=19800144

Family Applications (1)

Application Number Title Priority Date Filing Date
BE715441D BE715441A (xx) 1967-05-18 1968-05-20

Country Status (8)

Country Link
US (1) US3562604A (xx)
AT (1) AT276490B (xx)
BE (1) BE715441A (xx)
CH (1) CH472782A (xx)
FR (1) FR1576535A (xx)
GB (1) GB1210162A (xx)
NL (1) NL6706868A (xx)
SE (1) SE329444B (xx)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3837905A (en) * 1971-09-22 1974-09-24 Gen Motors Corp Thermal oxidation of silicon
GB1447866A (en) * 1972-11-10 1976-09-02 Nat Res Dev Charge coupled devices and methods of fabricating them
US3942243A (en) * 1974-01-25 1976-03-09 Litronix, Inc. Ohmic contact for semiconductor devices
US4220706A (en) * 1978-05-10 1980-09-02 Rca Corporation Etchant solution containing HF-HnO3 -H2 SO4 -H2 O2
US4214018A (en) * 1978-08-14 1980-07-22 Rca Corporation Method for making adherent pinhole free aluminum films on pyroelectric and/or piezoelectric substrates
US4478881A (en) * 1981-12-28 1984-10-23 Solid State Devices, Inc. Tungsten barrier contact
JPS59175763A (ja) * 1983-03-25 1984-10-04 Fujitsu Ltd 半導体装置
EP0184171A3 (en) * 1984-12-06 1988-09-21 Solid State Devices, Inc. Device having improved contact metallization
IT1213261B (it) * 1984-12-20 1989-12-14 Sgs Thomson Microelectronics Dispositivo a semiconduttore con metallizzazione a piu' spessori eprocedimento per la sua fabbricazione.
JP2921773B2 (ja) * 1991-04-05 1999-07-19 三菱電機株式会社 半導体装置の配線接続構造およびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1053069A (xx) * 1963-06-28
US3365628A (en) * 1965-09-16 1968-01-23 Texas Instruments Inc Metallic contacts for semiconductor devices
US3408733A (en) * 1966-03-22 1968-11-05 Bell Telephone Labor Inc Low resistance contact to diffused junction germanium transistor
US3436616A (en) * 1967-02-07 1969-04-01 Motorola Inc Ohmic contact consisting of a bilayer of gold and molybdenum over an alloyed region of aluminum-silicon

Also Published As

Publication number Publication date
SE329444B (xx) 1970-10-12
NL6706868A (xx) 1968-11-19
CH472782A (de) 1969-05-15
DE1764282B2 (de) 1976-07-01
US3562604A (en) 1971-02-09
AT276490B (de) 1969-11-25
DE1764282A1 (de) 1971-06-16
GB1210162A (en) 1970-10-28
FR1576535A (xx) 1969-08-01

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