BE694184A - - Google Patents
Info
- Publication number
- BE694184A BE694184A BE694184DA BE694184A BE 694184 A BE694184 A BE 694184A BE 694184D A BE694184D A BE 694184DA BE 694184 A BE694184 A BE 694184A
- Authority
- BE
- Belgium
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03D—FLOTATION; DIFFERENTIAL SEDIMENTATION
- B03D1/00—Flotation
- B03D1/02—Froth-flotation processes
- B03D1/021—Froth-flotation processes for treatment of phosphate ores
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S148/00—Metal treatment
- Y10S148/107—Melt
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31667—Next to addition polymer from unsaturated monomers, or aldehyde or ketone condensation product
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Electrochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Environmental & Geological Engineering (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Geology (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Chemically Coating (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR49866A FR1474973A (fr) | 1966-02-16 | 1966-02-16 | Procédé de fabrication d'une couche de contact pour dispositifs semi-conducteurs et produits obtenus |
Publications (1)
Publication Number | Publication Date |
---|---|
BE694184A true BE694184A (ja) | 1967-08-16 |
Family
ID=8601511
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE694184D BE694184A (ja) | 1966-02-16 | 1967-02-16 |
Country Status (9)
Country | Link |
---|---|
US (1) | US3522087A (ja) |
AT (1) | AT276487B (ja) |
BE (1) | BE694184A (ja) |
CH (1) | CH513250A (ja) |
DE (1) | DE1614218B2 (ja) |
ES (1) | ES336799A1 (ja) |
FR (1) | FR1474973A (ja) |
GB (1) | GB1177414A (ja) |
NL (1) | NL158322B (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4094675A (en) * | 1973-07-23 | 1978-06-13 | Licentia Patent-Verwaltungs-G.M.B.H. | Vapor deposition of photoconductive selenium onto a metallic substrate having a molten metal coating as bonding layer |
US3926746A (en) * | 1973-10-04 | 1975-12-16 | Minnesota Mining & Mfg | Electrical interconnection for metallized ceramic arrays |
FR2551461B1 (fr) * | 1977-12-21 | 1988-10-21 | Baj Vickers Ltd | Procede pour l'electrodeposition de revetements composites |
GB2128636B (en) * | 1982-10-19 | 1986-01-08 | Motorola Ltd | Silicon-aluminium alloy metallization of semiconductor substrate |
US5453293A (en) * | 1991-07-17 | 1995-09-26 | Beane; Alan F. | Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects |
US5614320A (en) * | 1991-07-17 | 1997-03-25 | Beane; Alan F. | Particles having engineered properties |
US5893966A (en) | 1997-07-28 | 1999-04-13 | Micron Technology, Inc. | Method and apparatus for continuous processing of semiconductor wafers |
AT408352B (de) * | 1999-03-26 | 2001-11-26 | Miba Gleitlager Ag | Galvanisch abgeschiedene legierungsschicht, insbesondere eine laufschicht eines gleitlagers |
DE19950187A1 (de) * | 1999-10-19 | 2001-05-10 | Pv Silicon Forschungs Und Prod | Verfahren zur Herstellung von kristallinen Silizium-Dünnschichtsolarzellen |
DE10015962C2 (de) * | 2000-03-30 | 2002-04-04 | Infineon Technologies Ag | Hochtemperaturfeste Lotverbindung für Halbleiterbauelement |
DE10015964C2 (de) * | 2000-03-30 | 2002-06-13 | Infineon Technologies Ag | Lotband für flexible und temperaturfeste Lotverbindungen |
JP5042894B2 (ja) * | 2008-03-19 | 2012-10-03 | 松田産業株式会社 | 電子部品およびその製造方法 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL270517A (ja) * | 1960-11-16 | |||
BE623962A (ja) * | 1961-10-24 | |||
US3287108A (en) * | 1963-01-07 | 1966-11-22 | Hausner Entpr Inc | Methods and apparatus for producing alloys |
FR1370724A (fr) * | 1963-07-15 | 1964-08-28 | Electronique & Automatisme Sa | Procédé de réalisation de couches minces monocristallines |
US3244557A (en) * | 1963-09-19 | 1966-04-05 | Ibm | Process of vapor depositing and annealing vapor deposited layers of tin-germanium and indium-germanium metastable solid solutions |
US3183407A (en) * | 1963-10-04 | 1965-05-11 | Sony Corp | Combined electrical element |
US3400006A (en) * | 1965-07-02 | 1968-09-03 | Libbey Owens Ford Glass Co | Transparent articles coated with gold, chromium, and germanium alloy film |
US3400066A (en) * | 1965-11-15 | 1968-09-03 | Ibm | Sputtering processes for depositing thin films of controlled thickness |
US3420704A (en) * | 1966-08-19 | 1969-01-07 | Nasa | Depositing semiconductor films utilizing a thermal gradient |
-
1966
- 1966-02-16 FR FR49866A patent/FR1474973A/fr not_active Expired
-
1967
- 1967-02-09 US US3522087D patent/US3522087A/en not_active Expired - Lifetime
- 1967-02-14 GB GB693167A patent/GB1177414A/en not_active Expired
- 1967-02-14 ES ES336799A patent/ES336799A1/es not_active Expired
- 1967-02-15 NL NL6702250A patent/NL158322B/xx not_active IP Right Cessation
- 1967-02-16 BE BE694184D patent/BE694184A/xx not_active IP Right Cessation
- 1967-02-16 AT AT156067A patent/AT276487B/de active
- 1967-02-16 DE DE19671614218 patent/DE1614218B2/de active Granted
- 1967-02-16 CH CH224167A patent/CH513250A/de not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE1614218A1 (de) | 1970-06-25 |
NL6702250A (ja) | 1967-08-17 |
AT276487B (de) | 1969-11-25 |
FR1474973A (fr) | 1967-03-31 |
DE1614218B2 (de) | 1976-01-15 |
GB1177414A (en) | 1970-01-14 |
US3522087A (en) | 1970-07-28 |
ES336799A1 (es) | 1968-01-01 |
NL158322B (nl) | 1978-10-16 |
CH513250A (de) | 1971-09-30 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
RE | Patent lapsed |
Owner name: N.V. PHILIPS GLOEILAMPENFABRIEKEN Effective date: 19860228 |