BE657708A - - Google Patents
Info
- Publication number
- BE657708A BE657708A BE657708DA BE657708A BE 657708 A BE657708 A BE 657708A BE 657708D A BE657708D A BE 657708DA BE 657708 A BE657708 A BE 657708A
- Authority
- BE
- Belgium
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US334549A US3269881A (en) | 1963-12-30 | 1963-12-30 | Hydrogen peroxide etching of copper in manufacture of printed circuits |
| US334572A US3293093A (en) | 1963-12-30 | 1963-12-30 | Dissolution of metal with acidified hydrogen peroxide and use as copper etchant in manufacture of printed circuits |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BE657708A true BE657708A (nl) |
Family
ID=26989261
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE657708D BE657708A (nl) | 1963-12-30 | ||
| BE657099D BE657099A (nl) | 1963-12-30 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BE657099D BE657099A (nl) | 1963-12-30 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US3269881A (nl) |
| BE (2) | BE657099A (nl) |
| CH (2) | CH469102A (nl) |
| DE (2) | DE1287403B (nl) |
| GB (2) | GB1029340A (nl) |
| NL (2) | NL6415194A (nl) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE655566A (nl) * | 1963-11-12 | |||
| DE1255443B (de) * | 1964-08-22 | 1967-11-30 | Degussa | Verfahren zum chemischen AEtzen von gedruckten Schaltungen |
| US3407141A (en) * | 1966-02-03 | 1968-10-22 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide solutions |
| US3442810A (en) * | 1966-02-25 | 1969-05-06 | Garman Co Inc | Chemical polishing composition and method |
| AT319617B (de) * | 1973-02-21 | 1974-12-27 | Pawlek Dr Ing Franz | Verfahren zur hydrometallurgischen Gewinnung von Kupfer aus Kupferkies- bzw. Buntkupferkieskonzentraten |
| JPS5332341B2 (nl) * | 1973-03-27 | 1978-09-07 | ||
| US3953263A (en) * | 1973-11-26 | 1976-04-27 | Hitachi, Ltd. | Process for preventing the formation of nitrogen monoxide in treatment of metals with nitric acid or mixed acid |
| US3945865A (en) * | 1974-07-22 | 1976-03-23 | Dart Environment And Services Company | Metal dissolution process |
| JPS5286933A (en) * | 1976-01-14 | 1977-07-20 | Tokai Electro Chemical Co | Method of treating surface of copper and copper alloy |
| US4174253A (en) * | 1977-11-08 | 1979-11-13 | Dart Industries Inc. | Dissolution of metals utilizing a H2 O2 -H2 SO4 solution catalyzed with hydroxy substituted cycloparaffins |
| US4175011A (en) * | 1978-07-17 | 1979-11-20 | Allied Chemical Corporation | Sulfate-free method of etching copper pattern on printed circuit boards |
| US4401509A (en) * | 1982-09-07 | 1983-08-30 | Fmc Corporation | Composition and process for printed circuit etching using a sulfuric acid solution containing hydrogen peroxide |
| DE3539886A1 (de) * | 1985-11-11 | 1987-05-14 | Hoellmueller Maschbau H | Verfahren und vorrichtung zum aetzen eines zumindest teilweise aus metall, vorzugsweise kupfer, bestehenden aetzguts |
| EP0265578A1 (en) * | 1986-10-30 | 1988-05-04 | Jan-Olof Eriksson | A non-abrasive polish or cleaning composition and process for its preparation |
| US4859281A (en) * | 1987-06-04 | 1989-08-22 | Pennwalt Corporation | Etching of copper and copper bearing alloys |
| US6156221A (en) * | 1998-10-02 | 2000-12-05 | International Business Machines Corporation | Copper etching compositions, processes and products derived therefrom |
| US6117250A (en) * | 1999-02-25 | 2000-09-12 | Morton International Inc. | Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions |
| US6444140B2 (en) | 1999-03-17 | 2002-09-03 | Morton International Inc. | Micro-etch solution for producing metal surface topography |
| US6830627B1 (en) | 1999-03-23 | 2004-12-14 | International Business Machines Corporation | Copper cleaning compositions, processes and products derived therefrom |
| US20030178391A1 (en) * | 2000-06-16 | 2003-09-25 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| US20040099637A1 (en) * | 2000-06-16 | 2004-05-27 | Shipley Company, L.L.C. | Composition for producing metal surface topography |
| US7077880B2 (en) * | 2004-01-16 | 2006-07-18 | Dupont Air Products Nanomaterials Llc | Surface modified colloidal abrasives, including stable bimetallic surface coated silica sols for chemical mechanical planarization |
| US7513920B2 (en) * | 2002-02-11 | 2009-04-07 | Dupont Air Products Nanomaterials Llc | Free radical-forming activator attached to solid and used to enhance CMP formulations |
| US20030162398A1 (en) | 2002-02-11 | 2003-08-28 | Small Robert J. | Catalytic composition for chemical-mechanical polishing, method of using same, and substrate treated with same |
| TW200417628A (en) * | 2002-09-09 | 2004-09-16 | Shipley Co Llc | Improved cleaning composition |
| US20040217006A1 (en) * | 2003-03-18 | 2004-11-04 | Small Robert J. | Residue removers for electrohydrodynamic cleaning of semiconductors |
| JP2004335751A (ja) * | 2003-05-08 | 2004-11-25 | Internatl Business Mach Corp <Ibm> | プリント基板の製造方法 |
| KR100676073B1 (ko) * | 2004-12-07 | 2007-01-30 | 태산엘시디 주식회사 | 도광판 제조용 스탬퍼의 제작방법 |
| US7476620B2 (en) | 2005-03-25 | 2009-01-13 | Dupont Air Products Nanomaterials Llc | Dihydroxy enol compounds used in chemical mechanical polishing compositions having metal ion oxidizers |
| US8858755B2 (en) | 2011-08-26 | 2014-10-14 | Tel Nexx, Inc. | Edge bevel removal apparatus and method |
| US20150262952A1 (en) * | 2014-03-13 | 2015-09-17 | Taiwan Semiconductor Manufacturing Co., Ltd | Bump structure and method for forming the same |
| US10246335B2 (en) | 2016-05-27 | 2019-04-02 | Baker Hughes, A Ge Company, Llc | Methods of modifying surfaces of diamond particles, and related diamond particles and earth-boring tools |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2154455A (en) * | 1934-02-08 | 1939-04-18 | Du Pont | Cadmium bright dip |
| US2154451A (en) * | 1934-12-17 | 1939-04-18 | Du Pont | Bright dip |
| US2318559A (en) * | 1941-04-30 | 1943-05-04 | Monsanto Chemicals | Material for and process of pickling copper or its alloys |
| US2428804A (en) * | 1945-09-07 | 1947-10-14 | Esther M Terry | Copper cleaning composition |
| US2491490A (en) * | 1947-11-18 | 1949-12-20 | Ortho Pharma Corp | Therapeutic sulfonamide compositions |
| US2719781A (en) * | 1952-04-09 | 1955-10-04 | Kaiser Aluminium Chem Corp | Composition and method for treating aluminum and aluminum alloys |
| US2758074A (en) * | 1953-08-26 | 1956-08-07 | Rca Corp | Printed circuits |
| US2736639A (en) * | 1953-12-16 | 1956-02-28 | Raytheon Mfg Co | Surface treatment of germanium |
| US2860039A (en) * | 1955-04-04 | 1958-11-11 | Fmc Corp | Graining zinc offset plates |
| US2923608A (en) * | 1956-04-13 | 1960-02-02 | Fmc Corp | Method of improving the bonding properties of steel surfaces |
| LU37351A1 (nl) * | 1958-03-26 | |||
| US3033725A (en) * | 1958-05-02 | 1962-05-08 | Photo Engravers Res Inc | Powderless etching of copper plate |
| NL105628C (nl) * | 1959-07-13 | |||
| NL268606A (nl) * | 1960-09-12 |
-
0
- BE BE657708D patent/BE657708A/xx unknown
- BE BE657099D patent/BE657099A/xx unknown
-
1963
- 1963-12-30 US US334549A patent/US3269881A/en not_active Expired - Lifetime
- 1963-12-30 US US334572A patent/US3293093A/en not_active Expired - Lifetime
-
1964
- 1964-12-09 GB GB50144/64A patent/GB1029340A/en not_active Expired
- 1964-12-15 DE DEA47891A patent/DE1287403B/de active Pending
- 1964-12-21 DE DEA47949A patent/DE1298383B/de active Pending
- 1964-12-22 GB GB52138/64A patent/GB1035970A/en not_active Expired
- 1964-12-23 CH CH1660364A patent/CH469102A/de unknown
- 1964-12-23 CH CH1660564A patent/CH458010A/de unknown
- 1964-12-29 NL NL6415194A patent/NL6415194A/xx unknown
- 1964-12-29 NL NL6415197A patent/NL6415197A/xx unknown
Also Published As
| Publication number | Publication date |
|---|---|
| US3293093A (en) | 1966-12-20 |
| DE1298383B (de) | 1969-06-26 |
| CH458010A (de) | 1968-06-15 |
| NL6415194A (nl) | 1965-07-01 |
| NL6415197A (nl) | 1965-07-01 |
| CH469102A (de) | 1969-02-28 |
| GB1035970A (en) | 1966-07-13 |
| GB1029340A (en) | 1966-05-11 |
| BE657099A (nl) | |
| US3269881A (en) | 1966-08-30 |
| DE1287403B (de) | 1969-01-16 |