US2154455A - Cadmium bright dip - Google Patents
Cadmium bright dip Download PDFInfo
- Publication number
- US2154455A US2154455A US710325A US71032534A US2154455A US 2154455 A US2154455 A US 2154455A US 710325 A US710325 A US 710325A US 71032534 A US71032534 A US 71032534A US 2154455 A US2154455 A US 2154455A
- Authority
- US
- United States
- Prior art keywords
- bright
- cadmium
- dip
- plated
- articles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F3/00—Brightening metals by chemical means
- C23F3/04—Heavy metals
- C23F3/06—Heavy metals with acidic solutions
Definitions
- frequen product plated articles which are stained and which are not of a uniformly bright finish. With articles of very irregular shape some areas may be somevmat dull so that the piece does not have as uniformly a bright and lustrous finish as is desirable.
- Plated articles maybeleftinthe bath for a fairly long time without substantial damage to the plating. This offers a great advantage over the use of the previously proposed oxidizing acid so dips wherein the plating is dissolved with relativeiy great rapidity.
- Another advanta e of my bright dip is that the brightened platcnil-ybereadilyplated with other metals such as nickel.
- nickel platingiron orsteelitis Prior to nickel platingiron orsteelitissometimes desirabietoplate the iron with cadmium, If the cadmimn plated iron orsteelisbrightdippedincertainosidising w acid dips. a subsequent nickel plate will not ad- 'here properly. . If the cadmium plated iron or steel is bright dipped in my bright dip.
- trample 14-h metal sheet bent to U-form was cadmium plated in a conventional manner. he use of a U-i'orm article closely approximates commercial plating conditions and the article is not '0 uniformly bright. being duller in the recessed portion.
- the plated article was rinsed free of the platingsolutionincoldwaterandthendipped for about fifteen seconds at room temperature in a brightdipconsistingof9ouncesofa30% (by weight) hydrogen peroxide solution, two-third of anounceofdd B6.0.P.sulfuricacidandagall0n of water. After removing the plated article from theln-ightdipitwascarefullywashedand dried. Theremltingplatedaheetbadalustromuniformly bright finish. the recessed portions being uniforminappcarancewiththerestofthearticle.
- the ratio of H102" nowadays weight) to HsSOe (by weight) is of great importance. In fact, it appearstobemoreimportantthantheperoxlde concentration. Astheacidisincreased andthe Biol/m ratio falls to one to one or below. the plate becomes white and as the ratio drops further becomes gray or black.
- a preliminary bath substantially free from oxidizing agents which comprises sulfuric acid
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Description
Patented Apr. 1a. 1939 UNITED STATES PATENT OFFICE 6. Co p y. of Delaware Ldnrontdcleesnenrs Dei.,aoerpcratlen N'Dra A on! I "sdriaus'r scum. (cues-oi This invention relates to hydrogen peroslrh solutions which contain a nihstance of acid aaction and to their use as bright dips forcadmimn plated articles.
- The um plating processes now in use frequen product plated articles which are stained and which are not of a uniformly bright finish. With articles of very irregular shape some areas may be somevmat dull so that the piece does not have as uniformly a bright and lustrous finish as is desirable.
It has been proposed to dip the plated articles in solutions of dilute oxidizing acids, but while a fairly uniform finish is thus obtained, much of thecadmiumis dissolveda dtbeplating may be seriously damaged. If the solution of oxidising acidbediluteenoughnottoiniuretheplab.
ing. it is ineffective as a bright dip.
I have found that a hydrogen peroxide solu tion which contains a substance of acid reaction serves as a very satisfactory bright dip for cadmium plated articlca, My bright dip acts upon cadmium plated articles to give them a lustrous, uniformly bright finish free from stains g5 and discoloration.
Plated articles maybeleftinthe bath for a fairly long time without substantial damage to the plating. This offers a great advantage over the use of the previously proposed oxidizing acid so dips wherein the plating is dissolved with relativeiy great rapidity.
-One especiallybeneficlalefiectot mybright dips is that cadmium plated articles which have been brightened according to my invention subsequentlyshowareslstancetostainssuchasare produced by If a cadmium plated article which not been bright dipped is touchedbythefingerastainsareleftatthspclnts oi'contact. Itiaofcom'snverydifilcultto o handle such plated articles without injuring their finish. Articles which have been bright dipped according tomyinventionmaybohandledfreely without iniury to their finish.
Another advanta e of my bright dip is that the brightened platcnil-ybereadilyplated with other metals such as nickel. Prior to nickel platingiron orsteelitissometimes desirabietoplate the iron with cadmium, If the cadmimn plated iron orsteelisbrightdippedincertainosidising w acid dips. a subsequent nickel plate will not ad- 'here properly. .If the cadmium plated iron or steel is bright dipped in my bright dip. a subsequent nickel coat adheres in a very satisfactory Ihavealsofoundthatcadmitnnplated articles whichhave bemdippedin asolution ofacidified hydrogen peroxide are easily washed or rinsed ilter the dippin This is not true of some other oxidizing acid bright dips which form a colored film which requires considerable wash- 5 ing to efi'ect complete removal.
While an acidified hydrogen peroxide solution constitutes an excellent ls'ight dip. hydrogen peroxide in neutral or alkaline solution doa not have a satisfactory brightening action though 19 it may somethnes remove a slight amount of stain. Likewise, the acidifier alone may remove some stain but it does'not serve as a brightener in a satisfactory manner.
The following examples are given to explain is more fully the practice of my invention:
trample 14-h metal sheet bent to U-form was cadmium plated in a conventional manner. he use of a U-i'orm article closely approximates commercial plating conditions and the article is not '0 uniformly bright. being duller in the recessed portion. The plated article was rinsed free of the platingsolutionincoldwaterandthendipped for about fifteen seconds at room temperature in a brightdipconsistingof9ouncesofa30% (by weight) hydrogen peroxide solution, two-third of anounceofdd B6.0.P.sulfuricacidandagall0n of water. After removing the plated article from theln-ightdipitwascarefullywashedand dried. Theremltingplatedaheetbadalustromuniformly bright finish. the recessed portions being uniforminappcarancewiththerestofthearticle.
vI-prefertousea pureacidasimmrltiessuch asarecommonlyfoundinoommercial acids might cause decomposition of the peroxide. '5
The ratio of H102"?! weight) to HsSOe (by weight) is of great importance. In fact, it appearstobemoreimportantthantheperoxlde concentration. Astheacidisincreased andthe Biol/m ratio falls to one to one or below. the plate becomes white and as the ratio drops further becomes gray or black. The discolorationbythedip,wdtharatioofsubstantially belowonetoone.istyplcaiofadirectacidetch. This ratio is dependent to some extent upon the as actual concentration involved, a higher peroxide ratio being required in the more dilute solutions. For example, fair results were obtained using 2% HaBOnnd 2% 8s0rbyweight,but0.2% ofeach gavepoorresults. Goodbrightening canbeobgo tained, however, by using 0.5% H20] and 0.2% 8:80. lily preferred Bros/H2304 ratio is about four to one. with higher ratios the brightening action is more vigorous. but the stability of the dipisnotquiteasgreatand tbenostisincreased. g
action of a preliminary bath substantially free from oxidizing agents which comprises sulfuric acid, and exposing the cadmium to a bright dip which comprises hydrogen peroxide and sulfuric acid, the ratio of peroxide to acid in the bright 5 dip being no less than about four to one.
' RAYMOND J. KEPFEB.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US710325A US2154455A (en) | 1934-02-08 | 1934-02-08 | Cadmium bright dip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US710325A US2154455A (en) | 1934-02-08 | 1934-02-08 | Cadmium bright dip |
Publications (1)
Publication Number | Publication Date |
---|---|
US2154455A true US2154455A (en) | 1939-04-18 |
Family
ID=24853556
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US710325A Expired - Lifetime US2154455A (en) | 1934-02-08 | 1934-02-08 | Cadmium bright dip |
Country Status (1)
Country | Link |
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US (1) | US2154455A (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2613141A (en) * | 1949-07-29 | 1952-10-07 | Aluminum Co Of America | Chemical brightening of aluminum |
US2638410A (en) * | 1951-01-16 | 1953-05-12 | Aluminum Co Of America | Brightening nickel |
US2678876A (en) * | 1950-12-26 | 1954-05-18 | Rca Corp | Conditioning of metal surfaces |
US2734094A (en) * | 1956-02-07 | simon | ||
US2856275A (en) * | 1956-11-20 | 1958-10-14 | Amchem Prod | Chemical treatment of refractory metal surfaces |
US2982625A (en) * | 1957-03-22 | 1961-05-02 | Sylvania Electric Prod | Etchant and method |
US3269881A (en) * | 1963-12-30 | 1966-08-30 | Allied Chem | Hydrogen peroxide etching of copper in manufacture of printed circuits |
US3412032A (en) * | 1965-02-01 | 1968-11-19 | Revere Copper & Brass Inc | Etching bath composition |
US4452643A (en) * | 1983-01-12 | 1984-06-05 | Halliburton Company | Method of removing copper and copper oxide from a ferrous metal surface |
US6310017B1 (en) | 1999-02-01 | 2001-10-30 | Ct Associates, Inc. | Cleaner composition, method for making and using same |
-
1934
- 1934-02-08 US US710325A patent/US2154455A/en not_active Expired - Lifetime
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2734094A (en) * | 1956-02-07 | simon | ||
US2613141A (en) * | 1949-07-29 | 1952-10-07 | Aluminum Co Of America | Chemical brightening of aluminum |
US2678876A (en) * | 1950-12-26 | 1954-05-18 | Rca Corp | Conditioning of metal surfaces |
US2638410A (en) * | 1951-01-16 | 1953-05-12 | Aluminum Co Of America | Brightening nickel |
US2856275A (en) * | 1956-11-20 | 1958-10-14 | Amchem Prod | Chemical treatment of refractory metal surfaces |
US2982625A (en) * | 1957-03-22 | 1961-05-02 | Sylvania Electric Prod | Etchant and method |
US3269881A (en) * | 1963-12-30 | 1966-08-30 | Allied Chem | Hydrogen peroxide etching of copper in manufacture of printed circuits |
US3293093A (en) * | 1963-12-30 | 1966-12-20 | Allied Chem | Dissolution of metal with acidified hydrogen peroxide and use as copper etchant in manufacture of printed circuits |
DE1298383B (en) * | 1963-12-30 | 1969-06-26 | Allied Chem | Process and means for the chemical dissolution of copper |
US3412032A (en) * | 1965-02-01 | 1968-11-19 | Revere Copper & Brass Inc | Etching bath composition |
US4452643A (en) * | 1983-01-12 | 1984-06-05 | Halliburton Company | Method of removing copper and copper oxide from a ferrous metal surface |
US6310017B1 (en) | 1999-02-01 | 2001-10-30 | Ct Associates, Inc. | Cleaner composition, method for making and using same |
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