BE605370A - Perfectionnements relatifs à la production de dispositifs semi-conducteurs. - Google Patents
Perfectionnements relatifs à la production de dispositifs semi-conducteurs.Info
- Publication number
- BE605370A BE605370A BE605370A BE605370A BE605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A
- Authority
- BE
- Belgium
- Prior art keywords
- production
- semiconductor devices
- improvements relating
- relating
- semiconductor
- Prior art date
Links
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
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- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/0554—External layer
- H01L2224/05599—Material
- H01L2224/056—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H01L2924/01083—Bismuth [Bi]
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
- Electrodes Of Semiconductors (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB22225/60A GB930091A (en) | 1960-06-24 | 1960-06-24 | Improvements relating to the production of semi-conductor devices |
Publications (1)
Publication Number | Publication Date |
---|---|
BE605370A true BE605370A (fr) | 1961-12-27 |
Family
ID=10175948
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE605370A BE605370A (fr) | 1960-06-24 | 1961-06-23 | Perfectionnements relatifs à la production de dispositifs semi-conducteurs. |
Country Status (3)
Country | Link |
---|---|
US (1) | US3186084A (fr) |
BE (1) | BE605370A (fr) |
GB (1) | GB930091A (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3523222A (en) * | 1966-09-15 | 1970-08-04 | Texas Instruments Inc | Semiconductive contacts |
DE2012110A1 (de) * | 1970-03-13 | 1971-09-23 | Siemens Ag | Verfahren zum Herstellen einer Mehrlagenmetallisierung an elektrischen Bauelementen |
US4011583A (en) * | 1974-09-03 | 1977-03-08 | Bell Telephone Laboratories, Incorporated | Ohmics contacts of germanium and palladium alloy from group III-V n-type semiconductors |
US4126713A (en) * | 1976-11-15 | 1978-11-21 | Trw Inc. | Forming films on semiconductor surfaces with metal-silica solution |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2418460A (en) * | 1943-12-31 | 1947-04-08 | Bell Telephone Labor Inc | Resistor |
US2509909A (en) * | 1946-12-31 | 1950-05-30 | Bell Telephone Labor Inc | Conductive device |
US2856681A (en) * | 1955-08-08 | 1958-10-21 | Texas Instruments Inc | Method of fixing leads to silicon and article resulting therefrom |
BE575275A (fr) * | 1958-02-03 | 1900-01-01 |
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1960
- 1960-06-24 GB GB22225/60A patent/GB930091A/en not_active Expired
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1961
- 1961-06-22 US US118914A patent/US3186084A/en not_active Expired - Lifetime
- 1961-06-23 BE BE605370A patent/BE605370A/fr unknown
Also Published As
Publication number | Publication date |
---|---|
GB930091A (en) | 1963-07-03 |
US3186084A (en) | 1965-06-01 |
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