BE605370A - Perfectionnements relatifs à la production de dispositifs semi-conducteurs. - Google Patents

Perfectionnements relatifs à la production de dispositifs semi-conducteurs.

Info

Publication number
BE605370A
BE605370A BE605370A BE605370A BE605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A BE 605370 A BE605370 A BE 605370A
Authority
BE
Belgium
Prior art keywords
production
semiconductor devices
improvements relating
relating
semiconductor
Prior art date
Application number
BE605370A
Other languages
English (en)
Original Assignee
Mond Nickel Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mond Nickel Co Ltd filed Critical Mond Nickel Co Ltd
Publication of BE605370A publication Critical patent/BE605370A/fr

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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    • H01ELECTRIC ELEMENTS
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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    • H01L2224/02Bonding areas; Manufacturing methods related thereto
    • H01L2224/04Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554External layer
    • H01L2224/05599Material
    • H01L2224/056Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/05663Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/00Metal working
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    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
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    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49204Contact or terminal manufacturing
    • Y10T29/49208Contact or terminal manufacturing by assembling plural parts
    • Y10T29/49218Contact or terminal manufacturing by assembling plural parts with deforming

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Wire Bonding (AREA)
BE605370A 1960-06-24 1961-06-23 Perfectionnements relatifs à la production de dispositifs semi-conducteurs. BE605370A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB22225/60A GB930091A (en) 1960-06-24 1960-06-24 Improvements relating to the production of semi-conductor devices

Publications (1)

Publication Number Publication Date
BE605370A true BE605370A (fr) 1961-12-27

Family

ID=10175948

Family Applications (1)

Application Number Title Priority Date Filing Date
BE605370A BE605370A (fr) 1960-06-24 1961-06-23 Perfectionnements relatifs à la production de dispositifs semi-conducteurs.

Country Status (3)

Country Link
US (1) US3186084A (fr)
BE (1) BE605370A (fr)
GB (1) GB930091A (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3523222A (en) * 1966-09-15 1970-08-04 Texas Instruments Inc Semiconductive contacts
DE2012110A1 (de) * 1970-03-13 1971-09-23 Siemens Ag Verfahren zum Herstellen einer Mehrlagenmetallisierung an elektrischen Bauelementen
US4011583A (en) * 1974-09-03 1977-03-08 Bell Telephone Laboratories, Incorporated Ohmics contacts of germanium and palladium alloy from group III-V n-type semiconductors
US4126713A (en) * 1976-11-15 1978-11-21 Trw Inc. Forming films on semiconductor surfaces with metal-silica solution

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2418460A (en) * 1943-12-31 1947-04-08 Bell Telephone Labor Inc Resistor
US2509909A (en) * 1946-12-31 1950-05-30 Bell Telephone Labor Inc Conductive device
US2856681A (en) * 1955-08-08 1958-10-21 Texas Instruments Inc Method of fixing leads to silicon and article resulting therefrom
BE575275A (fr) * 1958-02-03 1900-01-01

Also Published As

Publication number Publication date
GB930091A (en) 1963-07-03
US3186084A (en) 1965-06-01

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