BE568367A - Procédé de fabrication d'un panneau isolant, muni d'un reseau ou circuit conducteur, et panneau realise suivant ce procédé - Google Patents

Procédé de fabrication d'un panneau isolant, muni d'un reseau ou circuit conducteur, et panneau realise suivant ce procédé

Info

Publication number
BE568367A
BE568367A BE568367A BE568367A BE568367A BE 568367 A BE568367 A BE 568367A BE 568367 A BE568367 A BE 568367A BE 568367 A BE568367 A BE 568367A BE 568367 A BE568367 A BE 568367A
Authority
BE
Belgium
Prior art keywords
panel
network
produced according
conductive circuit
manufacturing process
Prior art date
Application number
BE568367A
Other languages
English (en)
French (fr)
Original Assignee
Philips Nv
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Nv filed Critical Philips Nv
Publication of BE568367A publication Critical patent/BE568367A/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1536—Temporarily stacked PCBs
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1059—Splitting sheet lamina in plane intermediate of faces
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
    • Y10T156/1062—Prior to assembly
    • Y10T156/1075—Prior to assembly of plural laminae from single stock and assembling to each other or to additional lamina
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y10T156/1089—Methods of surface bonding and/or assembly therefor of discrete laminae to single face of additional lamina
    • Y10T156/109—Embedding of laminae within face of additional laminae
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
BE568367A 1957-06-07 1958-06-05 Procédé de fabrication d'un panneau isolant, muni d'un reseau ou circuit conducteur, et panneau realise suivant ce procédé BE568367A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL217955A NL93768C (is") 1957-06-07 1957-06-07

Publications (1)

Publication Number Publication Date
BE568367A true BE568367A (fr) 1960-10-21

Family

ID=19750898

Family Applications (1)

Application Number Title Priority Date Filing Date
BE568367A BE568367A (fr) 1957-06-07 1958-06-05 Procédé de fabrication d'un panneau isolant, muni d'un reseau ou circuit conducteur, et panneau realise suivant ce procédé

Country Status (9)

Country Link
US (1) US3010863A (is")
JP (1) JPS3510176B1 (is")
AT (1) AT205096B (is")
BE (1) BE568367A (is")
CH (1) CH364822A (is")
DE (1) DE1129198B (is")
FR (1) FR1210722A (is")
GB (1) GB826117A (is")
NL (2) NL93768C (is")

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1244895B (de) * 1958-05-28 1967-07-20 Cromtryek Ab Verfahren zur Herstellung gedruckter Schaltungen
US3234060A (en) * 1961-06-15 1966-02-08 Sperry Rand Corp Method of fabricating a laminated printed circuit structure
FR1309917A (fr) * 1961-10-09 1962-11-23 Fulmen Résistance électrique variable et application à un régulateur électrique
DE1273649B (de) * 1961-10-14 1968-07-25 Wilhelm Ruppert Jun Verfahren zur Herstellung einer gedruckten Schaltung mit Hilfe von Bandleitern
US3131103A (en) * 1962-02-26 1964-04-28 Ney Co J M Method of making circuit components
US3217089A (en) * 1962-06-01 1965-11-09 Control Data Corp Embedded printed circuit
US3264159A (en) * 1963-01-18 1966-08-02 Park Electrochemical Corp Method of laminating metal to wood
DE1496984C3 (de) * 1963-02-06 1974-01-24 Siemens Ag, 1000 Berlin U. 8000 Muenchen Verfahren zum Herstellen gedruckter Schaltungen mit galvanisch erzeugten Leiterbahnen nach der Aufbaumethode
US3374129A (en) * 1963-05-02 1968-03-19 Sanders Associates Inc Method of producing printed circuits
US3972755A (en) * 1972-12-14 1976-08-03 The United States Of America As Represented By The Secretary Of The Navy Dielectric circuit board bonding
JPS5287510A (en) * 1976-01-17 1977-07-21 Koukuu Uchiyuu Gijiyutsu Kenki Gas turbine combustor
DE2659625C3 (de) * 1976-12-30 1981-07-02 Ferrozell-Gesellschaft Sachs & Co Mbh, 8900 Augsburg Verfahren zur Herstellung von Basismaterial zur Herstellung gedruckter Schaltungen
JPS60137092A (ja) * 1983-12-19 1985-07-20 株式会社東芝 回路基板の製造方法
JPS63240096A (ja) * 1987-03-27 1988-10-05 富士通株式会社 グリ−ンシ−ト多層法
US4918812A (en) * 1988-06-29 1990-04-24 International Business Machines Corporation Processing of cores for circuit boards or cards
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
AT398877B (de) * 1991-10-31 1995-02-27 Philips Nv Zwei- oder mehrlagige leiterplatte, verfahren zum herstellen einer solchen leiterplatte und laminat für die herstellung einer solchen leiterplatte nach einem solchen verfahren
EP1661053A4 (en) * 2003-08-08 2012-06-13 Shmuel Shapira SYSTEM AND METHOD FOR CIRCUIT FORMATION
CN109479374A (zh) * 2016-07-12 2019-03-15 日立化成株式会社 电路基板的制造方法和电路基板

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1284296A (en) * 1918-10-02 1918-11-12 Westinghouse Electric & Mfg Co Process of making laminated articles.
US2448357A (en) * 1945-11-29 1948-08-31 Paper Patents Co Panel facing
US2587171A (en) * 1949-01-27 1952-02-26 Union Carbide & Carbon Corp Laminated article having an unimpregnated surface and method of making the same
NL189131B (nl) * 1950-01-12 Basf Ag Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride.
GB728219A (en) * 1951-07-16 1955-04-13 Technograph Printed Circuits L Printed circuits
GB724380A (en) * 1952-10-10 1955-02-16 Gen Electric A method for making a predetermined metallic pattern on an insulating base
US2716268A (en) * 1952-10-16 1955-08-30 Erie Resistor Corp Method of making printed circuits
NL190034A (is") * 1953-08-17
US2849298A (en) * 1955-05-03 1958-08-26 St Regis Paper Co Printed circuitry laminates and production thereof

Also Published As

Publication number Publication date
US3010863A (en) 1961-11-28
CH364822A (de) 1962-10-15
GB826117A (en) 1959-12-23
FR1210722A (fr) 1960-03-10
AT205096B (de) 1959-09-10
JPS3510176B1 (is") 1960-07-29
DE1129198B (de) 1962-05-10
NL93768C (is") 1960-03-15
NL217955A (is")

Similar Documents

Publication Publication Date Title
BE568367A (fr) Procédé de fabrication d'un panneau isolant, muni d'un reseau ou circuit conducteur, et panneau realise suivant ce procédé
FR1209654A (fr) Câbles élastiques et leur procédé de fabrication
FR1222180A (fr) Conducteur électrique isolé et procédé de fabrication
FR1173923A (fr) Procédé de montage de circuits électriques
BE586392A (fr) Procédé de formation de circuit imprimés
BE583768A (fr) Procédé d'isolation électrique.
FR1262049A (fr) Procédé de fabrication de panneaux isolants et panneaux obtenus selon le procédé
BE590494A (fr) Condensateurs électriques et leur procédé de fabrication.
FR1217967A (fr) Bouilloire électrique et son procédé de fabrication
FR1189430A (fr) Procédé de fabrication d'une cathode imprégnée et cathode réalisée suivant ce procédé
CH354129A (fr) Procédé de fabrication d'un circuit électrique du type imprimé
BE575725A (fr) Eléments conducteurs électriques et leur procédé de fabrication.
FR1281431A (fr) Panneau isolant et son procédé de fabrication
FR1227021A (fr) Procédé de fabrication de rubans isolants imprégnés
FR1301765A (fr) Panneaux isolants et procédé de fabrication
FR1307490A (fr) Polymères adhésifs et leur procédé de fabrication
FR1266909A (fr) émulsions bitumineuses et leur procédé de fabrication
FR1188732A (fr) Dispositif de connexion électrique et son procédé de fabrication
FR1158315A (fr) Isolateurs électriques
FR1142677A (fr) Isolants électriques et leur procédé de fabrication
FR1214129A (fr) Condensateur électrique et procédé de fabrication
FR1184839A (fr) Ventilateurs électriques et leur procédé de fabrication
BE604025A (fr) Panneaux isolants et procédé de fabrication.
FR1184327A (fr) Circuit de supervision
FR1296885A (fr) Panneaux isolants et procédé de fabrication