NL189131B - Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride. - Google Patents

Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride.

Info

Publication number
NL189131B
NL189131B NLAANVRAGE7712395,A NL189131DA NL189131B NL 189131 B NL189131 B NL 189131B NL 189131D A NL189131D A NL 189131DA NL 189131 B NL189131 B NL 189131B
Authority
NL
Netherlands
Prior art keywords
chloride
preparation
dimethylpiperidinium
dimethyl morpholinium
dimethyl
Prior art date
Application number
NLAANVRAGE7712395,A
Other languages
English (en)
Original Assignee
Basf Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Publication of NL189131B publication Critical patent/NL189131B/nl

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0364—Conductor shape
    • H05K2201/0382—Continuously deformed conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2072—Anchoring, i.e. one structure gripping into another
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0369—Etching selective parts of a metal substrate through part of its thickness, e.g. using etch resist
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
NLAANVRAGE7712395,A 1950-01-12 Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride. NL189131B (nl)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US138246A US2683839A (en) 1950-01-12 1950-01-12 Electric circuit components and method of preparing same

Publications (1)

Publication Number Publication Date
NL189131B true NL189131B (nl)

Family

ID=22481143

Family Applications (1)

Application Number Title Priority Date Filing Date
NLAANVRAGE7712395,A NL189131B (nl) 1950-01-12 Werkwijze voor de bereiding van n.n-dimethylpiperidiniumchloride respectievelijk n.n-dimethylmorfoliniumchloride.

Country Status (2)

Country Link
US (1) US2683839A (nl)
NL (1) NL189131B (nl)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3123898A (en) * 1964-03-10 figure
US2939905A (en) * 1954-03-05 1960-06-07 Earl L Canfield Electrical conductors, connections and methods of connection
US2900580A (en) * 1954-06-04 1959-08-18 Beck S Inc Printed electrical circuit components having integral lead-outs and methods of making same
US2823286A (en) * 1954-07-12 1958-02-11 John T Beck Contacts for electrical circuits and methods for making same
US2870400A (en) * 1955-02-11 1959-01-20 Cleveland Patents Inc Tube tester
US2937358A (en) * 1955-04-18 1960-05-17 Gen Electric Printed circuit sandwiched in glass
NL255273A (nl) * 1955-07-15
US2912745A (en) * 1955-08-25 1959-11-17 Erie Resistor Corp Method of making a printed circuit
NL93768C (nl) * 1957-06-07 1960-03-15 Philips Nv
US2958064A (en) * 1957-11-26 1960-10-25 Amp Inc Circuit board and socket construction
US3008112A (en) * 1958-03-12 1961-11-07 Amp Inc Connector means for circuit board
US3079577A (en) * 1958-08-27 1963-02-26 Brownfield Robert Circuit boards
NL251679A (nl) * 1959-05-21
US3108560A (en) * 1959-07-15 1963-10-29 Gen Motors Corp Means for assembling printed circuits with components
NL254533A (nl) * 1959-08-10 1900-01-01
US3114807A (en) * 1959-10-23 1963-12-17 Clare & Co C P Sealed switch unit mounted on printed circuit board
US3098951A (en) * 1959-10-29 1963-07-23 Sippican Corp Weldable circuit cards
US3730812A (en) * 1970-12-14 1973-05-01 Gen Motors Corp Heat sealing die
US4064357A (en) * 1975-12-02 1977-12-20 Teledyne Electro-Mechanisms Interconnected printed circuits and method of connecting them
JPS60137092A (ja) * 1983-12-19 1985-07-20 株式会社東芝 回路基板の製造方法
US4584039A (en) * 1984-12-26 1986-04-22 Hughes Aircraft Co. Fine line flexible cable fabrication process
US4736277A (en) * 1986-01-03 1988-04-05 Motorola, Inc. Metal printed circuit panels including mesas for coupling circuitry thereon to signal ground

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1718993A (en) * 1927-09-09 1929-07-02 Belden Mfg Co Wiring panel for electrical apparatus
US1794831A (en) * 1929-01-19 1931-03-03 Lionel Corp Multiple conductor strip and method of making the same
US2431393A (en) * 1929-05-18 1947-11-25 Jacob Poster Method of forming metal and attaching it to a support
US2288735A (en) * 1929-05-18 1942-07-07 John J O'connell Method of making electrostatic shields
GB331991A (en) * 1929-05-18 1930-07-17 James Percival Laker Improvement in radio receivers and the like
FR687094A (fr) * 1929-12-21 1930-08-04 Procédé pour l'établissement rapide des connexions entre les divers organes d'appareils électriques complexes et produit obtenu par ce procédé
US1939130A (en) * 1931-04-14 1933-12-12 Donald H Mills Radio base construction
US2433384A (en) * 1942-11-05 1947-12-30 Int Standard Electric Corp Method of manufacturing unitary multiple connections
US2441960A (en) * 1943-02-02 1948-05-25 Eisler Paul Manufacture of electric circuit components
US2474988A (en) * 1943-08-30 1949-07-05 Sargrove John Adolph Method of manufacturing electrical network circuits
US2443119A (en) * 1944-04-05 1948-06-08 Milton D Rubin Process of producing predetermined metallic patterns
US2447541A (en) * 1945-01-29 1948-08-24 Sabee Method of making plastic structure
GB602492A (en) * 1945-08-23 1948-05-27 Sir Ernest Thomas Fisk Improvements in or relating to methods of making electrically conducting patterns, such as wiring circuits, coils and the like

Also Published As

Publication number Publication date
US2683839A (en) 1954-07-13

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