BE558969A - - Google Patents

Info

Publication number: BE558969A
Authority: BE; Belgium

Application number

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1956-07-04

Publication of BE558969A publication Critical patent/BE558969A/xx

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01023—Vanadium [V]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01032—Germanium [Ge]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys

Landscapes

Engineering & Computer Science (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Chemical & Material Sciences (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Die Bonding (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

BE558969D 1956-07-04 BE558969A (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
DEP16581A DE1035782B (de)	1956-07-04	1956-07-04	Verfahren zur Befestigung von Halbleiteranordnungen auf einem gut waermeleitenden Traeger

Publications (1)

Publication Number	Publication Date
BE558969A true BE558969A (fr)

Family

ID=7366113

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
BE558969D BE558969A (fr)	1956-07-04

Country Status (5)

Country	Link
BE (1)	BE558969A (fr)
CH (1)	CH353459A (fr)
DE (1)	DE1035782B (fr)
FR (1)	FR1182331A (fr)
GB (1)	GB859005A (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
DE1106878B (de) *	1958-08-08	1961-05-18	Siemens Ag	Halbleiteranordnung und Verfahren zu ihrer Herstellung
DE1176451B (de) *	1958-09-10	1964-08-20	Siemens Ag	Verfahren zur Herstellung eines Halbleiter-bauelementes
DE1110322B (de) *	1958-11-26	1961-07-06	Siemens Ag	Flaechengleichrichteranordnung mit einem mit Kuehlfahnen ausgestatteten massiven Kuehlkoerper
DE1205626B (de) *	1959-01-28	1965-11-25	Bosch Gmbh Robert	Halbleiteranordnung
DE1151324B (de) *	1960-04-11	1963-07-11	Elektronik M B H	Verfahren zur Herstellung von Halbleiteranordnungen
DE1221532B (de) *	1960-07-08	1966-07-21	Licentia Gmbh	Verwendung eines Gold-Antimon-Lotes zum Verloeten von Teilen aus Wolfram oder Moylbdaen mit Teilen aus dem glechen eihem anderen Werkstoff
DE1242758B (de) *	1961-04-07	1967-06-22	Siemens Ag	Halbleiteranordnung, insbesondere fuer grosse Leistungen, bei der ein duenner, scheibenfoermiger Halbleiterkoerper auf einer Traegerplatte befestigt ist
NL295109A (fr) *	1962-12-26
GB8522159D0 (en) *	1985-09-06	1985-10-09	Lucas Elect Electron Syst	Connection of electrical component
EP2337997B1 (fr) *	2008-10-14	2013-12-11	Koninklijke Philips N.V.	Système de conduction thermique entre une lampe à del et un élément raccordable
DE102012207470B3 (de) *	2012-05-04	2013-10-10	Infineon Technologies Ag	Verfahren zur herstellung einer halbleitermodulanordnung
DE102015115133B3 (de) *	2015-09-09	2016-11-03	Infineon Technologies Ag	Verfahren zum Verbinden eines Kühlkörpers mit wenigstens einem Schaltungsträger durch Aufschrumpfen

0
- BE BE558969D patent/BE558969A/xx unknown
1956
- 1956-07-04 DE DEP16581A patent/DE1035782B/de active Pending
1957
- 1957-07-01 GB GB2069357A patent/GB859005A/en not_active Expired
- 1957-07-02 FR FR1182331D patent/FR1182331A/fr not_active Expired
- 1957-07-02 CH CH353459D patent/CH353459A/de unknown

Also Published As

Publication number	Publication date
CH353459A (de)	1961-04-15
GB859005A (en)	1961-01-18
FR1182331A (fr)	1959-06-24
DE1035782B (de)	1958-08-07

Publication	Publication Date	Title
AT202855B (fr)	1959-04-10
BE552625A (fr)	1959-12-31
AT199361B (fr)	1958-08-25
AT198114B (fr)	1958-06-10
AT202354B (fr)	1959-03-10
AT201309B (fr)	1958-12-27
AT202279B (fr)	1959-02-25
AT213780B (fr)	1961-02-27
AT199904B (fr)	1958-10-10
AT201431B (fr)	1959-01-10
AT198038B (fr)	1958-06-10
AT198039B (fr)	1958-06-10
AT198051B (fr)	1958-06-10
AT211020B (fr)	1960-09-10
AT198347B (fr)	1958-06-25
AT198677B (fr)	1958-07-25
AT198814B (fr)	1958-07-25
AT198832B (fr)	1958-07-25
AT198843B (fr)	1958-07-25
AT198891B (fr)	1958-07-25
AT198966B (fr)	1958-08-11
AT198988B (fr)	1958-08-11
AT199054B (fr)	1958-08-11
AT204355B (fr)	1959-07-10
AT196060B (fr)	1958-02-25