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1952-12-04 |
1959-04-14 |
Raytheon Mfg Co |
Transistor assemblies
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1952-12-31 |
1900-01-01 |
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1953-03-02 |
1958-02-11 |
Rca Corp |
Method for removing portions of semiconductor device electrodes
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1953-07-29 |
1957-10-08 |
Rca Corp |
Power semiconductor devices
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1953-09-15 |
1958-08-12 |
Siemens Ag |
Semiconductor devices and method of manufacturing them
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1953-10-13 |
1958-09-02 |
Rca Corp |
Semiconductor devices
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1953-10-23 |
1958-04-15 |
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1953-12-02 |
1958-12-03 |
Philco Corp |
Semiconductor devices
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1954-01-21 |
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1954-06-01 |
1961-04-18 |
Rca Corp |
Methods of making semi-conductor devices
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1955-05-10 |
1967-01-17 |
Texas Instruments Inc |
Transistor structure with heatconductive housing for cooling
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1955-05-13 |
1960-06-14 |
Philco Corp |
Semiconductive apparatus
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1955-05-18 |
1965-07-06 |
Ibm |
Bistable junction transistor
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1955-05-23 |
1959-08-04 |
Philco Corp |
Method of fabricating semiconductor devices
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1955-05-23 |
1959-10-20 |
Texas Instruments Inc |
Base contacts for transistors
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1955-05-27 |
1960-03-01 |
Philco Corp |
Polarizing semiconductive apparatus
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1955-06-13 |
1958-07-15 |
Philco Corp |
Method of soldering leads to semiconductor devices
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1955-06-13 |
1959-09-29 |
Sprague Electric Co |
Silicon junction diode
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1955-09-12 |
1959-11-12 |
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1955-09-30 |
1958-04-08 |
Hughes Aircraft Co |
Heat dissipating semiconductor device
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1955-11-04 |
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1955-11-08 |
1957-09-10 |
Westinghouse Electric Corp |
Semiconductor rectifier device
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BE562491A
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1956-03-05 |
1900-01-01 |
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1956-03-30 |
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1956-05-31 |
1962-02-13 |
Raytheon Co |
Soldering methods
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1956-07-11 |
1963-10-24 |
Bosch Gmbh Robert |
Leistungstransistor
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*
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1956-09-07 |
1961-07-25 |
Int Rectifier Corp |
Air-cooled rectifier assembly
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*
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1956-09-17 |
1959-09-22 |
Rca Corp |
Semiconductor power devices and method of manufacture
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*
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1956-10-01 |
1961-05-16 |
Motorola Inc |
Transistor heat sink assembly
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*
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1956-11-27 |
1960-10-04 |
Raytheon Co |
Hermetically sealed power transistors
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1956-11-28 |
1961-08-22 |
Texas Instruments Inc |
Method of making ohmic connections to silicon semiconductors
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BE554048A
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1957-01-09 |
1957-01-31 |
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1957-02-27 |
1960-09-20 |
Westinghouse Electric Corp |
Semiconductor diode
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1957-05-02 |
1961-04-25 |
Sarkes Tarzian |
Semiconductor device
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1957-05-27 |
1959-12-01 |
Int Rectifier Corp |
Dry rectifier assembly and housing therefor
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1958-03-14 |
1962-07-31 |
Honeywell Regulator Co |
Soldering technique
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1958-07-10 |
1960-12-06 |
Texas Instruments Inc |
Arrangement for increasing heat dissipation in semi-conductor-device
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1958-09-12 |
1962-10-09 |
Raytheon Co |
Electrical cooling devices
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1958-10-17 |
1964-04-21 |
Talk A Phone Co |
Intercommunication system
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1958-12-16 |
1962-11-27 |
Sarkes Tarzian |
Semiconductor device
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1958-12-17 |
1960-03-01 |
Hughes Aircraft Co |
Perfectionnements aux dispositifs semi-conducteurs du type à jonction
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1959-04-27 |
1966-06-21 |
Rca Corp |
Semiconductor device enclosures
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1959-07-28 |
1960-12-13 |
Rca Corp |
Jig alloying of semiconductor devices
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1959-12-16 |
1963-11-12 |
Engelhard Ind Inc |
Method of bonding amalgam inserts in cavities and structure thereby produced
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1960-02-05 |
1962-03-13 |
Lear Inc |
Semiconductor heat sink and electrical insulator
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1960-03-09 |
1962-11-07 |
Westinghouse Electric Corp |
Semi-conductor devices
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1960-06-09 |
1966-12-22 |
Siemens Ag |
Verfahren zum Herstellen einer Halbleiteranordnung
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1960-11-22 |
1964-07-21 |
Jr George G Harman |
Method of low temperature bonding for subsequent high temperature use
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1962-01-04 |
1965-06-08 |
Lloyd C Lantz |
Method of releasing solid solder from a joint
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1962-06-15 |
1966-06-07 |
Gen Motors Corp |
Transistor electrode connection
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1963-05-13 |
1966-04-26 |
Bbc Brown Boveri & Cie |
Semiconductor device with liquidized solder layer for compensation of expansion stresses
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1964-05-28 |
1967-11-28 |
Rca Corp |
Semiconductor device assemblage having two convex tabs
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1968-06-26 |
1970-10-27 |
Electric Regulator Corp |
Heat sink module
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1969-07-31 |
1971-04-09 |
Cit Alcatel |
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1971-04-14 |
1974-10-08 |
Raytheon Co |
Method of intermetallic bonding
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1971-08-20 |
1973-04-06 |
Thomson Csf |
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1972-08-28 |
1974-06-25 |
Zyrotron Ind Inc |
Plurality of semiconductor elements mounted on common base
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1985-07-30 |
1987-02-12 |
Bosch Gmbh Robert |
Elektrisches schaltgeraet
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1986-11-21 |
1988-11-29 |
Zenith Electronics Corporation |
Sealing for CRT components
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1991-08-19 |
1993-02-26 |
Mitsubishi Electric Corp |
半導体装置
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