H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L23/00—Details of semiconductor or other solid state devices
H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
H01L25/073—Apertured devices mounted on one or more rods passed through the apertures
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
H01L2924/0001—Technical content checked by a classifier
H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Architecture de modules electroniques de puissance interconnectes pour une machine electrique tournante et machine electrique tournante comprenant une telle architecture
Perfectionnements apportés aux modules thermo-électriques à plusieurs thermo-éléments pour installation thermo-électrique, et installation thermo-électrique comportant de tels modules thermo-électriques
Procede d'interconnexion de modules electroniques de puissance d'une machine electrique tournante et assemblage de modules de puissance interconnectes obtenu par ce procede
Bande de cellules électrochimiques pour réaliser un module de batterie pour véhicule électrique ou hybride, et procédé de réalisation d'un tel module
Dispositif électronique comprenant une protection thermique par composant électronique intercalaire, module comprenant ce dispositif et procédé de fabrication du dispositif.