AU7268400A - Method for the production of a self-supporting copper foil - Google Patents

Method for the production of a self-supporting copper foil

Info

Publication number
AU7268400A
AU7268400A AU72684/00A AU7268400A AU7268400A AU 7268400 A AU7268400 A AU 7268400A AU 72684/00 A AU72684/00 A AU 72684/00A AU 7268400 A AU7268400 A AU 7268400A AU 7268400 A AU7268400 A AU 7268400A
Authority
AU
Australia
Prior art keywords
self
production
copper foil
supporting copper
supporting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU72684/00A
Other languages
English (en)
Inventor
Jurgen Hackert
Axel Schafer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bolta Werke GmbH
Original Assignee
Bolta Werke GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bolta Werke GmbH filed Critical Bolta Werke GmbH
Publication of AU7268400A publication Critical patent/AU7268400A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/041—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by using a die for cutting the conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
    • H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
AU72684/00A 1999-08-13 2000-07-25 Method for the production of a self-supporting copper foil Abandoned AU7268400A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19937843 1999-08-13
DE1999137843 DE19937843C1 (de) 1999-08-13 1999-08-13 Verfahren zur Herstellung einer selbsttragenden Kupferfolie
PCT/DE2000/002444 WO2001012880A2 (fr) 1999-08-13 2000-07-25 Procede de realisation d'une feuille de cuivre autoportante

Publications (1)

Publication Number Publication Date
AU7268400A true AU7268400A (en) 2001-03-13

Family

ID=7917921

Family Applications (1)

Application Number Title Priority Date Filing Date
AU72684/00A Abandoned AU7268400A (en) 1999-08-13 2000-07-25 Method for the production of a self-supporting copper foil

Country Status (4)

Country Link
EP (1) EP1203110A2 (fr)
AU (1) AU7268400A (fr)
DE (1) DE19937843C1 (fr)
WO (1) WO2001012880A2 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10133250B4 (de) * 2001-07-09 2005-06-30 Vipem Hackert Gmbh Verfahren zur Herstellung eines elektrischen oder elektronischen Kabelbaumes in Form eines flexiblen Laminates
DE10255702B4 (de) * 2002-11-29 2011-08-11 Vipem Hackert GmbH, 08223 Verfahren zur Erzeugung mechanisch strukturierbarer Kupferfolien
DE10312693B3 (de) * 2003-03-21 2004-11-04 Rehau Ag + Co. Verfahren zum Aufbringen von mindestens einer Leiterbahn auf einem Kunststoffbauteil sowie Spritzgusswerkzeug zur Herstellung eines Kunststoffbauteils mit mindestens einer Leiterbahn
US9243339B2 (en) 2012-05-25 2016-01-26 Trevor Pearson Additives for producing copper electrodeposits having low oxygen content
CN110055560B (zh) * 2019-04-24 2021-02-09 福建清景铜箔有限公司 电解铜箔的生箔装置及阴极辊的制备方法
CN110904472B (zh) * 2019-11-21 2021-06-08 湖北中一科技股份有限公司 一种防电解铜箔断裂阴极辊及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3769179A (en) * 1972-01-19 1973-10-30 Kewanee Oil Co Copper plating process for printed circuits
US3879270A (en) * 1974-01-10 1975-04-22 Monsanto Co Compositions and process for the electrodeposition of metals
DE3116078A1 (de) * 1981-04-22 1983-01-20 IVO Irion & Vosseler, Zählerfabrik GmbH & Co, 7730 Villingen-Schwenningen "praegefolie"
US4692221A (en) * 1986-12-22 1987-09-08 Olin Corporation In-situ dendritic treatment of electrodeposited foil
US5051154A (en) * 1988-08-23 1991-09-24 Shipley Company Inc. Additive for acid-copper electroplating baths to increase throwing power
US5019221A (en) * 1989-01-18 1991-05-28 Yates Industries Electroplating drum cathode with high current-carrying capability
US5215646A (en) * 1992-05-06 1993-06-01 Circuit Foil Usa, Inc. Low profile copper foil and process and apparatus for making bondable metal foils
US5302278A (en) * 1993-02-19 1994-04-12 Learonal, Inc. Cyanide-free plating solutions for monovalent metals
US5366612A (en) * 1993-04-19 1994-11-22 Magma Copper Company Process for making copper foil
JP3313277B2 (ja) * 1995-09-22 2002-08-12 古河サーキットフォイル株式会社 ファインパターン用電解銅箔とその製造方法
US5863410A (en) * 1997-06-23 1999-01-26 Circuit Foil Usa, Inc. Process for the manufacture of high quality very low profile copper foil and copper foil produced thereby

Also Published As

Publication number Publication date
EP1203110A2 (fr) 2002-05-08
DE19937843C1 (de) 2001-02-08
WO2001012880A3 (fr) 2001-10-04
WO2001012880A2 (fr) 2001-02-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase