AU6231599A - Device for treating printed circuit boards - Google Patents

Device for treating printed circuit boards

Info

Publication number
AU6231599A
AU6231599A AU62315/99A AU6231599A AU6231599A AU 6231599 A AU6231599 A AU 6231599A AU 62315/99 A AU62315/99 A AU 62315/99A AU 6231599 A AU6231599 A AU 6231599A AU 6231599 A AU6231599 A AU 6231599A
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
treating printed
treating
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU62315/99A
Inventor
James Emile Lantang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LANTRONIC BV
Original Assignee
LANTRONIC BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LANTRONIC BV filed Critical LANTRONIC BV
Publication of AU6231599A publication Critical patent/AU6231599A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
AU62315/99A 1998-09-29 1999-09-29 Device for treating printed circuit boards Abandoned AU6231599A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL1010214A NL1010214C2 (en) 1998-09-29 1998-09-29 Device for handling printed circuit boards.
NL1010214 1998-09-29
PCT/NL1999/000602 WO2000018534A1 (en) 1998-09-29 1999-09-29 Device for treating printed circuit boards

Publications (1)

Publication Number Publication Date
AU6231599A true AU6231599A (en) 2000-04-17

Family

ID=19767900

Family Applications (1)

Application Number Title Priority Date Filing Date
AU62315/99A Abandoned AU6231599A (en) 1998-09-29 1999-09-29 Device for treating printed circuit boards

Country Status (3)

Country Link
AU (1) AU6231599A (en)
NL (1) NL1010214C2 (en)
WO (1) WO2000018534A1 (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
CH656769A5 (en) * 1980-09-09 1986-07-15 Sinter Ltd DEVICE FOR APPLYING SOLDER TO PCB.

Also Published As

Publication number Publication date
WO2000018534A1 (en) 2000-04-06
NL1010214C2 (en) 2000-03-30

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase