WO2000018534A1 - Device for treating printed circuit boards - Google Patents

Device for treating printed circuit boards Download PDF

Info

Publication number
WO2000018534A1
WO2000018534A1 PCT/NL1999/000602 NL9900602W WO0018534A1 WO 2000018534 A1 WO2000018534 A1 WO 2000018534A1 NL 9900602 W NL9900602 W NL 9900602W WO 0018534 A1 WO0018534 A1 WO 0018534A1
Authority
WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
solder
clamp
clamping
Prior art date
Application number
PCT/NL1999/000602
Other languages
French (fr)
Inventor
James Emile Lantang
Original Assignee
Lantronic B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lantronic B.V. filed Critical Lantronic B.V.
Priority to AU62315/99A priority Critical patent/AU6231599A/en
Publication of WO2000018534A1 publication Critical patent/WO2000018534A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder

Definitions

  • the present invention relates to a device for treating printed circuit boards, comprising a frame, a solder vessel for liquid solder arranged on the frame, blowing means for blowing off excess solder, clamping means mounted movably on the frame which comprise at least one clamp for clamping a side of a printed circuit board, and guiding and moving means for guiding and moving the clamping means in a path of movement between a low position, in which the clamped printed circuit board is situated in the solder vessel, and a high position in which it is situate * d outside the vessel, and wherein the blowing means are arranged along the path of movement .
  • the known devices for treating the printed circuit boards are constructed to process the most common printed circuit boards with a thickness of 1.5-1.6 mm. Use is however increasingly being made nowadays of much thinner, flexible boards with a thickness of less than 0.8 mm (so- called ' flexible circuits' ) . In order to treat these thin printed circuit boards the boards have to be mounted manually in special frames. Due to the high temperature of the liquid solder (250 °C) the flexibility of the printed circuit board increases, whereby it is very difficult to guide the printed circuit board accurately between the blowing means during blowing-off.
  • the blowing means comprise for instance so-called air knives along which the printed circuit board is guided, wherein the excess solder is blown off the printed circuit board and fed back into the solder vessel .
  • the object of the present invention is to obviate the above stated drawback in the treatment of thin flexible printed circuit boards.
  • clamping means comprise a second clamp lying opposite the first clamp for clamping an opposite side of the printed circuit board and wherein the guide means extend into the solder vessel, wherein at least one of the clamps is situated at least in the low position in the solder vessel.
  • the thin flexible printed circuit boards By clamping the printed circuit board on two opposite sides the thin flexible printed circuit boards can also be treated in suitable manner since they are held tensioned by the positioning of the clamps.
  • the clamps are preferably arranged such that they clamp two sides of the printed circuit board which lie opposite each other in the direction of movement, and thus form a top and a bottom clamp.
  • the first and second clamp are mounted on a movable auxiliary frame with which the clamps are moved between a low and high position.
  • a printed circuit board mounted in the clamps can in this way be guided in and out of the solder vessel .
  • Adjusting means are preferably arranged on the auxiliary frame for adjusting the distance between the two opposite clamps to the size of the printed circuit board for treating.
  • the options for use of the device according to the invention are hereby increased.
  • tensioning means are arranged on the auxiliary frame for urging the clamps apart .
  • the printed circuit board can be held under tension between the two clamps when the printed circuit board for instance expands as a result of the high temperature of the liquid solder and therefore becomes slightly longer, particularly when a very thin and flexible printed circuit board is treated.
  • the tensioning means arranged on the auxiliary frame preferably comprise at least one cylinder and control means for feeding and draining fluid under pressure to and from the cylinder.
  • the control means comprise for instance special software for adjusting the inlet and outlet valves of the cylinder in the correct manner. Fluid under pressure is guided into the cylinder in order to tension the clamps. It is important herein that the fluid is let out of the cylinder again, and the clamps thus moved toward each other again, when the printed circuit board is taken out of the liquid solder, so as to prevent cracking of the printed circuit board through contraction as a result of cooling.
  • a clamp comprises two co- acting clamping surfaces between which the printed circuit board can be clamped.
  • At least one clamp preferably comprises two co-acting clamping surfaces which are urged toward each other in spring-loaded manner and thus have a clamping function.
  • the co-acting clamping surfaces are moved apart.
  • the protrusion and operating means are herein situated outside the solder vessel in order to limit to a minimum the number of components of the device according to the invention in the hot liquid solder. In this manner the fewest possible sensitive components are exposed to the extreme conditions in the liquid solder.
  • the printed circuit board is clamped between the clamping surfaces, wherein the clamping surfaces of at least one clamp, preferably of both clamps, clamp the printed circuit board on one side in at least two locations situated at a mutual distance .
  • the printed circuit board is kept under tension in simple manner, whereby it can be guided easily in the liquid solder and along the air knives .
  • a clamp with two continuous co-acting clamping surfaces with which a side of the printed circuit board can be wholly clamped.
  • the tensioning force exerted on the printed circuit board is hereby distributed evenly over the printed circuit board.
  • a clamp comprises at least two pairs of clamping surfaces situated at a mutual distance from each other, wherein the clamping surface clamps the printed circuit board at a number of locations situated at regular mutual distances.
  • the expansion of the printed circuit board is herein partly absorbed in the regions between the different paired clamping surfaces.
  • the clamping surfaces can be flat but may also have another shape, such as for instance wave-shaped, whereby the expansion of the printed circuit board can also be absorbed in suitable manner.
  • the invention further relates to a method for treating printed circuit boards, comprising of clamping the printed circuit board on one side, immersing the printed circuit board in a solder vessel and blowing off excess solder, wherein the printed circuit board is moreover clamped on the opposite side.
  • Figure 1 shows a perspective view of an essential part of an embodiment of the device according to the invention.
  • FIGS 2 and 3 show specific embodiments of clamps according to the invention.
  • Figure 1 shows an essential part of a preferred embodiment of the device for treating printed circuit boards according to the invention.
  • Device 1 herein comprises a frame 2, a solder vessel (not shown) for liquid solder 3 arranged on the frame, blowing means 4 for blowing off excess solder, and clamping means 5A, 5B mounted movably on the frame.
  • Clamping means 5A, 5B comprise two opposing clamps 5A, 5B for clamping printed circuit board 6, wherein the clamps are mounted on an auxiliary frame 7 and form a top clamp 5A and a bottom clamp 5B.
  • the clamps could however also comprise two side clamps.
  • the distance 8 between top clamp 5A and bottom clamp 5B can be adjusted to the size of the printed circuit board 6 for treating with adjusting means comprising telescopic tubes 9.
  • Guiding means 10 and moving means 11 are further arranged to enable movement of clamps 5A, 5B mounted on auxiliary frame 7 into and out of the liquid solder.
  • Guiding means 10 comprise a U-profile 12 which is mounted on frame 2 and in which auxiliary frame 7 is moved via guide carriages 13 using moving means 11 fixed to a cross beam 14 of the auxiliary frame, a piston rod of which moving means is shown.
  • two opposing air knives 4 are arranged for blowing off excess solder.
  • Guiding means 10 extend into the liquid solder 3 and bottom clamp 5B is also situated in liquid solder 3.
  • tensioning means comprising two cylinders 15, in addition to schematically designated control means 16 for feeding and draining fluid to and from cylinders 15.
  • control means 16 for feeding and draining fluid to and from cylinders 15.
  • Bottom clamp 5B comprises two continuous co-acting clamping surfaces 17 which are urged toward each other using springs 18.
  • bottom clamp 5B engages round a protrusion 19 arranged on the frame.
  • Recesses 20 are arranged for this purpose in clamping surfaces 17 on both sides of bottom clamp 5B, such that bottom clamp 5B can engage round protrusion 18.
  • Protrusion 19 can be rotated using operating means 21, so that the co-acting clamping surfaces 17 of clamp 5B are moved apart and printed circuit board 6 can be fixed or removed. Both the protrusion 19 and the operating means 21 for the protrusion are situated outside the solder vessel, i.e. above the level of liquid solder 3.
  • Top clamp 5A can be the same as bottom clamp 5B, but may also be another suitable clamp.
  • Clamps 5A, 5B comprise two continuous co-acting clamping surfaces 17, with which printed circuit board 6 is wholly clamped on both the upper side 6A and underside 6B and thus held under uniform tension.
  • the method as according to the invention is as follows: The distance 8 between clamps 5A, 5B is adjusted to the size of printed circuit board 6 using adjusting means 9 mounted on auxiliary frame 7. Printed circuit board 6 is fixed in the clamps 5A, 5B mounted on auxiliary frame 7. Tensioning means 15 are activated whereby printed circuit board 6 is held tensioned between the clamps.
  • FIG. 1 shows a further suitable embodiment of a clamp according to the invention.
  • Clamp 5 herein comprises six pairs (A-F) of co-acting clamping surfaces 17 situated at a regular mutual distance.
  • FIG 3 is shown another preferred embodiment of a clamp according to the invention wherein the co-acting clamping surfaces 17 are wave-shaped.

Abstract

The invention relates to a device for treating printed circuit boards. This device comprises a frame, a solder vessel for liquid solder arranged on the frame, blowing means for blowing off excess solder, clamping means mounted movably on the frame which comprise at least one clamp for clamping a side of a printed circuit board, and guiding and moving means for guiding and moving the clamping means in a path of movement between a low position, in which the clamped printed circuit board is situated in the solder vessel, and a high position in which it is situated outside the vessel. The blowing means are arranged along the path of movement. The clamping means comprise a second clamp located opposite the first clamp for clamping an opposite side of the printed circuit board, and the guide means extend into the solder vessel, wherein at least one of the clamps is situated at least in the low position in the solder vessel.

Description

DEVICE FOR TREATING PRINTED CIRCUIT BOARDS
The present invention relates to a device for treating printed circuit boards, comprising a frame, a solder vessel for liquid solder arranged on the frame, blowing means for blowing off excess solder, clamping means mounted movably on the frame which comprise at least one clamp for clamping a side of a printed circuit board, and guiding and moving means for guiding and moving the clamping means in a path of movement between a low position, in which the clamped printed circuit board is situated in the solder vessel, and a high position in which it is situate*d outside the vessel, and wherein the blowing means are arranged along the path of movement .
In the PCB industry printed circuit boards are treated by applying a solder layer at locations at or on which electronic components are later soldered. This treatment has the main function of keeping the printed circuit board readily capable of being soldered for a determined period.
For this purpose a printed circuit board, of which the conductors are embodied in copper, is cleaned thoroughly and then wetted with a soldering flux. The conservation process is carried out in devices specially intended for this purpose.
Devices are known wherein the printed circuit board is fixed on one side in a clamp, which clamp is arranged movably and with which the printed circuit board is immersed for several seconds in a solder vessel with liquid solder, whereafter the printed circuit board is carried along blowing means for blowing off excess solder. The known devices for treating the printed circuit boards are constructed to process the most common printed circuit boards with a thickness of 1.5-1.6 mm. Use is however increasingly being made nowadays of much thinner, flexible boards with a thickness of less than 0.8 mm (so- called ' flexible circuits' ) . In order to treat these thin printed circuit boards the boards have to be mounted manually in special frames. Due to the high temperature of the liquid solder (250 °C) the flexibility of the printed circuit board increases, whereby it is very difficult to guide the printed circuit board accurately between the blowing means during blowing-off.
The blowing means comprise for instance so-called air knives along which the printed circuit board is guided, wherein the excess solder is blown off the printed circuit board and fed back into the solder vessel .
Fixing of the printed circuit boards in special frames is a manual process and thereby time-consuming and costly. There is therefore a demand for a device which is equipped to treat thin flexible printed circuit boards as well as the conventional rigid printed circuit boards, wherein it is not necessary to carry out additional operations.
The object of the present invention is to obviate the above stated drawback in the treatment of thin flexible printed circuit boards.
This object is achieved with the invention by providing a device for treating printed circuit boards wherein the clamping means comprise a second clamp lying opposite the first clamp for clamping an opposite side of the printed circuit board and wherein the guide means extend into the solder vessel, wherein at least one of the clamps is situated at least in the low position in the solder vessel.
By clamping the printed circuit board on two opposite sides the thin flexible printed circuit boards can also be treated in suitable manner since they are held tensioned by the positioning of the clamps. The clamps are preferably arranged such that they clamp two sides of the printed circuit board which lie opposite each other in the direction of movement, and thus form a top and a bottom clamp.
In a preferred embodiment of the device the first and second clamp are mounted on a movable auxiliary frame with which the clamps are moved between a low and high position. A printed circuit board mounted in the clamps can in this way be guided in and out of the solder vessel .
Adjusting means are preferably arranged on the auxiliary frame for adjusting the distance between the two opposite clamps to the size of the printed circuit board for treating. The options for use of the device according to the invention are hereby increased.
According to a further preferred embodiment of the device according to the invention, tensioning means are arranged on the auxiliary frame for urging the clamps apart . Using these tensioning means the printed circuit board can be held under tension between the two clamps when the printed circuit board for instance expands as a result of the high temperature of the liquid solder and therefore becomes slightly longer, particularly when a very thin and flexible printed circuit board is treated.
The tensioning means arranged on the auxiliary frame preferably comprise at least one cylinder and control means for feeding and draining fluid under pressure to and from the cylinder. The control means comprise for instance special software for adjusting the inlet and outlet valves of the cylinder in the correct manner. Fluid under pressure is guided into the cylinder in order to tension the clamps. It is important herein that the fluid is let out of the cylinder again, and the clamps thus moved toward each other again, when the printed circuit board is taken out of the liquid solder, so as to prevent cracking of the printed circuit board through contraction as a result of cooling.
In a further suitable embodiment of the device according to the invention, a clamp comprises two co- acting clamping surfaces between which the printed circuit board can be clamped. At least one clamp preferably comprises two co-acting clamping surfaces which are urged toward each other in spring-loaded manner and thus have a clamping function. In order to fix a printed circuit board in or remove it from the clamp, the co-acting clamping surfaces are moved apart. Preferably arranged for this purpose at a fixed position on the frame is a protrusion around which the clamp engages in the high position and with which the clamping surfaces can then be moved apart using operating means mounted on the protrusion. The protrusion and operating means are herein situated outside the solder vessel in order to limit to a minimum the number of components of the device according to the invention in the hot liquid solder. In this manner the fewest possible sensitive components are exposed to the extreme conditions in the liquid solder.
According to a subsequent preferred embodiment of the device according to the invention, the printed circuit board is clamped between the clamping surfaces, wherein the clamping surfaces of at least one clamp, preferably of both clamps, clamp the printed circuit board on one side in at least two locations situated at a mutual distance . In this manner the printed circuit board is kept under tension in simple manner, whereby it can be guided easily in the liquid solder and along the air knives .
Other suitable embodiments of the clamp according to the invention are for instance a clamp with two continuous co-acting clamping surfaces with which a side of the printed circuit board can be wholly clamped. The tensioning force exerted on the printed circuit board is hereby distributed evenly over the printed circuit board. In a further suitable embodiment of the device according to the invention a clamp comprises at least two pairs of clamping surfaces situated at a mutual distance from each other, wherein the clamping surface clamps the printed circuit board at a number of locations situated at regular mutual distances. The expansion of the printed circuit board is herein partly absorbed in the regions between the different paired clamping surfaces.
The clamping surfaces can be flat but may also have another shape, such as for instance wave-shaped, whereby the expansion of the printed circuit board can also be absorbed in suitable manner.
The invention further relates to a method for treating printed circuit boards, comprising of clamping the printed circuit board on one side, immersing the printed circuit board in a solder vessel and blowing off excess solder, wherein the printed circuit board is moreover clamped on the opposite side.
The present invention is further elucidated with reference to the annexed, non-limiting, figures, in which
Figure 1 shows a perspective view of an essential part of an embodiment of the device according to the invention; and
Figures 2 and 3 show specific embodiments of clamps according to the invention.
Figure 1 shows an essential part of a preferred embodiment of the device for treating printed circuit boards according to the invention. Device 1 herein comprises a frame 2, a solder vessel (not shown) for liquid solder 3 arranged on the frame, blowing means 4 for blowing off excess solder, and clamping means 5A, 5B mounted movably on the frame. Clamping means 5A, 5B comprise two opposing clamps 5A, 5B for clamping printed circuit board 6, wherein the clamps are mounted on an auxiliary frame 7 and form a top clamp 5A and a bottom clamp 5B. The clamps could however also comprise two side clamps. The distance 8 between top clamp 5A and bottom clamp 5B can be adjusted to the size of the printed circuit board 6 for treating with adjusting means comprising telescopic tubes 9. Small as well as large printed circuit boards can thus be treated in simple manner with the device according to the invention. Guiding means 10 and moving means 11 are further arranged to enable movement of clamps 5A, 5B mounted on auxiliary frame 7 into and out of the liquid solder. Guiding means 10 comprise a U-profile 12 which is mounted on frame 2 and in which auxiliary frame 7 is moved via guide carriages 13 using moving means 11 fixed to a cross beam 14 of the auxiliary frame, a piston rod of which moving means is shown. Along the path of movement of clamps 5A, 5B two opposing air knives 4 are arranged for blowing off excess solder. Guiding means 10 extend into the liquid solder 3 and bottom clamp 5B is also situated in liquid solder 3. Further arranged on auxiliary frame 7 are tensioning means comprising two cylinders 15, in addition to schematically designated control means 16 for feeding and draining fluid to and from cylinders 15. When a printed circuit board 6 is immersed in the liquid solder 3 it will expand and become longer under the influence of the high temperature. In order to hold printed circuit board 6 tensioned, fluid is guided into the cylinder under pressure using control means 16, which are for instance computer-controlled, whereby the tensioning force on printed circuit board 6 is adjusted. When printed circuit board 6 is taken out of liquid solder 3, the tensioning force on the printed circuit board can be reduced by guiding fluid out of the cylinder. Printed circuit board 6, and in particular the thin flexible printed circuit boards, is thus prevented from cracking through contraction as a result of cooling. Bottom clamp 5B comprises two continuous co-acting clamping surfaces 17 which are urged toward each other using springs 18. When the clamp is situated in the high position, wherein printed circuit board 6 is therefore out of the solder vessel, bottom clamp 5B engages round a protrusion 19 arranged on the frame. Recesses 20 are arranged for this purpose in clamping surfaces 17 on both sides of bottom clamp 5B, such that bottom clamp 5B can engage round protrusion 18. Protrusion 19 can be rotated using operating means 21, so that the co-acting clamping surfaces 17 of clamp 5B are moved apart and printed circuit board 6 can be fixed or removed. Both the protrusion 19 and the operating means 21 for the protrusion are situated outside the solder vessel, i.e. above the level of liquid solder 3. In this manner the sensitive components of the device according to the invention are prevented from being exposed to the extreme conditions in liquid solder 3. Top clamp 5A can be the same as bottom clamp 5B, but may also be another suitable clamp. Clamps 5A, 5B comprise two continuous co-acting clamping surfaces 17, with which printed circuit board 6 is wholly clamped on both the upper side 6A and underside 6B and thus held under uniform tension. The method as according to the invention is as follows: The distance 8 between clamps 5A, 5B is adjusted to the size of printed circuit board 6 using adjusting means 9 mounted on auxiliary frame 7. Printed circuit board 6 is fixed in the clamps 5A, 5B mounted on auxiliary frame 7. Tensioning means 15 are activated whereby printed circuit board 6 is held tensioned between the clamps. The printed circuit board fixed in the clamps is guided along guiding means 10 into liquid solder 3 by means of the moving means 11 mounted on auxiliary frame 7. After a few seconds the board is moved out of the solder again and guided along blowing means 4 wherein the excess solder is blown off and fed back to the solder vessel. The treated printed circuit board can then be removed by urging apart the clamping surfaces 17 with the operating means arranged for this purpose. A subsequent printed circuit board can then be treated in a following cycle. Figure 2 shows a further suitable embodiment of a clamp according to the invention. Clamp 5 herein comprises six pairs (A-F) of co-acting clamping surfaces 17 situated at a regular mutual distance.
In figure 3 is shown another preferred embodiment of a clamp according to the invention wherein the co-acting clamping surfaces 17 are wave-shaped.
The figures show only several embodiments of the device according to the invention. Other embodiments are of course possible within the scope of the appended claims .
*****

Claims

1. Device for treating printed circuit boards, comprising a frame, a solder vessel for liquid solder arranged on the frame, blowing means for blowing off excess solder, clamping means mounted movably on the frame which comprise at least one clamp for clamping a side of a printed circuit board, and guiding and moving means for guiding and moving the clamping means in a path of movement between a low position, in which the clamped printed circuit board is situated in the solder vessel, and a high position in which it is situated outside the vessel, and wherein the blowing means are arranged along the path of movement, characterized in that the clamping means comprise a second clamp lying opposite the first clamp for clamping an opposite side of the printed circuit board, and the guide means extend into the solder vessel, wherein at least one of the clamps is situated at least in the low position in the solder vessel.
2. Device as claimed in claim 1, characterized in that this further comprises a movable auxiliary frame on which the first and second clamp are mounted.
3. Device as claimed in claim 2, characterized in that adjusting means are arranged on the auxiliary frame for adjusting the distance between the clamps.
4. Device as claimed in claim 2 or 3 , characterized in that this further comprises tensioning means arranged on the auxiliary frame for urging the clamps apart.
5. Device as claimed in claim 4, characterized in that the tensioning means comprise at least one cylinder and control means for feeding and draining fluid under pressure to and from the cylinder.
6. Device as claimed in any of the foregoing claims, characterized in that at least one clamp comprises two co-acting clamping surfaces which are urged toward each other in spring-loaded manner and which in the high position engage round a protrusion arranged at a fixed position on the frame, wherein the protrusion is situated above the solder vessel and wherein means are further arranged for rotating the protrusion for the purpose of moving apart the clamping surfaces .
7. Device as claimed in any of the foregoing claims, characterized in that at least one clamp comprises at least two pairs of co-acting clamping surfaces situated at a mutual distance.
8. Device as claimed in any of the foregoing claims, characterized in that at least one clamp comprises at least one wave-shaped clamping surface.
9. Method for treating printed circuit boards with the device as claimed in any of the claims 1-10, comprising of clamping the printed circuit board on one side, immersing the printed circuit board in a solder vessel and blowing off excess solder, characterized in that the printed circuit board is moreover clamped on the opposite side.
*****
PCT/NL1999/000602 1998-09-29 1999-09-29 Device for treating printed circuit boards WO2000018534A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU62315/99A AU6231599A (en) 1998-09-29 1999-09-29 Device for treating printed circuit boards

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1010214A NL1010214C2 (en) 1998-09-29 1998-09-29 Device for handling printed circuit boards.
NL1010214 1998-09-29

Publications (1)

Publication Number Publication Date
WO2000018534A1 true WO2000018534A1 (en) 2000-04-06

Family

ID=19767900

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL1999/000602 WO2000018534A1 (en) 1998-09-29 1999-09-29 Device for treating printed circuit boards

Country Status (3)

Country Link
AU (1) AU6231599A (en)
NL (1) NL1010214C2 (en)
WO (1) WO2000018534A1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
EP0047441A1 (en) * 1980-09-09 1982-03-17 Sinter Limited Apparatus for applying solder to printed circuits

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3865298A (en) * 1973-08-14 1975-02-11 Atomic Energy Commission Solder leveling
EP0047441A1 (en) * 1980-09-09 1982-03-17 Sinter Limited Apparatus for applying solder to printed circuits

Also Published As

Publication number Publication date
AU6231599A (en) 2000-04-17
NL1010214C2 (en) 2000-03-30

Similar Documents

Publication Publication Date Title
KR100234635B1 (en) Treating apparatus and treating method
US6634290B1 (en) Mask-printing apparatus and method including inspection of printed material and re-printing step
US4801069A (en) Method and apparatus for solder deposition
JPS648700B2 (en)
SG139505A1 (en) Improved stencil or mask for applying solder to circuit boards and support frame therefor
DE3111809C2 (en) Method and device for machine soldering of workpieces
US3791018A (en) Heating method and apparatus for securing a member to an article
US4909429A (en) Method and apparatus for solder deposition
US20010020637A1 (en) Automatic wave soldering apparatus and method
US20090224028A1 (en) Selective soldering apparatus with jet wave solder jet and nitrogen preheat
US5104689A (en) Method and apparatus for automated solder deposition at multiple sites
US20110139855A1 (en) Residual oxygen measurement and control in wave soldering process
US5678752A (en) Wave soldering process
WO2000018534A1 (en) Device for treating printed circuit boards
KR101297116B1 (en) Device and method for processing flat substrates, as for printing circuit boards or the like
KR920010190B1 (en) Apparatus and method of solder coating integrated circuit leads
US4802276A (en) Apparatus for printed wiring board component assembly
US5740954A (en) Apparatus for attaching/detaching a land grid array component to a circuit board
US20060054657A1 (en) Method and apparatus for de-soldering integrated circuit devices
EP1076237A2 (en) Method and apparatus for obtaining three-dimensional data
JPS6315746B2 (en)
KR20210143958A (en) Apparatus For Processing Plate
GB2063414A (en) Cleaning of Printed Circuit Boards
JPS6316907B2 (en)
KR100238532B1 (en) Flux apparatus for semiconductor fabrication

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A1

Designated state(s): AE AL AM AT AU AZ BA BB BG BR BY CA CH CN CR CU CZ DE DK DM EE ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KP KR KZ LC LK LR LS LT LU LV MD MG MK MN MW MX NO NZ PL PT RO RU SD SE SG SI SK SL TJ TM TR TT TZ UA UG US UZ VN YU ZA ZW

AL Designated countries for regional patents

Kind code of ref document: A1

Designated state(s): GH GM KE LS MW SD SL SZ TZ UG ZW AM AZ BY KG KZ MD RU TJ TM AT BE CH CY DE DK ES FI FR GB GR IE IT LU MC NL PT SE BF BJ CF CG CI CM GA GN GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
REG Reference to national code

Ref country code: DE

Ref legal event code: 8642

122 Ep: pct application non-entry in european phase