AU5545794A - Flash memory system, and methods of constructing and utilizing same - Google Patents
Flash memory system, and methods of constructing and utilizing sameInfo
- Publication number
- AU5545794A AU5545794A AU55457/94A AU5545794A AU5545794A AU 5545794 A AU5545794 A AU 5545794A AU 55457/94 A AU55457/94 A AU 55457/94A AU 5545794 A AU5545794 A AU 5545794A AU 5545794 A AU5545794 A AU 5545794A
- Authority
- AU
- Australia
- Prior art keywords
- constructing
- methods
- flash memory
- memory system
- utilizing same
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/04—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS
- G11C16/0466—Erasable programmable read-only memories electrically programmable using variable threshold transistors, e.g. FAMOS comprising cells with charge storage in an insulating layer, e.g. metal-nitride-oxide-silicon [MNOS], silicon-oxide-nitride-oxide-silicon [SONOS]
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/10—Programming or data input circuits
- G11C16/14—Circuits for erasing electrically, e.g. erase voltage switching circuits
- G11C16/16—Circuits for erasing electrically, e.g. erase voltage switching circuits for erasing blocks, e.g. arrays, words, groups
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C16/00—Erasable programmable read-only memories
- G11C16/02—Erasable programmable read-only memories electrically programmable
- G11C16/06—Auxiliary circuits, e.g. for writing into memory
- G11C16/26—Sensing or reading circuits; Data output circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02538—Group 13/15 materials
- H01L21/0254—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02551—Group 12/16 materials
- H01L21/02554—Oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/765—Making of isolation regions between components by field effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/792—Field effect transistors with field effect produced by an insulated gate with charge trapping gate insulator, e.g. MNOS-memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B43/00—EEPROM devices comprising charge-trapping gate insulators
- H10B43/30—EEPROM devices comprising charge-trapping gate insulators characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97092192A | 1992-11-02 | 1992-11-02 | |
PCT/US1993/010485 WO1994010686A1 (en) | 1992-11-02 | 1993-11-02 | Flash memory system, and methods of constructing and utilizing same |
US970921 | 1997-11-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5545794A true AU5545794A (en) | 1994-05-24 |
Family
ID=25517709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU55457/94A Abandoned AU5545794A (en) | 1992-11-02 | 1993-11-02 | Flash memory system, and methods of constructing and utilizing same |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0667026A4 (en) |
JP (1) | JPH08507411A (en) |
KR (1) | KR100354406B1 (en) |
AU (1) | AU5545794A (en) |
WO (1) | WO1994010686A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5774400A (en) * | 1995-12-26 | 1998-06-30 | Nvx Corporation | Structure and method to prevent over erasure of nonvolatile memory transistors |
US6900085B2 (en) * | 2001-06-26 | 2005-05-31 | Advanced Micro Devices, Inc. | ESD implant following spacer deposition |
JP2004193178A (en) | 2002-12-06 | 2004-07-08 | Fasl Japan 株式会社 | Semiconductor storage device and its manufacturing method |
US7184315B2 (en) * | 2003-11-04 | 2007-02-27 | Micron Technology, Inc. | NROM flash memory with self-aligned structural charge separation |
TW200812074A (en) | 2006-07-04 | 2008-03-01 | Nxp Bv | Non-volatile memory and-array |
US7710776B2 (en) | 2006-12-27 | 2010-05-04 | Cypress Semiconductor Corporation | Method for on chip sensing of SONOS VT window in non-volatile static random access memory |
JP5493865B2 (en) * | 2007-12-03 | 2014-05-14 | 凸版印刷株式会社 | Semiconductor device |
US7859899B1 (en) | 2008-03-28 | 2010-12-28 | Cypress Semiconductor Corporation | Non-volatile memory and method of operating the same |
US8422317B2 (en) | 2009-11-12 | 2013-04-16 | Em Microelectronic-Marin Sa | Self-powered detection device with a non-volatile memory |
US8422293B2 (en) | 2009-11-12 | 2013-04-16 | Em Microelectronic-Marin Sa | Self-powered event detection device |
US20110110171A1 (en) * | 2009-11-12 | 2011-05-12 | Em Microelectronic-Marin Sa | Powerless external event detection device |
US8411505B2 (en) | 2009-11-12 | 2013-04-02 | Em Microelectronic-Marin Sa | Self-powered detection device with a non-volatile memory |
US9443592B2 (en) * | 2013-07-18 | 2016-09-13 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3992701A (en) * | 1975-04-10 | 1976-11-16 | International Business Machines Corporation | Non-volatile memory cell and array using substrate current |
US4017888A (en) * | 1975-12-31 | 1977-04-12 | International Business Machines Corporation | Non-volatile metal nitride oxide semiconductor device |
US4611308A (en) * | 1978-06-29 | 1986-09-09 | Westinghouse Electric Corp. | Drain triggered N-channel non-volatile memory |
JPS5530846A (en) * | 1978-08-28 | 1980-03-04 | Hitachi Ltd | Method for manufacturing fixed memory |
DE2923995C2 (en) * | 1979-06-13 | 1985-11-07 | Siemens AG, 1000 Berlin und 8000 München | Process for the production of integrated MOS circuits with MOS transistors and MNOS memory transistors in silicon gate technology |
US4769787A (en) * | 1985-07-26 | 1988-09-06 | Hitachi, Ltd. | Semiconductor memory device |
JPH02126498A (en) * | 1988-07-08 | 1990-05-15 | Hitachi Ltd | Nonvolatile semiconductor memory device |
JPH0227594A (en) * | 1988-07-14 | 1990-01-30 | Nec Corp | Nonvolatile random access semiconductor memory |
JPH03219496A (en) * | 1990-01-25 | 1991-09-26 | Hitachi Ltd | Nonvolatile semiconductor memory device |
-
1993
- 1993-11-02 EP EP94900481A patent/EP0667026A4/en not_active Withdrawn
- 1993-11-02 WO PCT/US1993/010485 patent/WO1994010686A1/en not_active Application Discontinuation
- 1993-11-02 AU AU55457/94A patent/AU5545794A/en not_active Abandoned
- 1993-11-02 KR KR1019950701733A patent/KR100354406B1/en not_active IP Right Cessation
- 1993-11-02 JP JP6511377A patent/JPH08507411A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
EP0667026A4 (en) | 1998-10-21 |
KR950704790A (en) | 1995-11-20 |
KR100354406B1 (en) | 2002-12-26 |
JPH08507411A (en) | 1996-08-06 |
EP0667026A1 (en) | 1995-08-16 |
WO1994010686A1 (en) | 1994-05-11 |
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