AU3742997A - Method of making a laminate comprising a conductive polymer composition - Google Patents

Method of making a laminate comprising a conductive polymer composition

Info

Publication number
AU3742997A
AU3742997A AU37429/97A AU3742997A AU3742997A AU 3742997 A AU3742997 A AU 3742997A AU 37429/97 A AU37429/97 A AU 37429/97A AU 3742997 A AU3742997 A AU 3742997A AU 3742997 A AU3742997 A AU 3742997A
Authority
AU
Australia
Prior art keywords
laminate
making
polymer composition
conductive polymer
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU37429/97A
Other languages
English (en)
Inventor
Ann Banich
Daniel A. Chandler
Edward F Chu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raychem Ltd
Original Assignee
Raychem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raychem Corp filed Critical Raychem Corp
Publication of AU3742997A publication Critical patent/AU3742997A/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/15—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state
    • B32B37/153—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer being manufactured and immediately laminated before reaching its stable state, e.g. in which a layer is extruded and laminated while in semi-molten state at least one layer is extruded and immediately laminated while in semi-molten state
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41D—APPARATUS FOR THE MECHANICAL REPRODUCTION OF PRINTING SURFACES FOR STEREOTYPE PRINTING; SHAPING ELASTIC OR DEFORMABLE MATERIAL TO FORM PRINTING SURFACES
    • B41D7/00—Shaping elastic or deformable material, e.g. rubber, plastics material, to form printing surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41K—STAMPS; STAMPING OR NUMBERING APPARATUS OR DEVICES
    • B41K1/00—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor
    • B41K1/02—Portable hand-operated devices without means for supporting or locating the articles to be stamped, i.e. hand stamps; Inking devices or other accessories therefor with one or more flat stamping surfaces having fixed images
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/30—Fillers, e.g. particles, powders, beads, flakes, spheres, chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/704—Crystalline
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Thermistors And Varistors (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
AU37429/97A 1996-08-01 1997-07-30 Method of making a laminate comprising a conductive polymer composition Abandoned AU3742997A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US69175196A 1996-08-01 1996-08-01
US08691751 1996-08-01
PCT/US1997/013419 WO1998005503A1 (en) 1996-08-01 1997-07-30 Method of making a laminate comprising a conductive polymer composition

Publications (1)

Publication Number Publication Date
AU3742997A true AU3742997A (en) 1998-02-25

Family

ID=24777820

Family Applications (1)

Application Number Title Priority Date Filing Date
AU37429/97A Abandoned AU3742997A (en) 1996-08-01 1997-07-30 Method of making a laminate comprising a conductive polymer composition

Country Status (8)

Country Link
EP (1) EP0918638A1 (ja)
JP (1) JP2000515448A (ja)
KR (1) KR20000029763A (ja)
CN (2) CN1090087C (ja)
AU (1) AU3742997A (ja)
CA (1) CA2261895A1 (ja)
TW (1) TW343423B (ja)
WO (1) WO1998005503A1 (ja)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6306323B1 (en) * 1997-07-14 2001-10-23 Tyco Electronics Corporation Extrusion of polymers
US6589299B2 (en) * 2001-02-13 2003-07-08 3M Innovative Properties Company Method for making electrode
KR100378927B1 (ko) * 2001-02-16 2003-04-07 엘지전선 주식회사 과전류 차단용 피티씨 폴리머 퓨즈 제조 방법
KR100381920B1 (ko) * 2001-02-16 2003-04-26 엘지전선 주식회사 라미네이터를 이용한 정온계수 화학 가교 공정
KR100436582B1 (ko) * 2001-11-10 2004-06-19 엘지전선 주식회사 프레스를 이용한 정온계수 조성물의 화학가교 방법
CN102522171A (zh) * 2011-12-31 2012-06-27 上海长园维安电子线路保护股份有限公司 一种圆环ptc的制造方法
US20170004946A1 (en) * 2015-06-30 2017-01-05 Tyco Electronics Corporation Conductive Composite and Circuit Protection Device Including a Conductive Composite
CN106455296A (zh) * 2016-10-17 2017-02-22 上海长园维安电子线路保护有限公司 电路保护组件
US11881337B2 (en) * 2018-11-23 2024-01-23 Littelfuse Electronics (Shanghai) Co., Ltd. PPTC composition and device having low thermal derating and low process jump

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4390489A (en) * 1977-12-19 1983-06-28 Allied Corporation Method of shaping thermoplastic compositions on aluminum foil support
US4237441A (en) * 1978-12-01 1980-12-02 Raychem Corporation Low resistivity PTC compositions
GB2096393B (en) * 1981-04-02 1986-01-02 Raychem Corp Radiation cross-linking of ptc conductive polymers
JPH0690962B2 (ja) * 1986-03-31 1994-11-14 日本メクトロン株式会社 Ｐｔｃ素子の製造法
US5174924A (en) * 1990-06-04 1992-12-29 Fujikura Ltd. Ptc conductive polymer composition containing carbon black having large particle size and high dbp absorption
JPH04247602A (ja) * 1991-02-01 1992-09-03 Fujikura Ltd Ｐｔｃサーミスタの製造方法
GB2301223B (en) * 1995-05-26 1999-04-21 Johnson Electric Sa Polymeric type positive temperature coefficient thermistors
EP0953992A1 (en) * 1995-08-15 1999-11-03 Bourns Multifuse (Hong Kong), Ltd. Surface mount conductive polymer devices and methods for manufacturing such devices

Also Published As

Publication number Publication date
CN1090087C (zh) 2002-09-04
CA2261895A1 (en) 1998-02-12
CN1231635A (zh) 1999-10-13
JP2000515448A (ja) 2000-11-21
KR20000029763A (ko) 2000-05-25
EP0918638A1 (en) 1999-06-02
TW343423B (en) 1998-10-21
WO1998005503A1 (en) 1998-02-12
CN1326197A (zh) 2001-12-12

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