AU3040571A - Novel processes and compositions - Google Patents

Novel processes and compositions

Info

Publication number
AU3040571A
AU3040571A AU30405/71A AU3040571A AU3040571A AU 3040571 A AU3040571 A AU 3040571A AU 30405/71 A AU30405/71 A AU 30405/71A AU 3040571 A AU3040571 A AU 3040571A AU 3040571 A AU3040571 A AU 3040571A
Authority
AU
Australia
Prior art keywords
compositions
novel processes
novel
processes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
AU30405/71A
Other languages
English (en)
Inventor
DONALD ALLAN ARCILESI ARTHUR JAMES TOMSON and SYLVESTER PAUL MALAYIL OTTO KARDOS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M&T Chemicals Inc
Original Assignee
M&T Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M&T Chemicals Inc filed Critical M&T Chemicals Inc
Publication of AU3040571A publication Critical patent/AU3040571A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
AU30405/71A 1970-07-28 1971-06-24 Novel processes and compositions Expired AU3040571A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US5903470A 1970-07-28 1970-07-28
USUS59034 1970-07-28

Publications (1)

Publication Number Publication Date
AU3040571A true AU3040571A (en) 1973-01-04

Family

ID=22020395

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30405/71A Expired AU3040571A (en) 1970-07-28 1971-06-24 Novel processes and compositions

Country Status (7)

Country Link
US (1) US3682788A (enExample)
AU (1) AU3040571A (enExample)
BE (1) BE770346A (enExample)
CA (1) CA1026702A (enExample)
DE (1) DE2134757A1 (enExample)
FR (1) FR2104809B3 (enExample)
NL (1) NL7110413A (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3804729A (en) * 1972-06-19 1974-04-16 M & T Chemicals Inc Electrolyte and process for electro-depositing copper
US3966565A (en) * 1972-12-14 1976-06-29 M & T Chemicals Inc. Electrodeposition of copper
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956078A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3956084A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US3940320A (en) * 1972-12-14 1976-02-24 M & T Chemicals Inc. Electrodeposition of copper
DE2360892A1 (de) * 1972-12-14 1974-06-20 M & T Chemicals Inc Waessriges saures galvanisches kupferbad
US3956120A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
JPS544329B2 (enExample) * 1973-03-20 1979-03-06
NL7415845A (nl) * 1973-12-26 1975-06-30 Upjohn Co Werkwijze voor het bevorderen van de productie van endogene prostaglandinen door zoogdieren, alsmede werkwijze ter bereiding van daarbij te gebruiken preparaten.
US4036710A (en) * 1974-11-21 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4014760A (en) * 1974-11-21 1977-03-29 M & T Chemicals Inc. Electrodeposition of copper
CA1070637A (en) * 1975-09-22 1980-01-29 M And T Chemicals Inc. Electroplating process
US4036711A (en) * 1975-12-18 1977-07-19 M & T Chemicals Inc. Electrodeposition of copper
US4374709A (en) * 1980-05-01 1983-02-22 Occidental Chemical Corporation Process for plating polymeric substrates
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
US4490220A (en) * 1982-09-30 1984-12-25 Learonal, Inc. Electrolytic copper plating solutions
DE3462259D1 (de) * 1983-07-22 1987-03-05 Bayer Ag Substituted furazans
US4781801A (en) * 1987-02-03 1988-11-01 Mcgean-Rohco, Inc. Method of copper plating gravure rolls
US4948474A (en) * 1987-09-18 1990-08-14 Pennsylvania Research Corporation Copper electroplating solutions and methods
US4786746A (en) * 1987-09-18 1988-11-22 Pennsylvania Research Corporation Copper electroplating solutions and methods of making and using them
BR9105776A (pt) * 1990-05-30 1992-08-04 Gould Inc Pelicula de cobre eletrodepositada e processo para produzir pelicula de cobre eletrodepositada
US5403465A (en) * 1990-05-30 1995-04-04 Gould Inc. Electrodeposited copper foil and process for making same using electrolyte solutions having controlled additions of chloride ions and organic additives
EP0469724B1 (en) * 1990-08-03 1995-06-07 Mcgean-Rohco, Inc. Copper plating of gravure rolls
US6544399B1 (en) * 1999-01-11 2003-04-08 Applied Materials, Inc. Electrodeposition chemistry for filling apertures with reflective metal
DE10058896C1 (de) * 2000-10-19 2002-06-13 Atotech Deutschland Gmbh Elektrolytisches Kupferbad, dessen Verwendung und Verfahren zur Abscheidung einer matten Kupferschicht
CA2419595A1 (en) * 2000-10-19 2002-04-25 Atotech Deutschland Gmbh Copper bath and method of depositing a matt copper coating
WO2003012174A1 (en) * 2001-07-27 2003-02-13 Pirelli Pneumatici S.P.A. Electrolytic process for depositing a layer of copper on a steel wire
US6652731B2 (en) * 2001-10-02 2003-11-25 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
US20040074775A1 (en) * 2002-10-21 2004-04-22 Herdman Roderick Dennis Pulse reverse electrolysis of acidic copper electroplating solutions
US6851200B2 (en) * 2003-03-14 2005-02-08 Hopkins Manufacturing Corporation Reflecting lighted level

Also Published As

Publication number Publication date
FR2104809B3 (enExample) 1974-04-05
FR2104809A3 (enExample) 1972-04-21
BE770346A (fr) 1971-12-01
DE2134757A1 (de) 1972-03-30
US3682788A (en) 1972-08-08
NL7110413A (enExample) 1972-02-01
CA1026702A (en) 1978-02-21

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