AU2291100A - Method for the direct electroplating of through-holes in printed circuit boards - Google Patents

Method for the direct electroplating of through-holes in printed circuit boards

Info

Publication number
AU2291100A
AU2291100A AU22911/00A AU2291100A AU2291100A AU 2291100 A AU2291100 A AU 2291100A AU 22911/00 A AU22911/00 A AU 22911/00A AU 2291100 A AU2291100 A AU 2291100A AU 2291100 A AU2291100 A AU 2291100A
Authority
AU
Australia
Prior art keywords
holes
printed circuit
circuit boards
direct electroplating
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU22911/00A
Other languages
English (en)
Inventor
Friedrich Jonas
Stephan Kirchmeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Publication of AU2291100A publication Critical patent/AU2291100A/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
    • H05K3/424—Plated through-holes or plated via connections characterised by electroplating method by direct electroplating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AU22911/00A 1999-01-27 2000-01-14 Method for the direct electroplating of through-holes in printed circuit boards Abandoned AU2291100A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19903108A DE19903108A1 (de) 1999-01-27 1999-01-27 Verfahren zur direkten galvanischen Durchkontaktierung von Leiterplatten
DE19903108 1999-01-27
PCT/EP2000/000256 WO2000045625A2 (fr) 1999-01-27 2000-01-14 Procede de metallisation galvanique directe des trous de cartes de circuits

Publications (1)

Publication Number Publication Date
AU2291100A true AU2291100A (en) 2000-08-18

Family

ID=7895490

Family Applications (1)

Application Number Title Priority Date Filing Date
AU22911/00A Abandoned AU2291100A (en) 1999-01-27 2000-01-14 Method for the direct electroplating of through-holes in printed circuit boards

Country Status (7)

Country Link
EP (1) EP1234487A2 (fr)
JP (1) JP2003505587A (fr)
KR (1) KR20010093279A (fr)
AU (1) AU2291100A (fr)
DE (1) DE19903108A1 (fr)
TW (1) TW488199B (fr)
WO (1) WO2000045625A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100439534B1 (ko) * 2001-03-30 2004-07-09 주식회사 미뉴타텍 전기도금용 레벨링제
DE10124631C1 (de) * 2001-05-18 2002-11-21 Atotech Deutschland Gmbh Verfahren zum direkten elektrolytischen Metallisieren von elektrisch nichtleiteitenden Substratoberflächen
DE10138446A1 (de) * 2001-08-04 2003-02-13 Enthone Omi Deutschland Gmbh Verfahren zur Metallisierung von Kunststoffoberflächen
JP5294255B2 (ja) * 2008-09-12 2013-09-18 国立大学法人東京工業大学 新規化合物及びその製造方法、並びにこれを用いて得られる新規重合体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4202337A1 (de) * 1992-01-29 1993-08-05 Bayer Ag Verfahren zur durchkontaktierung von zweilagigen leiterplatten und multilayern
DE4436391A1 (de) * 1994-10-12 1996-04-18 Bayer Ag Verfahren zur direkten galvanischen Durchkontaktierung von zweilagigen Leiterplatten und Multilayern
DE19527056C1 (de) * 1995-07-25 1996-11-28 Blasberg Oberflaechentech Verfahren zur Herstellung von durchkontaktierten Leiterplatten oder Mehrlagenleiterplatten (Multilayer)

Also Published As

Publication number Publication date
DE19903108A1 (de) 2000-08-03
TW488199B (en) 2002-05-21
EP1234487A2 (fr) 2002-08-28
KR20010093279A (ko) 2001-10-27
WO2000045625A3 (fr) 2002-06-13
WO2000045625A2 (fr) 2000-08-03
JP2003505587A (ja) 2003-02-12

Similar Documents

Publication Publication Date Title
AU1926900A (en) Printed circuit boards with integrated passive components and method for making same
AU2003260274A1 (en) Printed circuit board and method for producing the same
AU2107299A (en) Interconnect assembly for printed circuit boards and method of fabrication
AU6483199A (en) Electronic circuit board
AU5856800A (en) An arrangement for mounting chips in multilayer printed circuit boards
SG65717A1 (en) Printed circuit boards
SG71716A1 (en) Multilayer printed circuit boards
HK1048666A1 (en) Printed circuit boards
AU2283501A (en) Method of manufacture of printed wiring boards and flexible circuitry
AU2074001A (en) Electronics circuit board assembly apparatus and method
GB9928031D0 (en) Printed wiring board
GB0024401D0 (en) Printed circuit board
AU9450298A (en) Printed circuit boards
TW422484U (en) Electronic component supplying apparatus
AU4237197A (en) Pattern plating method for fabricating printed circuit boards
IL133312A0 (en) Method for printed circuit board inspection
GB9820932D0 (en) Circuit board and connection method
AU6310599A (en) Method for coating printed circuit boards or similar substrates
TW389438U (en) Connection apparatus between circuit boards
GB2337862B (en) Printed circuit board
SG91272A1 (en) Printed wiring board
IL122930A (en) Printing and printed circuit board members and methods for producing same
AU2291100A (en) Method for the direct electroplating of through-holes in printed circuit boards
EP1094692A3 (fr) Panneau à circuit imprimé et son procédé de fabrication
SG109405A1 (en) Printed circuit boards with solid interconnect and method of producing the same

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase