AU2003298003A1 - Apparatus and methods for detecting overlay errors using scatterometry - Google Patents

Apparatus and methods for detecting overlay errors using scatterometry

Info

Publication number
AU2003298003A1
AU2003298003A1 AU2003298003A AU2003298003A AU2003298003A1 AU 2003298003 A1 AU2003298003 A1 AU 2003298003A1 AU 2003298003 A AU2003298003 A AU 2003298003A AU 2003298003 A AU2003298003 A AU 2003298003A AU 2003298003 A1 AU2003298003 A1 AU 2003298003A1
Authority
AU
Australia
Prior art keywords
scatterometry
methods
overlay errors
detecting overlay
detecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003298003A
Other languages
English (en)
Inventor
Michael Adel
Noah Bareket
Christopher F. Bevis
Paola Dececco
Thaddeus G. Dziura
Anatoly Fabrikant
John Fielden
Michael Friedmann
Boris Golovanevsky
Ken Gross
Ady Levy
Walter D. Mieher
Ian Smith
Dan Wack
Piotr Zalicki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KLA Tencor Technologies Corp
Original Assignee
KLA Tencor Technologies Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KLA Tencor Technologies Corp filed Critical KLA Tencor Technologies Corp
Publication of AU2003298003A1 publication Critical patent/AU2003298003A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/70633—Overlay, i.e. relative alignment between patterns printed by separate exposures in different layers, or in the same layer in multiple exposures or stitching
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7049—Technique, e.g. interferometric
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
AU2003298003A 2002-12-05 2003-12-05 Apparatus and methods for detecting overlay errors using scatterometry Abandoned AU2003298003A1 (en)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US43131402P 2002-12-05 2002-12-05
US60/431,314 2002-12-05
US44097003P 2003-01-17 2003-01-17
US60/440,970 2003-01-17
US44949603P 2003-02-22 2003-02-22
US60/449,496 2003-02-22
US49852403P 2003-08-27 2003-08-27
US60/498,524 2003-08-27
US50409303P 2003-09-19 2003-09-19
US60/504,093 2003-09-19
PCT/US2003/038784 WO2004053426A1 (en) 2002-12-05 2003-12-05 Apparatus and methods for detecting overlay errors using scatterometry

Publications (1)

Publication Number Publication Date
AU2003298003A1 true AU2003298003A1 (en) 2004-06-30

Family

ID=32512688

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003298003A Abandoned AU2003298003A1 (en) 2002-12-05 2003-12-05 Apparatus and methods for detecting overlay errors using scatterometry

Country Status (4)

Country Link
EP (1) EP1570232B1 (enExample)
JP (1) JP4746987B2 (enExample)
AU (1) AU2003298003A1 (enExample)
WO (1) WO2004053426A1 (enExample)

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US7317531B2 (en) 2002-12-05 2008-01-08 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7541201B2 (en) 2000-08-30 2009-06-02 Kla-Tencor Technologies Corporation Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
US7440105B2 (en) 2002-12-05 2008-10-21 Kla-Tencor Technologies Corporation Continuously varying offset mark and methods of determining overlay
US7019835B2 (en) * 2004-02-19 2006-03-28 Molecular Imprints, Inc. Method and system to measure characteristics of a film disposed on a substrate
US7791727B2 (en) 2004-08-16 2010-09-07 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
US20080144036A1 (en) 2006-12-19 2008-06-19 Asml Netherlands B.V. Method of measurement, an inspection apparatus and a lithographic apparatus
US7532305B2 (en) * 2006-03-28 2009-05-12 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using overlay measurement
US7391513B2 (en) * 2006-03-29 2008-06-24 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method using overlay measurement quality indication
US7616313B2 (en) * 2006-03-31 2009-11-10 Kla-Tencor Technologies Corporation Apparatus and methods for detecting overlay errors using scatterometry
US7898662B2 (en) 2006-06-20 2011-03-01 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
FR2902877B1 (fr) * 2006-06-22 2008-09-12 Centre Nat Rech Scient Procede de caracterisation de l'anisotropie d'un milieu diffusant et dispositif pour la mise en oeuvre d'un tel procede
US7564555B2 (en) * 2006-08-15 2009-07-21 Asml Netherlands B.V. Method and apparatus for angular-resolved spectroscopic lithography characterization
WO2008035685A1 (fr) * 2006-09-19 2008-03-27 Olympus Medical Systems Corporation Dispositif de mesure de polarisation
US7570358B2 (en) * 2007-03-30 2009-08-04 Asml Netherlands Bv Angularly resolved scatterometer, inspection method, lithographic apparatus, lithographic processing cell device manufacturing method and alignment sensor
IL194839A0 (en) * 2007-10-25 2009-08-03 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
WO2010013325A1 (ja) * 2008-07-30 2010-02-04 株式会社ニレコ 分光測光装置
US8329360B2 (en) * 2009-12-04 2012-12-11 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus of providing overlay
US9535338B2 (en) 2012-05-29 2017-01-03 Asml Netherlands B.V. Metrology method and apparatus, substrate, lithographic system and device manufacturing method
JP6102230B2 (ja) * 2012-12-07 2017-03-29 株式会社ニコン 露光装置及び露光方法、並びにデバイス製造方法
TWI479141B (zh) * 2012-12-27 2015-04-01 Metal Ind Res & Dev Ct Ellipsometry and polarization modulation ellipsometry method for the
US9784690B2 (en) * 2014-05-12 2017-10-10 Kla-Tencor Corporation Apparatus, techniques, and target designs for measuring semiconductor parameters
KR102678955B1 (ko) * 2015-05-19 2024-06-26 케이엘에이 코포레이션 오버레이 측정을 위한 지형 위상 제어
US10451412B2 (en) 2016-04-22 2019-10-22 Kla-Tencor Corporation Apparatus and methods for detecting overlay errors using scatterometry
IL273680B2 (en) 2017-10-05 2024-04-01 Asml Netherlands Bv Metrology system and method for determining a characteristic of one or more structures on a substrate
US10801953B2 (en) 2019-01-11 2020-10-13 Kla-Tencor Corporation Semiconductor metrology based on hyperspectral imaging
JP7542561B2 (ja) 2019-06-25 2024-08-30 ケーエルエー コーポレイション 位置ずれの測定およびその改善のための関心領域の選択
CN115428139B (zh) * 2020-04-15 2024-04-12 科磊股份有限公司 可用于测量半导体装置偏移的具有装置级特征的偏移目标
US11454894B2 (en) 2020-09-14 2022-09-27 Kla Corporation Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof
US11378394B1 (en) * 2020-12-11 2022-07-05 Kla Corporation On-the-fly scatterometry overlay metrology target
CN113296365B (zh) * 2020-12-29 2024-04-02 杭州广立微电子股份有限公司 一种测量套刻误差的方法及测试结构
US12131959B2 (en) 2021-04-22 2024-10-29 Kla Corporation Systems and methods for improved metrology for semiconductor device wafers
KR102750985B1 (ko) * 2023-03-29 2025-01-09 (주) 오로스테크놀로지 파장 가변형 광섬유 광원 및 이를 구비한 오버레이 측정 장치

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US4757207A (en) * 1987-03-03 1988-07-12 International Business Machines Corporation Measurement of registration of overlaid test patterns by the use of reflected light
US4999014A (en) 1989-05-04 1991-03-12 Therma-Wave, Inc. Method and apparatus for measuring thickness of thin films
US5856871A (en) 1993-08-18 1999-01-05 Applied Spectral Imaging Ltd. Film thickness mapping using interferometric spectral imaging
US5712707A (en) * 1995-11-20 1998-01-27 International Business Machines Corporation Edge overlay measurement target for sub-0.5 micron ground rules
US6483580B1 (en) 1998-03-06 2002-11-19 Kla-Tencor Technologies Corporation Spectroscopic scatterometer system
US6142629A (en) 1998-08-30 2000-11-07 Applied Spectral Imaging Ltd. Spectral imaging using illumination of preselected spectral content
US6350548B1 (en) * 2000-03-15 2002-02-26 International Business Machines Corporation Nested overlay measurement target
US6503734B1 (en) * 2000-07-26 2003-01-07 Cognis Corporation Cytochrome b5 gene and protein of Candida tropicalis and methods relating thereto
JP5180419B2 (ja) * 2000-08-30 2013-04-10 ケーエルエー−テンカー・コーポレーション 重ね合わせマーク、重ね合わせマークの設計方法および重ね合わせ測定の方法
US6486954B1 (en) * 2000-09-01 2002-11-26 Kla-Tencor Technologies Corporation Overlay alignment measurement mark
IL138552A (en) * 2000-09-19 2006-08-01 Nova Measuring Instr Ltd Lateral shift measurement using an optical technique
US6917433B2 (en) 2000-09-20 2005-07-12 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to an etch process
WO2003020762A1 (en) * 2001-09-03 2003-03-13 Intreat Pty Limited Antibodies to non-functional p2x7receptor, diagnosis and treatment of cancers and other conditions
WO2002065545A2 (en) * 2001-02-12 2002-08-22 Sensys Instruments Corporation Overlay alignment metrology using diffraction gratings
US6699624B2 (en) * 2001-02-27 2004-03-02 Timbre Technologies, Inc. Grating test patterns and methods for overlay metrology
US7804994B2 (en) * 2002-02-15 2010-09-28 Kla-Tencor Technologies Corporation Overlay metrology and control method
US6778275B2 (en) * 2002-02-20 2004-08-17 Micron Technology, Inc. Aberration mark and method for estimating overlay error and optical aberrations
CN1795536A (zh) * 2003-05-28 2006-06-28 株式会社尼康 位置信息测量方法及装置、和曝光方法及装置

Also Published As

Publication number Publication date
EP1570232A4 (en) 2007-08-29
EP1570232A1 (en) 2005-09-07
JP2006509219A (ja) 2006-03-16
EP1570232B1 (en) 2016-11-02
WO2004053426A1 (en) 2004-06-24
JP4746987B2 (ja) 2011-08-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase