AU2003284477A1 - CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER - Google Patents

CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER

Info

Publication number
AU2003284477A1
AU2003284477A1 AU2003284477A AU2003284477A AU2003284477A1 AU 2003284477 A1 AU2003284477 A1 AU 2003284477A1 AU 2003284477 A AU2003284477 A AU 2003284477A AU 2003284477 A AU2003284477 A AU 2003284477A AU 2003284477 A1 AU2003284477 A1 AU 2003284477A1
Authority
AU
Australia
Prior art keywords
conductive
layer
containing layer
conductive sheet
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003284477A
Inventor
Shigeki Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FCM Co Ltd
Original Assignee
FCM Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FCM Co Ltd filed Critical FCM Co Ltd
Publication of AU2003284477A1 publication Critical patent/AU2003284477A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Physical Vapour Deposition (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2003284477A 2002-12-09 2003-11-27 CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER Abandoned AU2003284477A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002356696A JP4072899B2 (en) 2002-12-09 2002-12-09 Conductive sheet
JP2002-356696 2002-12-09
PCT/JP2003/015195 WO2004052642A1 (en) 2002-12-09 2003-11-27 CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER

Publications (1)

Publication Number Publication Date
AU2003284477A1 true AU2003284477A1 (en) 2004-06-30

Family

ID=32500822

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003284477A Abandoned AU2003284477A1 (en) 2002-12-09 2003-11-27 CONDUCTIVE SHEET HAVING CONDUCTIVE LAYER ON Si-CONTAINING LAYER

Country Status (4)

Country Link
JP (1) JP4072899B2 (en)
AU (1) AU2003284477A1 (en)
TW (1) TWI240932B (en)
WO (1) WO2004052642A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019038136A (en) * 2017-08-23 2019-03-14 住友金属鉱山株式会社 Double side metal laminate and production method thereof

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU604254B2 (en) * 1986-09-01 1990-12-13 Kanegafuchi Kagaku Kogyo Kabushiki Kaisha Polyimide film and its manufacturing method
JPS6361030A (en) * 1986-09-01 1988-03-17 Kanegafuchi Chem Ind Co Ltd Polyimide film and production thereof
EP0335565B1 (en) * 1988-03-28 1994-06-15 Hitachi Chemical Co., Ltd. Process for producing printed wiring board
JP3447075B2 (en) * 1993-02-10 2003-09-16 三井化学株式会社 Flexible circuit board
JPH09254303A (en) * 1996-03-22 1997-09-30 Teijin Ltd Transparent electrically conductive film
JPH10192773A (en) * 1997-01-13 1998-07-28 Sumitomo Bakelite Co Ltd Method for drying polyimide film
JPH114055A (en) * 1997-04-18 1999-01-06 Ube Ind Ltd Flexible circuit board
JP3346228B2 (en) * 1997-07-11 2002-11-18 宇部興産株式会社 Aromatic polyimide film, laminate and solar cell
JP2002192646A (en) * 2000-03-14 2002-07-10 Dainippon Printing Co Ltd Gas-barrier film
JP4350263B2 (en) * 2000-04-03 2009-10-21 三菱伸銅株式会社 Metallized polyimide film and method for producing the same
JP2002072177A (en) * 2000-08-25 2002-03-12 Nippon Sheet Glass Co Ltd Substrate with transparent conductive film, its manufacturing method and liquid crystal display element
JP3502846B2 (en) * 2001-03-21 2004-03-02 日本写真印刷株式会社 Decorative sheet, method for producing decorative sheet, and method for producing decorative molded product
JP2002317046A (en) * 2001-04-20 2002-10-31 Kanegafuchi Chem Ind Co Ltd Polyimide film and method for producing the film, and laminate and multi-layered printed circuit board using the film

Also Published As

Publication number Publication date
JP4072899B2 (en) 2008-04-09
JP2004188654A (en) 2004-07-08
TWI240932B (en) 2005-10-01
TW200414233A (en) 2004-08-01
WO2004052642A1 (en) 2004-06-24

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase