AU2001247438A1 - Thermally conductive sheet - Google Patents

Thermally conductive sheet

Info

Publication number
AU2001247438A1
AU2001247438A1 AU2001247438A AU4743801A AU2001247438A1 AU 2001247438 A1 AU2001247438 A1 AU 2001247438A1 AU 2001247438 A AU2001247438 A AU 2001247438A AU 4743801 A AU4743801 A AU 4743801A AU 2001247438 A1 AU2001247438 A1 AU 2001247438A1
Authority
AU
Australia
Prior art keywords
thermally conductive
conductive sheet
sheet
thermally
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001247438A
Inventor
Mitsuhiko Okada
Tomoaki Uchiya
Yoshinao Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001247438A1 publication Critical patent/AU2001247438A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AU2001247438A 2000-04-10 2001-03-15 Thermally conductive sheet Abandoned AU2001247438A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-113260 2000-04-10
JP2000113260A JP2001291807A (en) 2000-04-10 2000-04-10 Thermo-conductive sheet
PCT/US2001/008231 WO2001076855A1 (en) 2000-04-10 2001-03-15 Thermally conductive sheet

Publications (1)

Publication Number Publication Date
AU2001247438A1 true AU2001247438A1 (en) 2001-10-23

Family

ID=18625258

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001247438A Abandoned AU2001247438A1 (en) 2000-04-10 2001-03-15 Thermally conductive sheet

Country Status (4)

Country Link
EP (1) EP1274561A1 (en)
JP (1) JP2001291807A (en)
AU (1) AU2001247438A1 (en)
WO (1) WO2001076855A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4889190B2 (en) * 2003-04-16 2012-03-07 スリーエム イノベイティブ プロパティズ カンパニー Acrylic heat conductive composition and heat conductive sheet
US7229683B2 (en) 2003-05-30 2007-06-12 3M Innovative Properties Company Thermal interface materials and method of making thermal interface materials
US7744991B2 (en) 2003-05-30 2010-06-29 3M Innovative Properties Company Thermally conducting foam interface materials
US8581393B2 (en) * 2006-09-21 2013-11-12 3M Innovative Properties Company Thermally conductive LED assembly
JP5035884B2 (en) * 2007-03-27 2012-09-26 東京エレクトロン株式会社 Thermal conductive sheet and substrate mounting apparatus using the same
US8076773B2 (en) * 2007-12-26 2011-12-13 The Bergquist Company Thermal interface with non-tacky surface
JP5245673B2 (en) * 2008-09-19 2013-07-24 信越化学工業株式会社 High heat conductive heat fixing roll or heat fixing belt
FR2993894B1 (en) * 2012-07-25 2014-08-01 Hutchinson RUBBER COMPOSITION BASED ON SILICONE ELASTOMER AND MCP, PREPARATION METHOD THEREOF, FLEXIBLE ELEMENT, AND THERMAL CONTROL / REGULATION SYSTEM INCORPORATING SAME.
JP2014187233A (en) * 2013-03-25 2014-10-02 Panasonic Corp Heat radiation sheet and heat radiation structure using the same
WO2016042739A1 (en) 2014-09-17 2016-03-24 パナソニックＩｐマネジメント株式会社 Heat dissipating sheet and heat dissipating structure using same
JP6436035B2 (en) 2015-09-25 2018-12-12 信越化学工業株式会社 Thermally softening thermally conductive silicone grease composition, thermal conductive film forming method, heat dissipation structure and power module device
JP2018078272A (en) * 2016-10-31 2018-05-17 スリーエム イノベイティブ プロパティズ カンパニー Three-dimensionally shaped thermally conductive molded body, and manufacturing method thereof
CN111040310A (en) * 2018-10-15 2020-04-21 伊利诺斯工具制品有限公司 Heat-conducting insulating sheet and preparation method thereof
CN116075547B (en) 2020-09-30 2024-04-09 积水保力马科技株式会社 Thermally conductive sheet, method for mounting the same, and method for manufacturing the same
JP2023047991A (en) 2021-09-27 2023-04-06 信越化学工業株式会社 thermally conductive film

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4823064A (en) * 1987-05-07 1989-04-18 Gte Products Corporation Quick reset motor starting device
AU723258B2 (en) * 1996-04-29 2000-08-24 Parker-Hannifin Corporation Conformal thermal interface material for electronic components
US6391442B1 (en) * 1999-07-08 2002-05-21 Saint-Gobain Performance Plastics Corporation Phase change thermal interface material

Also Published As

Publication number Publication date
EP1274561A1 (en) 2003-01-15
WO2001076855A1 (en) 2001-10-18
JP2001291807A (en) 2001-10-19

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