AU2003283428A1 - Method for chemical vapour deposition (cvd) of zrbless thansbgreater thanxless than/sbgreater thancless thansbgreater thanyless than/sbgreater thannless thansbgreater thanz less than/sbgreater than(or x+y+z=1) layers and a cutting tool coated with said layer - Google Patents

Method for chemical vapour deposition (cvd) of zrbless thansbgreater thanxless than/sbgreater thancless thansbgreater thanyless than/sbgreater thannless thansbgreater thanz less than/sbgreater than(or x+y+z=1) layers and a cutting tool coated with said layer

Info

Publication number
AU2003283428A1
AU2003283428A1 AU2003283428A AU2003283428A AU2003283428A1 AU 2003283428 A1 AU2003283428 A1 AU 2003283428A1 AU 2003283428 A AU2003283428 A AU 2003283428A AU 2003283428 A AU2003283428 A AU 2003283428A AU 2003283428 A1 AU2003283428 A1 AU 2003283428A1
Authority
AU
Australia
Prior art keywords
thansbgreater
sbgreater
layers
layer
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003283428A
Inventor
Helga Holzschuh
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Walter AG
Original Assignee
Walter AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Walter AG filed Critical Walter AG
Publication of AU2003283428A1 publication Critical patent/AU2003283428A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/006Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterized by the colour of the layer
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C30/00Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process
    • C23C30/005Coating with metallic material characterised only by the composition of the metallic material, i.e. not characterised by the coating process on hard metal substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Cutting Tools, Boring Holders, And Turrets (AREA)
  • Photoreceptors In Electrophotography (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

According to the invention, in order to form a ZRBXCYNZ (OR X+Y+Z=1) layer, wherein x+y+z=1 and x=0.001 to 0.05, y= 0 to 0.95 and z=0 to 0.95, by chemical vapour deposition a processing gas is used in which a Zr halide content is higher than 5 % volume and a boron halide content is less than 5 % volume. The thus produced layers can be used as anti-wearing protection and as decorative layers.
AU2003283428A 2002-12-13 2003-11-26 Method for chemical vapour deposition (cvd) of zrbless thansbgreater thanxless than/sbgreater thancless thansbgreater thanyless than/sbgreater thannless thansbgreater thanz less than/sbgreater than(or x+y+z=1) layers and a cutting tool coated with said layer Abandoned AU2003283428A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10258282A DE10258282A1 (en) 2002-12-13 2002-12-13 CVD coating process for ZrBx CyNz layers (x + y + z = 1) and coated cutting tool
DE10258282.3 2002-12-13
PCT/EP2003/013289 WO2004055235A1 (en) 2002-12-13 2003-11-26 Method for chemical vapour deposition (cvd) of zrbxcynz (or x+y+z=1) layers and a cutting tool coated with said layer

Publications (1)

Publication Number Publication Date
AU2003283428A1 true AU2003283428A1 (en) 2004-07-09

Family

ID=32477611

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003283428A Abandoned AU2003283428A1 (en) 2002-12-13 2003-11-26 Method for chemical vapour deposition (cvd) of zrbless thansbgreater thanxless than/sbgreater thancless thansbgreater thanyless than/sbgreater thannless thansbgreater thanz less than/sbgreater than(or x+y+z=1) layers and a cutting tool coated with said layer

Country Status (6)

Country Link
EP (1) EP1570105B1 (en)
AT (1) ATE331054T1 (en)
AU (1) AU2003283428A1 (en)
DE (2) DE10258282A1 (en)
ES (1) ES2268449T3 (en)
WO (1) WO2004055235A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005049393B4 (en) * 2005-10-15 2019-08-08 Kennametal Widia Produktions Gmbh & Co. Kg Method for producing a coated substrate body, substrate body with a coating and use of the coated substrate body
JP4753249B2 (en) * 2006-01-13 2011-08-24 株式会社神戸製鋼所 Mold for glass molding
JP2008211079A (en) * 2007-02-27 2008-09-11 Ulvac Japan Ltd Barrier film and forming method thereof, and multilayer interconnection structure and manufacturing method thereof
WO2008105360A1 (en) 2007-02-27 2008-09-04 Ulvac, Inc. Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
JP2008211090A (en) * 2007-02-27 2008-09-11 Ulvac Japan Ltd Method and apparatus for manufacturing semiconductor device
DE102007058564A1 (en) * 2007-11-30 2009-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Smooth wear-protection coating for metal or ceramic components or tools, deposits layers of alternating structure to limit growth of defects and prevent unacceptable surface roughness
CN116162917B (en) * 2023-04-26 2023-07-14 赣州澳克泰工具技术有限公司 Multilayer coating cutter and preparation method thereof

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4239536A (en) * 1977-09-09 1980-12-16 Sumitomo Electric Industries, Ltd. Surface-coated sintered hard body
JPS5948864B2 (en) * 1978-07-05 1984-11-29 住友電気工業株式会社 Manufacturing method for coated cemented carbide parts
SE8205274L (en) * 1982-09-15 1984-03-16 Santrade Ltd HAPPENS AND METHOD FOR MANUFACTURING THE SAME
FR2612946B1 (en) * 1987-03-27 1993-02-19 Chimie Metal PROCESS AND PLANT FOR CHEMICAL DEPOSITION OF MODERATE TEMPERATURE ULTRADOR COATINGS
AT387988B (en) * 1987-08-31 1989-04-10 Plansee Tizit Gmbh METHOD FOR PRODUCING MULTI-LAYER COATED HARD METAL PARTS
JP3424263B2 (en) * 1993-05-27 2003-07-07 住友電気工業株式会社 Coated hard alloy members
JPH10176289A (en) * 1996-12-10 1998-06-30 Balzers Ag Coated hard alloy
JP3231006B2 (en) * 1997-08-28 2001-11-19 株式会社シマノ Gear change control device for bicycle
US6492011B1 (en) * 1998-09-02 2002-12-10 Unaxis Trading Ag Wear-resistant workpiece and method for producing same
DE29818029U1 (en) * 1998-10-09 1999-03-25 Balzers Prozess Systeme Vertri Wear-resistant workpiece

Also Published As

Publication number Publication date
WO2004055235A1 (en) 2004-07-01
DE50303995D1 (en) 2006-08-03
ES2268449T3 (en) 2007-03-16
EP1570105B1 (en) 2006-06-21
EP1570105A1 (en) 2005-09-07
ATE331054T1 (en) 2006-07-15
DE10258282A1 (en) 2004-07-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase