AU2003279079A1 - Low stress semiconductor die attach - Google Patents

Low stress semiconductor die attach

Info

Publication number
AU2003279079A1
AU2003279079A1 AU2003279079A AU2003279079A AU2003279079A1 AU 2003279079 A1 AU2003279079 A1 AU 2003279079A1 AU 2003279079 A AU2003279079 A AU 2003279079A AU 2003279079 A AU2003279079 A AU 2003279079A AU 2003279079 A1 AU2003279079 A1 AU 2003279079A1
Authority
AU
Australia
Prior art keywords
semiconductor die
die attach
low stress
stress semiconductor
low
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003279079A
Other languages
English (en)
Inventor
Brian W. Condie
David J. Dougherty
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NXP USA Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of AU2003279079A1 publication Critical patent/AU2003279079A1/en
Abandoned legal-status Critical Current

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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
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    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
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    • H01L2924/013—Alloys
    • H01L2924/0133—Ternary Alloys
    • H—ELECTRICITY
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    • H01L2924/013—Alloys
    • H01L2924/0134—Quaternary Alloys
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/1026—Compound semiconductors
    • H01L2924/1032—III-V
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2924/15738—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950 C and less than 1550 C
    • H01L2924/15747—Copper [Cu] as principal constituent
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Die Bonding (AREA)
AU2003279079A 2002-12-30 2003-09-30 Low stress semiconductor die attach Abandoned AU2003279079A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/334,042 2002-12-30
US10/334,042 US7042103B2 (en) 2002-12-30 2002-12-30 Low stress semiconductor die attach
PCT/US2003/030862 WO2004061936A1 (en) 2002-12-30 2003-09-30 Low stress semiconductor die attach

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AU2003279079A1 true AU2003279079A1 (en) 2004-07-29

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AU2003279079A Abandoned AU2003279079A1 (en) 2002-12-30 2003-09-30 Low stress semiconductor die attach

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US (1) US7042103B2 (enExample)
JP (1) JP4436765B2 (enExample)
KR (1) KR20050094820A (enExample)
AU (1) AU2003279079A1 (enExample)
WO (1) WO2004061936A1 (enExample)

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WO2008132559A1 (en) * 2007-04-27 2008-11-06 Freescale Semiconductor, Inc. Semiconductor wafer processing
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US8718720B1 (en) * 2010-07-30 2014-05-06 Triquint Semiconductor, Inc. Die including a groove extending from a via to an edge of the die
CN102255033B (zh) * 2011-07-14 2013-04-10 佛山市蓝箭电子股份有限公司 一种大功率led封装结构及其封装方法
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US8962389B2 (en) 2013-05-30 2015-02-24 Freescale Semiconductor, Inc. Microelectronic packages including patterned die attach material and methods for the fabrication thereof
US9171786B1 (en) 2014-07-02 2015-10-27 Freescale Semiconductor, Inc. Integrated circuit with recess for die attachment
JP6430422B2 (ja) * 2016-02-29 2018-11-28 株式会社東芝 半導体装置
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KR20050094820A (ko) 2005-09-28
US7042103B2 (en) 2006-05-09
JP4436765B2 (ja) 2010-03-24
US20040124543A1 (en) 2004-07-01
JP2006512765A (ja) 2006-04-13

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