AU2003272215B2 - Method for microfabricating structures using silicon-on-insulator material - Google Patents

Method for microfabricating structures using silicon-on-insulator material Download PDF

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Publication number
AU2003272215B2
AU2003272215B2 AU2003272215A AU2003272215A AU2003272215B2 AU 2003272215 B2 AU2003272215 B2 AU 2003272215B2 AU 2003272215 A AU2003272215 A AU 2003272215A AU 2003272215 A AU2003272215 A AU 2003272215A AU 2003272215 B2 AU2003272215 B2 AU 2003272215B2
Authority
AU
Australia
Prior art keywords
layer
substrate
soi wafer
etch
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2003272215A
Other languages
English (en)
Other versions
AU2003272215A1 (en
Inventor
Jeffrey T. Borenstein
William D. Sawyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Charles Stark Draper Laboratory Inc
Original Assignee
Charles Stark Draper Laboratory Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Charles Stark Draper Laboratory Inc filed Critical Charles Stark Draper Laboratory Inc
Publication of AU2003272215A1 publication Critical patent/AU2003272215A1/en
Application granted granted Critical
Publication of AU2003272215B2 publication Critical patent/AU2003272215B2/en
Priority to AU2009248425A priority Critical patent/AU2009248425B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00563—Avoid or control over-etching
    • B81C1/00579—Avoid charge built-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
AU2003272215A 2002-08-15 2003-08-15 Method for microfabricating structures using silicon-on-insulator material Ceased AU2003272215B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2009248425A AU2009248425B2 (en) 2002-08-15 2009-12-10 Method for microfabricating structures using silicon-on-insulator material

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US40379602P 2002-08-15 2002-08-15
US60/403,796 2002-08-15
PCT/US2003/025435 WO2004017371A2 (fr) 2002-08-15 2003-08-15 Procede de microusinage de structures utilisant un materiau de silicium sur isolant

Related Child Applications (1)

Application Number Title Priority Date Filing Date
AU2009248425A Division AU2009248425B2 (en) 2002-08-15 2009-12-10 Method for microfabricating structures using silicon-on-insulator material

Publications (2)

Publication Number Publication Date
AU2003272215A1 AU2003272215A1 (en) 2004-03-03
AU2003272215B2 true AU2003272215B2 (en) 2009-09-10

Family

ID=31888282

Family Applications (2)

Application Number Title Priority Date Filing Date
AU2003272215A Ceased AU2003272215B2 (en) 2002-08-15 2003-08-15 Method for microfabricating structures using silicon-on-insulator material
AU2009248425A Ceased AU2009248425B2 (en) 2002-08-15 2009-12-10 Method for microfabricating structures using silicon-on-insulator material

Family Applications After (1)

Application Number Title Priority Date Filing Date
AU2009248425A Ceased AU2009248425B2 (en) 2002-08-15 2009-12-10 Method for microfabricating structures using silicon-on-insulator material

Country Status (3)

Country Link
EP (1) EP1576650A4 (fr)
AU (2) AU2003272215B2 (fr)
WO (1) WO2004017371A2 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7381630B2 (en) * 2001-01-02 2008-06-03 The Charles Stark Draper Laboratory, Inc. Method for integrating MEMS device and interposer
US7253083B2 (en) * 2005-06-17 2007-08-07 Northrop Grumman Corporation Method of thinning a semiconductor structure
US8735199B2 (en) * 2012-08-22 2014-05-27 Honeywell International Inc. Methods for fabricating MEMS structures by etching sacrificial features embedded in glass
DE102018200371A1 (de) 2018-01-11 2019-07-11 Robert Bosch Gmbh Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760443A (en) * 1993-10-18 1998-06-02 Regents Of The University Of California Silicon on insulator with active buried regions
US6002507A (en) * 1998-12-01 1999-12-14 Xerox Corpoation Method and apparatus for an integrated laser beam scanner
US6077721A (en) * 1995-06-29 2000-06-20 Nippondenso Co., Ltd. Method of producing an anodic bonded semiconductor sensor element
US6277666B1 (en) * 1999-06-24 2001-08-21 Honeywell Inc. Precisely defined microelectromechanical structures and associated fabrication methods
US6291875B1 (en) * 1998-06-24 2001-09-18 Analog Devices Imi, Inc. Microfabricated structures with electrical isolation and interconnections
US6431714B1 (en) * 2000-10-10 2002-08-13 Nippon Telegraph And Telephone Corporation Micro-mirror apparatus and production method therefor
US6458615B1 (en) * 1999-09-30 2002-10-01 Carnegie Mellon University Method of fabricating micromachined structures and devices formed therefrom

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6105427A (en) 1998-07-31 2000-08-22 Litton Systems, Inc. Micro-mechanical semiconductor accelerometer
US6433401B1 (en) * 1999-04-06 2002-08-13 Analog Devices Imi, Inc. Microfabricated structures with trench-isolation using bonded-substrates and cavities
EP1364398A4 (fr) 2001-01-02 2011-11-30 Draper Lab Charles S Procede de microusinage de structures utilisant un materiau de silicium sur isolant

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5760443A (en) * 1993-10-18 1998-06-02 Regents Of The University Of California Silicon on insulator with active buried regions
US6077721A (en) * 1995-06-29 2000-06-20 Nippondenso Co., Ltd. Method of producing an anodic bonded semiconductor sensor element
US6291875B1 (en) * 1998-06-24 2001-09-18 Analog Devices Imi, Inc. Microfabricated structures with electrical isolation and interconnections
US6002507A (en) * 1998-12-01 1999-12-14 Xerox Corpoation Method and apparatus for an integrated laser beam scanner
US6277666B1 (en) * 1999-06-24 2001-08-21 Honeywell Inc. Precisely defined microelectromechanical structures and associated fabrication methods
US6458615B1 (en) * 1999-09-30 2002-10-01 Carnegie Mellon University Method of fabricating micromachined structures and devices formed therefrom
US6431714B1 (en) * 2000-10-10 2002-08-13 Nippon Telegraph And Telephone Corporation Micro-mirror apparatus and production method therefor

Also Published As

Publication number Publication date
EP1576650A2 (fr) 2005-09-21
WO2004017371A3 (fr) 2005-08-18
EP1576650A3 (fr) 2005-10-05
WO2004017371A9 (fr) 2004-07-08
WO2004017371A2 (fr) 2004-02-26
AU2009248425B2 (en) 2012-12-20
AU2009248425A1 (en) 2010-01-07
AU2003272215A1 (en) 2004-03-03
EP1576650A4 (fr) 2011-06-15

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FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired