WO2004017371A3 - Procede de microusinage de structures utilisant un materiau de silicium sur isolant - Google Patents
Procede de microusinage de structures utilisant un materiau de silicium sur isolant Download PDFInfo
- Publication number
- WO2004017371A3 WO2004017371A3 PCT/US2003/025435 US0325435W WO2004017371A3 WO 2004017371 A3 WO2004017371 A3 WO 2004017371A3 US 0325435 W US0325435 W US 0325435W WO 2004017371 A3 WO2004017371 A3 WO 2004017371A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- soi wafer
- layer
- silicon
- microfabricating
- structures
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
- B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
- B81C1/00563—Avoid or control over-etching
- B81C1/00579—Avoid charge built-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C3/00—Assembling of devices or systems from individually processed components
- B81C3/001—Bonding of two components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Manufacturing & Machinery (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Abstract
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03754388A EP1576650A4 (fr) | 2002-08-15 | 2003-08-15 | Procede de microusinage de structures utilisant un materiau de silicium sur isolant |
AU2003272215A AU2003272215B2 (en) | 2002-08-15 | 2003-08-15 | Method for microfabricating structures using silicon-on-insulator material |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US40379602P | 2002-08-15 | 2002-08-15 | |
US60/403,796 | 2002-08-15 |
Publications (3)
Publication Number | Publication Date |
---|---|
WO2004017371A2 WO2004017371A2 (fr) | 2004-02-26 |
WO2004017371A9 WO2004017371A9 (fr) | 2004-07-08 |
WO2004017371A3 true WO2004017371A3 (fr) | 2005-08-18 |
Family
ID=31888282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2003/025435 WO2004017371A2 (fr) | 2002-08-15 | 2003-08-15 | Procede de microusinage de structures utilisant un materiau de silicium sur isolant |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP1576650A4 (fr) |
AU (2) | AU2003272215B2 (fr) |
WO (1) | WO2004017371A2 (fr) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7381630B2 (en) * | 2001-01-02 | 2008-06-03 | The Charles Stark Draper Laboratory, Inc. | Method for integrating MEMS device and interposer |
US7253083B2 (en) | 2005-06-17 | 2007-08-07 | Northrop Grumman Corporation | Method of thinning a semiconductor structure |
US8735199B2 (en) * | 2012-08-22 | 2014-05-27 | Honeywell International Inc. | Methods for fabricating MEMS structures by etching sacrificial features embedded in glass |
DE102018200371A1 (de) | 2018-01-11 | 2019-07-11 | Robert Bosch Gmbh | Interposersubstrat, MEMS-Vorrichtung sowie entsprechendes Herstellungsverfahren |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5760443A (en) * | 1993-10-18 | 1998-06-02 | Regents Of The University Of California | Silicon on insulator with active buried regions |
US6077721A (en) * | 1995-06-29 | 2000-06-20 | Nippondenso Co., Ltd. | Method of producing an anodic bonded semiconductor sensor element |
US6277666B1 (en) * | 1999-06-24 | 2001-08-21 | Honeywell Inc. | Precisely defined microelectromechanical structures and associated fabrication methods |
US6291875B1 (en) * | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
US6431714B1 (en) * | 2000-10-10 | 2002-08-13 | Nippon Telegraph And Telephone Corporation | Micro-mirror apparatus and production method therefor |
US6433401B1 (en) * | 1999-04-06 | 2002-08-13 | Analog Devices Imi, Inc. | Microfabricated structures with trench-isolation using bonded-substrates and cavities |
US6458615B1 (en) * | 1999-09-30 | 2002-10-01 | Carnegie Mellon University | Method of fabricating micromachined structures and devices formed therefrom |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6105427A (en) * | 1998-07-31 | 2000-08-22 | Litton Systems, Inc. | Micro-mechanical semiconductor accelerometer |
US6002507A (en) * | 1998-12-01 | 1999-12-14 | Xerox Corpoation | Method and apparatus for an integrated laser beam scanner |
CA2433738C (fr) * | 2001-01-02 | 2012-07-24 | The Charles Stark Draper Laboratory, Inc. | Procede de microusinage de structures utilisant un materiau de silicium sur isolant |
-
2003
- 2003-08-15 WO PCT/US2003/025435 patent/WO2004017371A2/fr not_active Application Discontinuation
- 2003-08-15 AU AU2003272215A patent/AU2003272215B2/en not_active Ceased
- 2003-08-15 EP EP03754388A patent/EP1576650A4/fr not_active Withdrawn
-
2009
- 2009-12-10 AU AU2009248425A patent/AU2009248425B2/en not_active Ceased
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5760443A (en) * | 1993-10-18 | 1998-06-02 | Regents Of The University Of California | Silicon on insulator with active buried regions |
US6077721A (en) * | 1995-06-29 | 2000-06-20 | Nippondenso Co., Ltd. | Method of producing an anodic bonded semiconductor sensor element |
US6291875B1 (en) * | 1998-06-24 | 2001-09-18 | Analog Devices Imi, Inc. | Microfabricated structures with electrical isolation and interconnections |
US6433401B1 (en) * | 1999-04-06 | 2002-08-13 | Analog Devices Imi, Inc. | Microfabricated structures with trench-isolation using bonded-substrates and cavities |
US6277666B1 (en) * | 1999-06-24 | 2001-08-21 | Honeywell Inc. | Precisely defined microelectromechanical structures and associated fabrication methods |
US6458615B1 (en) * | 1999-09-30 | 2002-10-01 | Carnegie Mellon University | Method of fabricating micromachined structures and devices formed therefrom |
US6431714B1 (en) * | 2000-10-10 | 2002-08-13 | Nippon Telegraph And Telephone Corporation | Micro-mirror apparatus and production method therefor |
Non-Patent Citations (1)
Title |
---|
See also references of EP1576650A4 * |
Also Published As
Publication number | Publication date |
---|---|
EP1576650A4 (fr) | 2011-06-15 |
AU2003272215B2 (en) | 2009-09-10 |
AU2009248425B2 (en) | 2012-12-20 |
EP1576650A2 (fr) | 2005-09-21 |
AU2003272215A1 (en) | 2004-03-03 |
AU2009248425A1 (en) | 2010-01-07 |
WO2004017371A9 (fr) | 2004-07-08 |
EP1576650A3 (fr) | 2005-10-05 |
WO2004017371A2 (fr) | 2004-02-26 |
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