AU2003271114A1 - Liquid processing device - Google Patents

Liquid processing device

Info

Publication number
AU2003271114A1
AU2003271114A1 AU2003271114A AU2003271114A AU2003271114A1 AU 2003271114 A1 AU2003271114 A1 AU 2003271114A1 AU 2003271114 A AU2003271114 A AU 2003271114A AU 2003271114 A AU2003271114 A AU 2003271114A AU 2003271114 A1 AU2003271114 A1 AU 2003271114A1
Authority
AU
Australia
Prior art keywords
processing device
liquid processing
liquid
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003271114A
Inventor
Shuichi Nagamine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003271114A1 publication Critical patent/AU2003271114A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Coating Apparatus (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
AU2003271114A 2002-10-17 2003-10-07 Liquid processing device Abandoned AU2003271114A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-302967 2002-10-17
JP2002302967A JP4028346B2 (en) 2002-10-17 2002-10-17 Liquid processing equipment
PCT/JP2003/012835 WO2004036633A1 (en) 2002-10-17 2003-10-07 Liquid processing device

Publications (1)

Publication Number Publication Date
AU2003271114A1 true AU2003271114A1 (en) 2004-05-04

Family

ID=32105061

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003271114A Abandoned AU2003271114A1 (en) 2002-10-17 2003-10-07 Liquid processing device

Country Status (4)

Country Link
JP (1) JP4028346B2 (en)
AU (1) AU2003271114A1 (en)
TW (1) TW200409182A (en)
WO (1) WO2004036633A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5017722B2 (en) * 2006-12-12 2012-09-05 東洋自動機株式会社 Steam replacement deaeration apparatus and method in bagging and packaging
JP4737638B2 (en) * 2007-01-19 2011-08-03 東京エレクトロン株式会社 Development processing equipment
JP4971294B2 (en) * 2008-12-02 2012-07-11 三菱電機株式会社 Substrate processing apparatus, substrate processing method, and display device manufacturing method
JP5301505B2 (en) * 2009-08-27 2013-09-25 東京エレクトロン株式会社 Liquid processing apparatus and liquid processing method
JP6885753B2 (en) * 2017-03-08 2021-06-16 株式会社Ｓｃｒｅｅｎホールディングス Substrate processing equipment and substrate processing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2657392B2 (en) * 1988-05-13 1997-09-24 東京エレクトロン株式会社 Rotary processing device
JP3258042B2 (en) * 1991-08-21 2002-02-18 キヤノン株式会社 Wafer chuck
JPH10321581A (en) * 1997-05-20 1998-12-04 Tokyo Electron Ltd Treating device
JP3641115B2 (en) * 1997-10-08 2005-04-20 大日本スクリーン製造株式会社 Substrate processing equipment
JP3698398B2 (en) * 1998-09-24 2005-09-21 東京エレクトロン株式会社 Rotating cup, coating apparatus and coating method
JP3721320B2 (en) * 2000-11-01 2005-11-30 東京エレクトロン株式会社 Substrate processing apparatus and substrate processing method

Also Published As

Publication number Publication date
JP4028346B2 (en) 2007-12-26
WO2004036633A1 (en) 2004-04-29
JP2004140155A (en) 2004-05-13
TW200409182A (en) 2004-06-01

Similar Documents

Publication Publication Date Title
AU2003289047A1 (en) Needle-insertion device
AU2003237647A1 (en) Lid-positioning device
AU2003281272A1 (en) Fireblocking device
AU2003293034A1 (en) Trans-thermoelectric device
AU2003241714A1 (en) Plasma processing device
AU2003249333A1 (en) Device interaction
AUPS053902A0 (en) Aspiration device
AU2003248055A1 (en) Data processing device
AU2003245720A1 (en) Electroptic device
AU2003273062A1 (en) Data processing device
AU2003271698A1 (en) Displacing device
AU2003275373A1 (en) Semiconductor device processing
AU2003241924A1 (en) Image processing device
AU2003240245A1 (en) Osteosynthesis device
AU2003231451A1 (en) Substrate processing device
AU2003264380A1 (en) Data processing device
AU2003247851A1 (en) Camera-attachable device
AU2003246290A1 (en) Box-assembling device
AU2003301386A1 (en) Data processing device
AU2003262240A1 (en) Plasma processing device
AU2003258834A1 (en) Liquid delivery device
AU2003234991A1 (en) Image processing device
AU2003255013A1 (en) Plasma processing device
AU2003271114A1 (en) Liquid processing device
AU2003243974A1 (en) Substrate processing device

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase