AU2003268263A1 - Techniques for fabricating a resistor on a flexible base material - Google Patents

Techniques for fabricating a resistor on a flexible base material

Info

Publication number
AU2003268263A1
AU2003268263A1 AU2003268263A AU2003268263A AU2003268263A1 AU 2003268263 A1 AU2003268263 A1 AU 2003268263A1 AU 2003268263 A AU2003268263 A AU 2003268263A AU 2003268263 A AU2003268263 A AU 2003268263A AU 2003268263 A1 AU2003268263 A1 AU 2003268263A1
Authority
AU
Australia
Prior art keywords
fabricating
resistor
techniques
base material
flexible base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003268263A
Other languages
English (en)
Inventor
Kevin M. Durocher
Vikram B. Krishnamurthy
Richard J. Saia
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of AU2003268263A1 publication Critical patent/AU2003268263A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C3/00—Non-adjustable metal resistors made of wire or ribbon, e.g. coiled, woven or formed as grids
    • H01C3/06—Flexible or folding resistors, whereby such a resistor can be looped or collapsed upon itself
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
    • H01C17/12—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006—Thin film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0317—Thin film conductor layer; Thin film passive component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1136—Conversion of insulating material into conductive material, e.g. by pyrolysis
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Plasma & Fusion (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
AU2003268263A 2002-09-30 2003-08-28 Techniques for fabricating a resistor on a flexible base material Abandoned AU2003268263A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/261,052 US6709944B1 (en) 2002-09-30 2002-09-30 Techniques for fabricating a resistor on a flexible base material
US10/261,052 2002-09-30
PCT/US2003/027112 WO2004032154A1 (en) 2002-09-30 2003-08-28 Techniques for fabricating a resistor on a flexible base material

Publications (1)

Publication Number Publication Date
AU2003268263A1 true AU2003268263A1 (en) 2004-04-23

Family

ID=31977937

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003268263A Abandoned AU2003268263A1 (en) 2002-09-30 2003-08-28 Techniques for fabricating a resistor on a flexible base material

Country Status (7)

Country Link
US (2) US6709944B1 (OSRAM)
EP (1) EP1550140A1 (OSRAM)
JP (1) JP2006501670A (OSRAM)
KR (1) KR20050065565A (OSRAM)
CN (1) CN100477021C (OSRAM)
AU (1) AU2003268263A1 (OSRAM)
WO (1) WO2004032154A1 (OSRAM)

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US20080035370A1 (en) * 1999-08-27 2008-02-14 Lex Kosowsky Device applications for voltage switchable dielectric material having conductive or semi-conductive organic material
US7825491B2 (en) * 2005-11-22 2010-11-02 Shocking Technologies, Inc. Light-emitting device using voltage switchable dielectric material
US20100038119A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100038121A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100044080A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
US20100040896A1 (en) * 1999-08-27 2010-02-18 Lex Kosowsky Metal Deposition
US20100044079A1 (en) * 1999-08-27 2010-02-25 Lex Kosowsky Metal Deposition
KR100674824B1 (ko) 2004-12-08 2007-01-25 삼성전기주식회사 자기저항소자 제조방법
EP1750309A3 (en) * 2005-08-03 2009-07-29 Samsung Electro-mechanics Co., Ltd Light emitting device having protection element
KR20080084812A (ko) 2005-11-22 2008-09-19 쇼킹 테크놀로지스 인코포레이티드 과전압 보호를 위해 전압 변환가능 재료를 포함하는 반도체디바이스
US20100263200A1 (en) * 2005-11-22 2010-10-21 Lex Kosowsky Wireless communication device using voltage switchable dielectric material
US8222116B2 (en) 2006-03-03 2012-07-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
US7968014B2 (en) * 2006-07-29 2011-06-28 Shocking Technologies, Inc. Device applications for voltage switchable dielectric material having high aspect ratio particles
US20080029405A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having conductive or semi-conductive organic material
US20080032049A1 (en) * 2006-07-29 2008-02-07 Lex Kosowsky Voltage switchable dielectric material having high aspect ratio particles
JP2010521058A (ja) * 2006-09-24 2010-06-17 ショッキング テクノロジーズ，インコーポレイテッド ステップ電圧応答を有する電圧切り換え可能な誘電体材料の組成及び該誘電体材料の製造方法
US20120119168A9 (en) * 2006-11-21 2012-05-17 Robert Fleming Voltage switchable dielectric materials with low band gap polymer binder or composite
JP5374063B2 (ja) * 2007-03-28 2013-12-25 三菱重工業株式会社 金属溶解用ルツボ及びその表面処理方法
US7793236B2 (en) * 2007-06-13 2010-09-07 Shocking Technologies, Inc. System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
US20100006884A1 (en) * 2007-08-07 2010-01-14 Epistar Corporation Light Emitting Device and Manufacturing Method Therof
US8206614B2 (en) 2008-01-18 2012-06-26 Shocking Technologies, Inc. Voltage switchable dielectric material having bonded particle constituents
US8203421B2 (en) * 2008-04-14 2012-06-19 Shocking Technologies, Inc. Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
US7727808B2 (en) * 2008-06-13 2010-06-01 General Electric Company Ultra thin die electronic package
US20100047535A1 (en) * 2008-08-22 2010-02-25 Lex Kosowsky Core layer structure having voltage switchable dielectric material
US20100065785A1 (en) * 2008-09-17 2010-03-18 Lex Kosowsky Voltage switchable dielectric material containing boron compound
US9208931B2 (en) 2008-09-30 2015-12-08 Littelfuse, Inc. Voltage switchable dielectric material containing conductor-on-conductor core shelled particles
WO2010039902A2 (en) * 2008-09-30 2010-04-08 Shocking Technologies, Inc. Voltage switchable dielectric material containing conductive core shelled particles
US8362871B2 (en) * 2008-11-05 2013-01-29 Shocking Technologies, Inc. Geometric and electric field considerations for including transient protective material in substrate devices
US9226391B2 (en) 2009-01-27 2015-12-29 Littelfuse, Inc. Substrates having voltage switchable dielectric materials
US8272123B2 (en) 2009-01-27 2012-09-25 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
US8399773B2 (en) 2009-01-27 2013-03-19 Shocking Technologies, Inc. Substrates having voltage switchable dielectric materials
CN102550132A (zh) 2009-03-26 2012-07-04 肖克科技有限公司 具有电压可切换电介质材料的元件
US9053844B2 (en) * 2009-09-09 2015-06-09 Littelfuse, Inc. Geometric configuration or alignment of protective material in a gap structure for electrical devices
KR101065409B1 (ko) * 2009-11-04 2011-09-16 삼성모바일디스플레이주식회사 유기 발광 조명 장치
US20110198544A1 (en) * 2010-02-18 2011-08-18 Lex Kosowsky EMI Voltage Switchable Dielectric Materials Having Nanophase Materials
US9224728B2 (en) * 2010-02-26 2015-12-29 Littelfuse, Inc. Embedded protection against spurious electrical events
US9320135B2 (en) * 2010-02-26 2016-04-19 Littelfuse, Inc. Electric discharge protection for surface mounted and embedded components
US9082622B2 (en) 2010-02-26 2015-07-14 Littelfuse, Inc. Circuit elements comprising ferroic materials
CN102324289B (zh) * 2011-05-31 2014-05-14 四平市吉华高新技术有限公司 厚膜电阻板及其制造方法
TWI497535B (zh) 2011-07-28 2015-08-21 Cyntec Co Ltd 具有軟性材料層之微電阻元件及其製造方法
CN102903467B (zh) * 2011-07-29 2016-04-06 乾坤科技股份有限公司 具有软性材料层的微电阻元件及其制造方法
DE102012208730A1 (de) * 2012-05-24 2013-11-28 Osram Opto Semiconductors Gmbh Optoelektronische Bauelementevorrichtung und Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung
DE102015000380A1 (de) * 2015-01-13 2016-07-14 Wabco Gmbh Sensoreinheit, Sensier- und Auswertevorrichtung mit einer derartigen Sensoreinheit sowie Kraftfahrzeug oder Anhänger damit und Verfahren zum Schützen einer Auswerteeinrichtung
CN111780653B (zh) * 2020-06-09 2022-01-07 中国电子科技集团公司第四十九研究所 基于碳膜纳米导电材料的电阻体及其制备方法
DE112022001244T5 (de) * 2021-02-26 2023-12-07 KYOCERA AVX Components Corporation Hochfrequenz- und Hochleistungsdünnschichtkomponente
CN113410382B (zh) * 2021-06-15 2022-11-29 西安微电子技术研究所 一种铬硅系薄膜电阻及其制备方法
CN114256063A (zh) * 2021-12-16 2022-03-29 上海华虹宏力半导体制造有限公司 一种图形轮廓质量提高方法
USD1050042S1 (en) * 2022-08-09 2024-11-05 Richardson Electronics, Ltd. Resistor
USD1046802S1 (en) * 2022-08-09 2024-10-15 Richardson Electronics, Ltd. Resistor

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Also Published As

Publication number Publication date
US7158383B2 (en) 2007-01-02
CN1695209A (zh) 2005-11-09
CN100477021C (zh) 2009-04-08
WO2004032154A1 (en) 2004-04-15
JP2006501670A (ja) 2006-01-12
US6709944B1 (en) 2004-03-23
US20040114336A1 (en) 2004-06-17
US20040063294A1 (en) 2004-04-01
EP1550140A1 (en) 2005-07-06
KR20050065565A (ko) 2005-06-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase