AU2003261832A1 - Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element - Google Patents

Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element

Info

Publication number
AU2003261832A1
AU2003261832A1 AU2003261832A AU2003261832A AU2003261832A1 AU 2003261832 A1 AU2003261832 A1 AU 2003261832A1 AU 2003261832 A AU2003261832 A AU 2003261832A AU 2003261832 A AU2003261832 A AU 2003261832A AU 2003261832 A1 AU2003261832 A1 AU 2003261832A1
Authority
AU
Australia
Prior art keywords
inductive element
variable inductive
chip
built
multilayer substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261832A
Inventor
Yuichi Ichikawa
Masahiko Oshimura
Kouichirou Sagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of AU2003261832A1 publication Critical patent/AU2003261832A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0013—Printed inductances with stacked layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)
AU2003261832A 2002-08-29 2003-08-29 Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element Abandoned AU2003261832A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-250950 2002-08-29
JP2002250950A JP2006054208A (en) 2002-08-29 2002-08-29 Variable inductance element, multilayer substrate incorporating variable inductance element, semiconductor chip and chip type variable inductance element
PCT/JP2003/011052 WO2004021374A1 (en) 2002-08-29 2003-08-29 Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element

Publications (1)

Publication Number Publication Date
AU2003261832A1 true AU2003261832A1 (en) 2004-03-19

Family

ID=31972657

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261832A Abandoned AU2003261832A1 (en) 2002-08-29 2003-08-29 Variable inductive element, multilayer substrate with built-in variable inductive element, semiconductor chip, and chip variable inductive element

Country Status (4)

Country Link
JP (1) JP2006054208A (en)
AU (1) AU2003261832A1 (en)
TW (1) TW200406916A (en)
WO (1) WO2004021374A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8384507B2 (en) * 2010-06-01 2013-02-26 Qualcomm Incorporated Through via inductor or transformer in a high-resistance substrate with programmability
US9559053B2 (en) * 2011-04-21 2017-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Compact vertical inductors extending in vertical planes
CN109643597B (en) * 2016-09-02 2021-08-24 株式会社村田制作所 Inductor component and power supply module
EP3618109B1 (en) * 2018-08-28 2021-11-17 Nxp B.V. Integrated passive coupler and method
TWI667671B (en) * 2018-09-10 2019-08-01 世界先進積體電路股份有限公司 Inductor structures
CN110139415A (en) * 2019-05-31 2019-08-16 华中科技大学 The variable circle number load coil of one kind
US10763921B1 (en) 2019-09-11 2020-09-01 Nxp B.V. Near-field electromagnetic induction device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186776B2 (en) * 1990-12-29 2001-07-11 ティーディーケイ株式会社 Electronic component manufacturing method
JPH04237106A (en) * 1991-01-21 1992-08-25 Nippon Telegr & Teleph Corp <Ntt> Integrated inductance element and integrated transformer
JPH056811U (en) * 1991-07-09 1993-01-29 日本電気株式会社 Inductance circuit
JPH06112655A (en) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd Multilayer printed wiring board with built-in coil, and its manufacture
US5572180A (en) * 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
JPH10154795A (en) * 1996-11-19 1998-06-09 Advanced Materials Eng Res Inc Inductor on semiconductor chip and its manufacturing method
JP2002198223A (en) * 2000-12-26 2002-07-12 Nec Tokin Corp Composite lc component

Also Published As

Publication number Publication date
TW200406916A (en) 2004-05-01
WO2004021374A1 (en) 2004-03-11
JP2006054208A (en) 2006-02-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase