AU2003261831A1 - Inductance device, multilayer substrate with built-in inductance device, semiconductor chip, and chip inductance device - Google Patents

Inductance device, multilayer substrate with built-in inductance device, semiconductor chip, and chip inductance device

Info

Publication number
AU2003261831A1
AU2003261831A1 AU2003261831A AU2003261831A AU2003261831A1 AU 2003261831 A1 AU2003261831 A1 AU 2003261831A1 AU 2003261831 A AU2003261831 A AU 2003261831A AU 2003261831 A AU2003261831 A AU 2003261831A AU 2003261831 A1 AU2003261831 A1 AU 2003261831A1
Authority
AU
Australia
Prior art keywords
inductance device
chip
built
multilayer substrate
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261831A
Inventor
Yuichi Ichikawa
Masahiko Oshimura
Kouichirou Sagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ajinomoto Co Inc
Original Assignee
Ajinomoto Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Co Inc filed Critical Ajinomoto Co Inc
Publication of AU2003261831A1 publication Critical patent/AU2003261831A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F21/00—Variable inductances or transformers of the signal type
    • H01F21/12—Variable inductances or transformers of the signal type discontinuously variable, e.g. tapped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Coils Or Transformers For Communication (AREA)
AU2003261831A 2002-08-29 2003-08-29 Inductance device, multilayer substrate with built-in inductance device, semiconductor chip, and chip inductance device Abandoned AU2003261831A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002250949A JP2006054207A (en) 2002-08-29 2002-08-29 Inductance element, multilayer substrate incorporating inductance element, semiconductor chip and chip type inductance element
JP2002-250949 2002-08-29
PCT/JP2003/011051 WO2004021373A1 (en) 2002-08-29 2003-08-29 Inductance device, multilayer substrate with built-in inductance device, semiconductor chip, and chip inductance device

Publications (1)

Publication Number Publication Date
AU2003261831A1 true AU2003261831A1 (en) 2004-03-19

Family

ID=31972656

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261831A Abandoned AU2003261831A1 (en) 2002-08-29 2003-08-29 Inductance device, multilayer substrate with built-in inductance device, semiconductor chip, and chip inductance device

Country Status (4)

Country Link
JP (1) JP2006054207A (en)
AU (1) AU2003261831A1 (en)
TW (1) TW200405544A (en)
WO (1) WO2004021373A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010040882A (en) * 2008-08-07 2010-02-18 Murata Mfg Co Ltd Electronic component
JP5477191B2 (en) * 2010-06-23 2014-04-23 Ｔｄｋ株式会社 Coil parts
JP5397325B2 (en) * 2010-06-23 2014-01-22 Ｔｄｋ株式会社 Coil parts
JP2012160507A (en) * 2011-01-31 2012-08-23 Toko Inc Surface mount inductor and method for manufacturing surface mount inductor
JP5907124B2 (en) 2013-07-24 2016-04-20 株式会社村田製作所 High frequency components and filter components
JP5821914B2 (en) 2013-08-28 2015-11-24 株式会社村田製作所 High frequency components
JP5888475B2 (en) * 2013-10-30 2016-03-22 株式会社村田製作所 Electronic components
JP6695807B2 (en) 2014-10-30 2020-05-20 日立オートモティブシステムズ株式会社 In-vehicle control device
JP2016116034A (en) * 2014-12-12 2016-06-23 三菱電機株式会社 Impedance matching circuit
JP6497153B2 (en) * 2015-03-20 2019-04-10 株式会社リコー Transformer and plasma generator
TWI581562B (en) * 2015-10-01 2017-05-01 Murata Manufacturing Co Laminated bandpass filter
JP6797676B2 (en) * 2016-05-31 2020-12-09 太陽誘電株式会社 Coil parts
CN107452463B (en) * 2016-05-31 2021-04-02 太阳诱电株式会社 Coil component
JP6787071B2 (en) * 2016-11-21 2020-11-18 Tdk株式会社 Power converter
JP2021057377A (en) * 2019-09-27 2021-04-08 株式会社オートネットワーク技術研究所 Inductor
JP2021117004A (en) * 2020-01-22 2021-08-10 株式会社東芝 Chip package
KR20220014222A (en) 2020-07-28 2022-02-04 주식회사 엘지에너지솔루션 The FPCB And The Method For Manufacturing Thereof
KR20220033744A (en) 2020-09-10 2022-03-17 삼성전기주식회사 Coil component and board having the same mounted thereon
CN114141472B (en) * 2021-01-19 2024-01-16 西安电子科技大学 High-integration high-shielding transformer structure based on penetrating through holes
KR20240061848A (en) 2022-11-01 2024-05-08 삼성전기주식회사 Coil component

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3186776B2 (en) * 1990-12-29 2001-07-11 ティーディーケイ株式会社 Electronic component manufacturing method
JPH04237106A (en) * 1991-01-21 1992-08-25 Nippon Telegr & Teleph Corp <Ntt> Integrated inductance element and integrated transformer
JPH056811U (en) * 1991-07-09 1993-01-29 日本電気株式会社 Inductance circuit
JPH06112655A (en) * 1992-09-29 1994-04-22 Matsushita Electric Ind Co Ltd Multilayer printed wiring board with built-in coil, and its manufacture
US5572180A (en) * 1995-11-16 1996-11-05 Motorola, Inc. Surface mountable inductor
JPH10154795A (en) * 1996-11-19 1998-06-09 Advanced Materials Eng Res Inc Inductor on semiconductor chip and its manufacturing method
JPH10303026A (en) * 1997-04-23 1998-11-13 Nec Home Electron Ltd Coil
JP2002198223A (en) * 2000-12-26 2002-07-12 Nec Tokin Corp Composite lc component

Also Published As

Publication number Publication date
TW200405544A (en) 2004-04-01
JP2006054207A (en) 2006-02-23
WO2004021373A1 (en) 2004-03-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase