AU2003261429A1 - Stackable layers containing ball grid array packages - Google Patents

Stackable layers containing ball grid array packages

Info

Publication number
AU2003261429A1
AU2003261429A1 AU2003261429A AU2003261429A AU2003261429A1 AU 2003261429 A1 AU2003261429 A1 AU 2003261429A1 AU 2003261429 A AU2003261429 A AU 2003261429A AU 2003261429 A AU2003261429 A AU 2003261429A AU 2003261429 A1 AU2003261429 A1 AU 2003261429A1
Authority
AU
Australia
Prior art keywords
grid array
ball grid
layers containing
array packages
containing ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003261429A
Other languages
English (en)
Inventor
Floyd K. Eide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Irvine Sensors Corp
Original Assignee
Irvine Sensors Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Irvine Sensors Corp filed Critical Irvine Sensors Corp
Priority claimed from PCT/US2003/024706 external-priority patent/WO2005018000A1/en
Publication of AU2003261429A1 publication Critical patent/AU2003261429A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Wire Bonding (AREA)
AU2003261429A 2003-08-08 2003-08-08 Stackable layers containing ball grid array packages Abandoned AU2003261429A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2003/024706 WO2005018000A1 (en) 2002-02-07 2003-08-08 Stackable layers containing ball grid array packages

Publications (1)

Publication Number Publication Date
AU2003261429A1 true AU2003261429A1 (en) 2005-03-07

Family

ID=34885493

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003261429A Abandoned AU2003261429A1 (en) 2003-08-08 2003-08-08 Stackable layers containing ball grid array packages

Country Status (3)

Country Link
EP (1) EP1652233A4 (ja)
JP (1) JP2007521631A (ja)
AU (1) AU2003261429A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7676912B2 (en) * 2007-09-05 2010-03-16 Headway Technologies, Inc. Method of manufacturing electronic component package

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3613367B2 (ja) * 1997-01-17 2005-01-26 ヘンケル コーポレイション 熱硬化性樹脂組成物
US6404043B1 (en) * 2000-06-21 2002-06-11 Dense-Pac Microsystems, Inc. Panel stacking of BGA devices to form three-dimensional modules
JP2003078109A (ja) * 2001-09-03 2003-03-14 Mitsubishi Electric Corp 積層型メモリ装置
US6797537B2 (en) * 2001-10-30 2004-09-28 Irvine Sensors Corporation Method of making stackable layers containing encapsulated integrated circuit chips with one or more overlaying interconnect layers

Also Published As

Publication number Publication date
EP1652233A1 (en) 2006-05-03
EP1652233A4 (en) 2009-11-25
JP2007521631A (ja) 2007-08-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase