EP1652233A4 - Stackable layers containing ball grid array packages - Google Patents

Stackable layers containing ball grid array packages

Info

Publication number
EP1652233A4
EP1652233A4 EP20030818224 EP03818224A EP1652233A4 EP 1652233 A4 EP1652233 A4 EP 1652233A4 EP 20030818224 EP20030818224 EP 20030818224 EP 03818224 A EP03818224 A EP 03818224A EP 1652233 A4 EP1652233 A4 EP 1652233A4
Authority
EP
Grant status
Application
Patent type
Prior art keywords
grid array
ball grid
layers containing
array packages
containing ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP20030818224
Other languages
German (de)
French (fr)
Other versions
EP1652233A1 (en )
Inventor
Floyd K Eide
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Aprolase Development Co LLC
Original Assignee
Aprolase Development Co LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/10Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
EP20030818224 2002-02-07 2003-08-08 Stackable layers containing ball grid array packages Withdrawn EP1652233A4 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2003/024706 WO2005018000A1 (en) 2002-02-07 2003-08-08 Stackable layers containing ball grid array packages

Publications (2)

Publication Number Publication Date
EP1652233A1 true EP1652233A1 (en) 2006-05-03
EP1652233A4 true true EP1652233A4 (en) 2009-11-25

Family

ID=34885493

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20030818224 Withdrawn EP1652233A4 (en) 2002-02-07 2003-08-08 Stackable layers containing ball grid array packages

Country Status (2)

Country Link
EP (1) EP1652233A4 (en)
JP (1) JP2007521631A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7676912B2 (en) * 2007-09-05 2010-03-16 Headway Technologies, Inc. Method of manufacturing electronic component package

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031738A1 (en) * 1997-01-17 1998-07-23 Loctite Corporation Thermosetting resin compositions
US20020094603A1 (en) * 2000-06-21 2002-07-18 Isaak Harlan R. Three-dimensional memory stacking using anisotropic epoxy interconnections
US20030043650A1 (en) * 2001-09-03 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Multilayered memory device
WO2003038861A2 (en) * 2001-10-30 2003-05-08 Irvine Sensors Corporation A method of stacking layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998031738A1 (en) * 1997-01-17 1998-07-23 Loctite Corporation Thermosetting resin compositions
US20020094603A1 (en) * 2000-06-21 2002-07-18 Isaak Harlan R. Three-dimensional memory stacking using anisotropic epoxy interconnections
US20030043650A1 (en) * 2001-09-03 2003-03-06 Mitsubishi Denki Kabushiki Kaisha Multilayered memory device
WO2003038861A2 (en) * 2001-10-30 2003-05-08 Irvine Sensors Corporation A method of stacking layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2005018000A1 *

Also Published As

Publication number Publication date Type
EP1652233A1 (en) 2006-05-03 application
JP2007521631A (en) 2007-08-02 application

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Legal Events

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AK Designated contracting states:

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR

17P Request for examination filed

Effective date: 20051216

DAX Request for extension of the european patent (to any country) deleted
RAP1 Transfer of rights of an ep published application

Owner name: APROLASE DEVELOPMENT CO., LLC

A4 Supplementary search report

Effective date: 20091028

RIC1 Classification (correction)

Ipc: H05K 1/14 20060101ALI20091022BHEP

Ipc: H01L 25/10 20060101AFI20091022BHEP

18D Deemed to be withdrawn

Effective date: 20100514