AU2003253429A8 - Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices - Google Patents

Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices

Info

Publication number
AU2003253429A8
AU2003253429A8 AU2003253429A AU2003253429A AU2003253429A8 AU 2003253429 A8 AU2003253429 A8 AU 2003253429A8 AU 2003253429 A AU2003253429 A AU 2003253429A AU 2003253429 A AU2003253429 A AU 2003253429A AU 2003253429 A8 AU2003253429 A8 AU 2003253429A8
Authority
AU
Australia
Prior art keywords
thermocoductive
semiconductor devices
elastomer composition
silicone elastomer
thermoconductive filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003253429A
Other versions
AU2003253429A1 (en
Inventor
Kimio Yamakawa
Hiroki Ishikawa
Kazumi Nakayoshi
Katsutoshi Mine
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Original Assignee
Dow Corning Toray Silicone Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone Co Ltd filed Critical Dow Corning Toray Silicone Co Ltd
Publication of AU2003253429A8 publication Critical patent/AU2003253429A8/en
Publication of AU2003253429A1 publication Critical patent/AU2003253429A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
AU2003253429A 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices Abandoned AU2003253429A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-229820 2002-08-07
JP2002229820 2002-08-07
PCT/JP2003/010035 WO2004015002A2 (en) 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices

Publications (2)

Publication Number Publication Date
AU2003253429A8 true AU2003253429A8 (en) 2004-02-25
AU2003253429A1 AU2003253429A1 (en) 2004-02-25

Family

ID=31711665

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003253429A Abandoned AU2003253429A1 (en) 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices

Country Status (3)

Country Link
AU (1) AU2003253429A1 (en)
TW (1) TW200406449A (en)
WO (1) WO2004015002A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101815772A (en) * 2007-09-14 2010-08-25 汉高股份两合公司 Thermally conductive composition
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
WO2014086638A1 (en) * 2012-12-04 2014-06-12 Sika Technology Ag Silicone formulation with improved storage stability
JP6656509B1 (en) * 2018-11-07 2020-03-04 ニホンハンダ株式会社 Method for producing conductive filler, conductive addition-curable silicone composition, and semiconductor device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548879A (en) * 1984-05-21 1985-10-22 Rohm And Haas Company Solderable polymer thick films
US4711673A (en) * 1985-10-03 1987-12-08 Aluminum Company Of America Combination of surface modifiers for powdered inorganic fillers
JPH0297559A (en) * 1988-10-03 1990-04-10 Toshiba Silicone Co Ltd Heat-conductive silicone composition
CA2000787A1 (en) * 1988-11-04 1990-05-04 Richard L. Cole Electrically conductive silicone compositions
US5227093A (en) * 1991-11-29 1993-07-13 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
DE69407137T2 (en) * 1993-10-06 1998-04-09 Dow Corning Toray Silicone Electrically conductive organosiloxane compositions filled with silver
IL117216A (en) * 1995-02-23 2003-10-31 Martinswerk Gmbh Surface-modified filler composition
KR100703059B1 (en) * 2000-02-07 2007-04-05 가부시키가이샤 가네카 Curable composition and conductive roller and conductive drum both made from the same

Also Published As

Publication number Publication date
AU2003253429A1 (en) 2004-02-25
WO2004015002A2 (en) 2004-02-19
WO2004015002A3 (en) 2005-01-06
WO2004015002A8 (en) 2004-11-11
TW200406449A (en) 2004-05-01
WO2004015002B1 (en) 2005-02-24

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase