WO2004015002A3 - Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices - Google Patents

Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices Download PDF

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Publication number
WO2004015002A3
WO2004015002A3 PCT/JP2003/010035 JP0310035W WO2004015002A3 WO 2004015002 A3 WO2004015002 A3 WO 2004015002A3 JP 0310035 W JP0310035 W JP 0310035W WO 2004015002 A3 WO2004015002 A3 WO 2004015002A3
Authority
WO
WIPO (PCT)
Prior art keywords
silicone elastomer
elastomer composition
thermoconductive
thermocoductive
semiconductor devices
Prior art date
Application number
PCT/JP2003/010035
Other languages
French (fr)
Other versions
WO2004015002A8 (en
WO2004015002B1 (en
WO2004015002A2 (en
Inventor
Kimio Yamakawa
Kazumi Nakayoshi
Hiroki Ishikawa
Katsutoshi Mine
Original Assignee
Dow Corning Toray Silicone
Kimio Yamakawa
Kazumi Nakayoshi
Hiroki Ishikawa
Katsutoshi Mine
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone, Kimio Yamakawa, Kazumi Nakayoshi, Hiroki Ishikawa, Katsutoshi Mine filed Critical Dow Corning Toray Silicone
Priority to AU2003253429A priority Critical patent/AU2003253429A1/en
Publication of WO2004015002A2 publication Critical patent/WO2004015002A2/en
Publication of WO2004015002A8 publication Critical patent/WO2004015002A8/en
Publication of WO2004015002A3 publication Critical patent/WO2004015002A3/en
Publication of WO2004015002B1 publication Critical patent/WO2004015002B1/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/08—Ingredients agglomerated by treatment with a binding agent
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes

Abstract

A thermoconductive filler whose surface has been treated or coated with a fatty acid and thereafter has also been treated or coated with an epoxy-functional compound and a curing catalyst for epoxy resins. A thermoconductive silicone elastomer compositions that contains the thermoconductive filler whose surface has been treated or coated with a fatty acid and thereafter has also been treated or coated with an epoxy-functional compound and a curing catalyst for epoxy resins. A semiconductor device afforded by coating a semiconductor chip with the thermoconductive silicone elastomer composition and curing.
PCT/JP2003/010035 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices WO2004015002A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003253429A AU2003253429A1 (en) 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002229820 2002-08-07
JP2002-229820 2002-08-07

Publications (4)

Publication Number Publication Date
WO2004015002A2 WO2004015002A2 (en) 2004-02-19
WO2004015002A8 WO2004015002A8 (en) 2004-11-11
WO2004015002A3 true WO2004015002A3 (en) 2005-01-06
WO2004015002B1 WO2004015002B1 (en) 2005-02-24

Family

ID=31711665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2003/010035 WO2004015002A2 (en) 2002-08-07 2003-08-06 Thermoconductive filler, thermocoductive silicone elastomer composition, and semiconductor devices

Country Status (3)

Country Link
AU (1) AU2003253429A1 (en)
TW (1) TW200406449A (en)
WO (1) WO2004015002A2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2201079B1 (en) * 2007-09-14 2017-08-23 Henkel AG & Co. KGaA Thermally conductive composition
US8115369B2 (en) * 2009-11-09 2012-02-14 Lg Innotek Co., Ltd. Lighting device
CN104822733A (en) * 2012-12-04 2015-08-05 Sika技术股份公司 Silicone formulation with improved storage stability
JP6656509B1 (en) * 2018-11-07 2020-03-04 ニホンハンダ株式会社 Method for producing conductive filler, conductive addition-curable silicone composition, and semiconductor device

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548879A (en) * 1984-05-21 1985-10-22 Rohm And Haas Company Solderable polymer thick films
US4711673A (en) * 1985-10-03 1987-12-08 Aluminum Company Of America Combination of surface modifiers for powdered inorganic fillers
EP0367562A2 (en) * 1988-11-04 1990-05-09 Dow Corning Corporation Electrically conductive silicone compositions
US5021494A (en) * 1988-10-03 1991-06-04 Toshiba Silicone Co., Ltd Thermal conductive silicone composition
EP0545568A1 (en) * 1991-11-29 1993-06-09 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
EP0647682A1 (en) * 1993-10-06 1995-04-12 Dow Corning Toray Silicone Company, Limited Silver-filled electrically conductive organosiloxane compositions
WO1996026240A1 (en) * 1995-02-23 1996-08-29 Martinswerk Gmbh Für Chemische Und Metallurgische Produktion Surface-modified filler composition
WO2001059010A1 (en) * 2000-02-07 2001-08-16 Kaneka Corporation Curable composition and conductive roller and conductive drum both made from the same

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4548879A (en) * 1984-05-21 1985-10-22 Rohm And Haas Company Solderable polymer thick films
US4711673A (en) * 1985-10-03 1987-12-08 Aluminum Company Of America Combination of surface modifiers for powdered inorganic fillers
US5021494A (en) * 1988-10-03 1991-06-04 Toshiba Silicone Co., Ltd Thermal conductive silicone composition
EP0367562A2 (en) * 1988-11-04 1990-05-09 Dow Corning Corporation Electrically conductive silicone compositions
EP0545568A1 (en) * 1991-11-29 1993-06-09 Dow Corning Corporation Curable organosiloxane compositions yielding electrically conductive materials
EP0647682A1 (en) * 1993-10-06 1995-04-12 Dow Corning Toray Silicone Company, Limited Silver-filled electrically conductive organosiloxane compositions
WO1996026240A1 (en) * 1995-02-23 1996-08-29 Martinswerk Gmbh Für Chemische Und Metallurgische Produktion Surface-modified filler composition
WO2001059010A1 (en) * 2000-02-07 2001-08-16 Kaneka Corporation Curable composition and conductive roller and conductive drum both made from the same
EP1270674A1 (en) * 2000-02-07 2003-01-02 Kaneka Corporation Curable composition and conductive roller and conductive drum both made from the same

Also Published As

Publication number Publication date
AU2003253429A1 (en) 2004-02-25
TW200406449A (en) 2004-05-01
AU2003253429A8 (en) 2004-02-25
WO2004015002A8 (en) 2004-11-11
WO2004015002B1 (en) 2005-02-24
WO2004015002A2 (en) 2004-02-19

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