AU2003249363A1 - Partial-membrane carrier head - Google Patents

Partial-membrane carrier head

Info

Publication number
AU2003249363A1
AU2003249363A1 AU2003249363A AU2003249363A AU2003249363A1 AU 2003249363 A1 AU2003249363 A1 AU 2003249363A1 AU 2003249363 A AU2003249363 A AU 2003249363A AU 2003249363 A AU2003249363 A AU 2003249363A AU 2003249363 A1 AU2003249363 A1 AU 2003249363A1
Authority
AU
Australia
Prior art keywords
partial
carrier head
membrane carrier
membrane
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003249363A
Other languages
English (en)
Inventor
Peter Renteln
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2003249363A1 publication Critical patent/AU2003249363A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
AU2003249363A 2002-06-28 2003-06-24 Partial-membrane carrier head Abandoned AU2003249363A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/186,888 2002-06-28
US10/186,888 US6758726B2 (en) 2002-06-28 2002-06-28 Partial-membrane carrier head
PCT/US2003/019942 WO2004002676A1 (fr) 2002-06-28 2003-06-24 Tete de porteur a membrane partielle

Publications (1)

Publication Number Publication Date
AU2003249363A1 true AU2003249363A1 (en) 2004-01-19

Family

ID=29779958

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003249363A Abandoned AU2003249363A1 (en) 2002-06-28 2003-06-24 Partial-membrane carrier head

Country Status (8)

Country Link
US (1) US6758726B2 (fr)
EP (1) EP1545832A1 (fr)
JP (1) JP2005531930A (fr)
KR (1) KR100691353B1 (fr)
CN (1) CN100364720C (fr)
AU (1) AU2003249363A1 (fr)
TW (1) TWI221643B (fr)
WO (1) WO2004002676A1 (fr)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100579865B1 (ko) * 2004-12-23 2006-05-12 동부일렉트로닉스 주식회사 화학기계적 연마장치
KR101057228B1 (ko) * 2008-10-21 2011-08-16 주식회사 엘지실트론 경면연마장치의 가압헤드
US20120021673A1 (en) * 2010-07-20 2012-01-26 Applied Materials, Inc. Substrate holder to reduce substrate edge stress during chemical mechanical polishing
CN102179758A (zh) * 2011-03-03 2011-09-14 浙江工业大学 一种柔性可控球形气压砂轮光整工具
JP2013004928A (ja) * 2011-06-21 2013-01-07 Shin Etsu Handotai Co Ltd 研磨ヘッド、研磨装置及びワークの研磨方法
KR101241023B1 (ko) * 2011-12-08 2013-03-11 주식회사 케이씨텍 캐리어 헤드의 멤브레인
KR101597870B1 (ko) * 2012-04-02 2016-02-25 강준모 화학 기계적 연마 장치 용 캐리어 헤드
CN104308736A (zh) * 2014-08-27 2015-01-28 上海华力微电子有限公司 研磨头膜片的缺陷检测方法
KR102332801B1 (ko) * 2015-05-06 2021-11-30 주식회사 케이씨텍 기판 연마장치의 디척 방법
JP2017037918A (ja) * 2015-08-07 2017-02-16 エスアイアイ・セミコンダクタ株式会社 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路の製造方法
TWM546597U (zh) * 2015-10-12 2017-08-01 應用材料股份有限公司 用於固持基板之基板載體
US9873179B2 (en) * 2016-01-20 2018-01-23 Applied Materials, Inc. Carrier for small pad for chemical mechanical polishing
JP6713377B2 (ja) * 2016-08-10 2020-06-24 エイブリック株式会社 研磨ヘッド、研磨ヘッドを有するｃｍｐ研磨装置およびそれを用いた半導体集積回路装置の製造方法
WO2018059144A1 (fr) * 2016-09-27 2018-04-05 清华大学 Procédé et système de détection de chute de plaquette de tête de polissage d'équipement cmp
CN109202665A (zh) * 2018-09-21 2019-01-15 胡新军 一种钢板抛光打磨装置及方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2616736B2 (ja) * 1995-01-25 1997-06-04 日本電気株式会社 ウエーハ研磨装置
KR100210840B1 (ko) * 1996-12-24 1999-07-15 구본준 기계 화학적 연마 방법 및 그 장치
US6225224B1 (en) * 1999-05-19 2001-05-01 Infineon Technologies Norht America Corp. System for dispensing polishing liquid during chemical mechanical polishing of a semiconductor wafer
AU2001283529A1 (en) * 2000-07-31 2002-02-13 Asml Us, Inc. Apparatus and method for chemical mechanical polishing of substrates
KR20030033084A (ko) * 2000-09-27 2003-04-26 스트라스바흐, 인코포레이티드 배면연마 테이프를 남겨두고 웨이퍼를 배면연마하는 방법
EP1260315B1 (fr) * 2001-05-25 2003-12-10 Infineon Technologies AG Support pour substrat semiconducteur muni d'une plaque mobile pour le polissage mécano-chimique
US6568991B2 (en) * 2001-08-28 2003-05-27 Speedfam-Ipec Corporation Method and apparatus for sensing a wafer in a carrier
US6776693B2 (en) * 2001-12-19 2004-08-17 Applied Materials Inc. Method and apparatus for face-up substrate polishing

Also Published As

Publication number Publication date
WO2004002676A1 (fr) 2004-01-08
KR100691353B1 (ko) 2007-03-12
EP1545832A1 (fr) 2005-06-29
US20040002291A1 (en) 2004-01-01
JP2005531930A (ja) 2005-10-20
CN100364720C (zh) 2008-01-30
TWI221643B (en) 2004-10-01
TW200401359A (en) 2004-01-16
CN1665639A (zh) 2005-09-07
US6758726B2 (en) 2004-07-06
KR20050037514A (ko) 2005-04-22

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase