AU2003231385A1 - Mounting method and mounting system - Google Patents

Mounting method and mounting system

Info

Publication number
AU2003231385A1
AU2003231385A1 AU2003231385A AU2003231385A AU2003231385A1 AU 2003231385 A1 AU2003231385 A1 AU 2003231385A1 AU 2003231385 A AU2003231385 A AU 2003231385A AU 2003231385 A AU2003231385 A AU 2003231385A AU 2003231385 A1 AU2003231385 A1 AU 2003231385A1
Authority
AU
Australia
Prior art keywords
mounting
mounting system
mounting method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003231385A
Inventor
Satoru Naraba
Akira Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Engineering Co Ltd
Original Assignee
Toray Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Engineering Co Ltd filed Critical Toray Engineering Co Ltd
Publication of AU2003231385A1 publication Critical patent/AU2003231385A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7501—Means for cleaning, e.g. brushes, for hydro blasting, for ultrasonic cleaning, for dry ice blasting, using gas-flow, by etching, by applying flux or plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/751—Means for controlling the bonding environment, e.g. valves, vacuum pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
AU2003231385A 2002-04-26 2003-04-22 Mounting method and mounting system Abandoned AU2003231385A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002-125816 2002-04-26
JP2002125816 2002-04-26
JP2003-66586 2003-03-12
JP2003066586A JP2004006707A (en) 2002-04-26 2003-03-12 Packaging method and packaging apparatus
PCT/JP2003/005121 WO2003092054A1 (en) 2002-04-26 2003-04-22 Mounting method and mounting system

Publications (1)

Publication Number Publication Date
AU2003231385A1 true AU2003231385A1 (en) 2003-11-10

Family

ID=29272362

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003231385A Abandoned AU2003231385A1 (en) 2002-04-26 2003-04-22 Mounting method and mounting system

Country Status (4)

Country Link
JP (1) JP2004006707A (en)
AU (1) AU2003231385A1 (en)
TW (1) TW200403790A (en)
WO (1) WO2003092054A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4608890B2 (en) * 2004-01-29 2011-01-12 富士ゼロックス株式会社 Method and apparatus for manufacturing microstructure
JP4864591B2 (en) * 2006-08-08 2012-02-01 神港精機株式会社 Soldering method and soldering apparatus
KR100841376B1 (en) 2007-06-12 2008-06-26 삼성에스디아이 주식회사 Joining method and method of fabricating oled using the same
KR100841375B1 (en) 2007-06-12 2008-06-26 삼성에스디아이 주식회사 Joining method and method of fabricating oled using the same
KR100889625B1 (en) 2007-07-19 2009-03-20 삼성모바일디스플레이주식회사 Joining method and method of fabricating OLED using the same
US9443820B2 (en) 2012-05-30 2016-09-13 Ev Group E. Thallner Gmbh Device and method for bonding substrates
JP2014160743A (en) * 2013-02-19 2014-09-04 Tokyo Ohka Kogyo Co Ltd Bonding apparatus and cleaning method of the same
KR102039233B1 (en) * 2017-12-26 2019-11-26 캐논 톡키 가부시키가이샤 Electrostatic chuck, film forming apparatus including electrostatic chuck, substrate holding and separating method, film forming method including the same, and manufacturing method of electronic device using the same
WO2022176798A1 (en) * 2021-02-16 2022-08-25 パナソニックＩｐマネジメント株式会社 Bonding system, bonding method, and method for manufacturing semiconductor device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5198634A (en) * 1990-05-21 1993-03-30 Mattson Brad S Plasma contamination removal process
JP2791429B2 (en) * 1996-09-18 1998-08-27 工業技術院長 Room-temperature bonding of silicon wafers
JP2002064268A (en) * 2000-08-18 2002-02-28 Toray Eng Co Ltd Mounting method and mounting apparatus

Also Published As

Publication number Publication date
WO2003092054A1 (en) 2003-11-06
JP2004006707A (en) 2004-01-08
TW200403790A (en) 2004-03-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase