AU2003213394A1 - Polishing equipment, and method of manufacturing semiconductor device using the equipment - Google Patents

Polishing equipment, and method of manufacturing semiconductor device using the equipment

Info

Publication number
AU2003213394A1
AU2003213394A1 AU2003213394A AU2003213394A AU2003213394A1 AU 2003213394 A1 AU2003213394 A1 AU 2003213394A1 AU 2003213394 A AU2003213394 A AU 2003213394A AU 2003213394 A AU2003213394 A AU 2003213394A AU 2003213394 A1 AU2003213394 A1 AU 2003213394A1
Authority
AU
Australia
Prior art keywords
equipment
semiconductor device
manufacturing semiconductor
polishing
polishing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003213394A
Inventor
Susumu Hoshino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of AU2003213394A1 publication Critical patent/AU2003213394A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2003213394A 2002-03-20 2003-03-17 Polishing equipment, and method of manufacturing semiconductor device using the equipment Abandoned AU2003213394A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-077745 2002-03-20
JP2002077745A JP2003266300A (en) 2002-03-20 2002-03-20 Polishing device and manufacturing method for semiconductor device
PCT/JP2003/003150 WO2003078103A1 (en) 2002-03-20 2003-03-17 Polishing equipment, and method of manufacturing semiconductor device using the equipment

Publications (1)

Publication Number Publication Date
AU2003213394A1 true AU2003213394A1 (en) 2003-09-29

Family

ID=28035535

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003213394A Abandoned AU2003213394A1 (en) 2002-03-20 2003-03-17 Polishing equipment, and method of manufacturing semiconductor device using the equipment

Country Status (5)

Country Link
JP (1) JP2003266300A (en)
KR (1) KR20040091761A (en)
AU (1) AU2003213394A1 (en)
TW (1) TW200400099A (en)
WO (1) WO2003078103A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100581757B1 (en) 2004-08-19 2006-05-22 주식회사 신안에스엔피 Polishing Apparatus and Polishing System for Glass
WO2007087830A1 (en) * 2006-02-03 2007-08-09 Freescale Semiconductor, Inc. Initiating chemical mechanical polishing with slurries having small abrasive particles
KR100787091B1 (en) 2006-04-21 2007-12-21 엘지마이크론 주식회사 Apparatuas for repairing mask and method for repairing mask
JP6468147B2 (en) * 2015-02-05 2019-02-13 東京エレクトロン株式会社 Polishing apparatus, coating film forming apparatus, coating film forming method, and storage medium
WO2016125408A1 (en) * 2015-02-05 2016-08-11 東京エレクトロン株式会社 Polishing device, coating film formation device, coating film formation method, recording medium, pattern formation method, and pattern formation device
CN106926138B (en) * 2017-03-23 2019-02-12 大连理工大学 A kind of continuous real-time monitoring device of polishing fluid performance

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2527966B2 (en) * 1987-06-02 1996-08-28 株式会社ジャパンエナジー Double-sided polishing method and device
JPH03142163A (en) * 1989-10-24 1991-06-17 Mitsubishi Electric Corp Polishing device
JPH07171761A (en) * 1993-12-21 1995-07-11 Nippon Electric Glass Co Ltd Abrasive solution feed mechanism for polishing device
TW402542B (en) * 1994-10-24 2000-08-21 Motorola Inc Improvements in timing and location for mixing polishing fluid in a process of polishing a semiconductor substrate
JPH1094965A (en) * 1996-09-24 1998-04-14 Sony Corp Chemical machine polishing device

Also Published As

Publication number Publication date
JP2003266300A (en) 2003-09-24
TW200400099A (en) 2004-01-01
WO2003078103A1 (en) 2003-09-25
KR20040091761A (en) 2004-10-28

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase