AU2002354178A1 - Support substrate for thin-sheet work - Google Patents

Support substrate for thin-sheet work

Info

Publication number
AU2002354178A1
AU2002354178A1 AU2002354178A AU2002354178A AU2002354178A1 AU 2002354178 A1 AU2002354178 A1 AU 2002354178A1 AU 2002354178 A AU2002354178 A AU 2002354178A AU 2002354178 A AU2002354178 A AU 2002354178A AU 2002354178 A1 AU2002354178 A1 AU 2002354178A1
Authority
AU
Australia
Prior art keywords
thin
support substrate
sheet work
sheet
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002354178A
Inventor
Masahiko Kitamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of AU2002354178A1 publication Critical patent/AU2002354178A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2002354178A 2001-12-21 2002-12-11 Support substrate for thin-sheet work Abandoned AU2002354178A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-390114 2001-12-21
JP2001390114A JP2003197584A (en) 2001-12-21 2001-12-21 Supporting base for thin plate processing work
PCT/JP2002/012978 WO2003054943A1 (en) 2001-12-21 2002-12-11 Support substrate for thin-sheet work

Publications (1)

Publication Number Publication Date
AU2002354178A1 true AU2002354178A1 (en) 2003-07-09

Family

ID=19188336

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002354178A Abandoned AU2002354178A1 (en) 2001-12-21 2002-12-11 Support substrate for thin-sheet work

Country Status (5)

Country Link
US (1) US20040072520A1 (en)
JP (1) JP2003197584A (en)
AU (1) AU2002354178A1 (en)
TW (1) TW200301537A (en)
WO (1) WO2003054943A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7018268B2 (en) * 2002-04-09 2006-03-28 Strasbaugh Protection of work piece during surface processing
JP2003318142A (en) * 2002-04-24 2003-11-07 Three M Innovative Properties Co Surface protection sheet and electronic component package
JP4447206B2 (en) * 2002-10-18 2010-04-07 株式会社ディスコ Semiconductor wafer protection unit and semiconductor wafer processing method
KR100862852B1 (en) 2003-12-26 2008-10-09 동부일렉트로닉스 주식회사 Polishing part for cmp equipment
KR20070120319A (en) * 2006-06-19 2007-12-24 삼성전자주식회사 Apparatus having a pair of ejectors for detaching semiconductor chips and method of detaching semiconductor chips using the apparatus
JP6459524B2 (en) * 2015-01-08 2019-01-30 株式会社ジェイテクト Composite grinding machine and grinding method

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3681139A (en) * 1969-10-16 1972-08-01 Western Electric Co Method for handling and maintaining the orientation of a matrix of miniature electrical devices
US3809233A (en) * 1971-02-03 1974-05-07 Western Electric Co Method of and package for transporting articles
US3783499A (en) * 1972-01-24 1974-01-08 Bell Telephone Labor Inc Semiconductor device fabrication using magnetic carrier
US4071944A (en) * 1975-10-20 1978-02-07 Western Electric Co., Inc. Adhesively and magnetically holding an article
JPS60183434U (en) * 1984-05-15 1985-12-05 大洋電産株式会社 Wafer for integrated circuit formation
JP2860671B2 (en) * 1989-10-18 1999-02-24 新日本無線株式会社 Dicing method for semiconductor wafer
JP2002348554A (en) * 2001-05-24 2002-12-04 Lintec Corp Sheet for fixing work and method for machining work

Also Published As

Publication number Publication date
WO2003054943A1 (en) 2003-07-03
US20040072520A1 (en) 2004-04-15
TW200301537A (en) 2003-07-01
JP2003197584A (en) 2003-07-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase