AU2002354178A1 - Support substrate for thin-sheet work - Google Patents
Support substrate for thin-sheet workInfo
- Publication number
- AU2002354178A1 AU2002354178A1 AU2002354178A AU2002354178A AU2002354178A1 AU 2002354178 A1 AU2002354178 A1 AU 2002354178A1 AU 2002354178 A AU2002354178 A AU 2002354178A AU 2002354178 A AU2002354178 A AU 2002354178A AU 2002354178 A1 AU2002354178 A1 AU 2002354178A1
- Authority
- AU
- Australia
- Prior art keywords
- thin
- support substrate
- sheet work
- sheet
- work
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-390114 | 2001-12-21 | ||
JP2001390114A JP2003197584A (en) | 2001-12-21 | 2001-12-21 | Supporting base for thin plate processing work |
PCT/JP2002/012978 WO2003054943A1 (en) | 2001-12-21 | 2002-12-11 | Support substrate for thin-sheet work |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002354178A1 true AU2002354178A1 (en) | 2003-07-09 |
Family
ID=19188336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002354178A Abandoned AU2002354178A1 (en) | 2001-12-21 | 2002-12-11 | Support substrate for thin-sheet work |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040072520A1 (en) |
JP (1) | JP2003197584A (en) |
AU (1) | AU2002354178A1 (en) |
TW (1) | TW200301537A (en) |
WO (1) | WO2003054943A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7018268B2 (en) * | 2002-04-09 | 2006-03-28 | Strasbaugh | Protection of work piece during surface processing |
JP2003318142A (en) * | 2002-04-24 | 2003-11-07 | Three M Innovative Properties Co | Surface protection sheet and electronic component package |
JP4447206B2 (en) * | 2002-10-18 | 2010-04-07 | 株式会社ディスコ | Semiconductor wafer protection unit and semiconductor wafer processing method |
KR100862852B1 (en) | 2003-12-26 | 2008-10-09 | 동부일렉트로닉스 주식회사 | Polishing part for cmp equipment |
KR20070120319A (en) * | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | Apparatus having a pair of ejectors for detaching semiconductor chips and method of detaching semiconductor chips using the apparatus |
JP6459524B2 (en) * | 2015-01-08 | 2019-01-30 | 株式会社ジェイテクト | Composite grinding machine and grinding method |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3681139A (en) * | 1969-10-16 | 1972-08-01 | Western Electric Co | Method for handling and maintaining the orientation of a matrix of miniature electrical devices |
US3809233A (en) * | 1971-02-03 | 1974-05-07 | Western Electric Co | Method of and package for transporting articles |
US3783499A (en) * | 1972-01-24 | 1974-01-08 | Bell Telephone Labor Inc | Semiconductor device fabrication using magnetic carrier |
US4071944A (en) * | 1975-10-20 | 1978-02-07 | Western Electric Co., Inc. | Adhesively and magnetically holding an article |
JPS60183434U (en) * | 1984-05-15 | 1985-12-05 | 大洋電産株式会社 | Wafer for integrated circuit formation |
JP2860671B2 (en) * | 1989-10-18 | 1999-02-24 | 新日本無線株式会社 | Dicing method for semiconductor wafer |
JP2002348554A (en) * | 2001-05-24 | 2002-12-04 | Lintec Corp | Sheet for fixing work and method for machining work |
-
2001
- 2001-12-21 JP JP2001390114A patent/JP2003197584A/en not_active Withdrawn
-
2002
- 2002-12-11 US US10/467,889 patent/US20040072520A1/en not_active Abandoned
- 2002-12-11 AU AU2002354178A patent/AU2002354178A1/en not_active Abandoned
- 2002-12-11 WO PCT/JP2002/012978 patent/WO2003054943A1/en active Application Filing
- 2002-12-16 TW TW091136290A patent/TW200301537A/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2003054943A1 (en) | 2003-07-03 |
US20040072520A1 (en) | 2004-04-15 |
TW200301537A (en) | 2003-07-01 |
JP2003197584A (en) | 2003-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |