AU2002315755A1 - Power module and air conditioner - Google Patents

Power module and air conditioner

Info

Publication number
AU2002315755A1
AU2002315755A1 AU2002315755A AU2002315755A AU2002315755A1 AU 2002315755 A1 AU2002315755 A1 AU 2002315755A1 AU 2002315755 A AU2002315755 A AU 2002315755A AU 2002315755 A AU2002315755 A AU 2002315755A AU 2002315755 A1 AU2002315755 A1 AU 2002315755A1
Authority
AU
Australia
Prior art keywords
air conditioner
power module
module
power
conditioner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU2002315755A
Other versions
AU2002315755B2 (en
Inventor
Shinji Ehira
Masakazu Iida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Daikin Industries Ltd
Original Assignee
Daikin Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2001208421A external-priority patent/JP2003023280A/en
Application filed by Daikin Industries Ltd filed Critical Daikin Industries Ltd
Priority claimed from PCT/JP2002/006659 external-priority patent/WO2003007376A1/en
Publication of AU2002315755A1 publication Critical patent/AU2002315755A1/en
Application granted granted Critical
Publication of AU2002315755B2 publication Critical patent/AU2002315755B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

AU2002315755A 2001-07-09 2002-07-01 Power module and air conditioner Ceased AU2002315755B2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001-208421 2001-07-09
JP2001208420 2001-07-09
JP2001-208420 2001-07-09
JP2001208421A JP2003023280A (en) 2001-07-09 2001-07-09 Power module
PCT/JP2002/006659 WO2003007376A1 (en) 2001-07-09 2002-07-01 Power module and air conditioner

Publications (2)

Publication Number Publication Date
AU2002315755A1 true AU2002315755A1 (en) 2003-05-22
AU2002315755B2 AU2002315755B2 (en) 2004-10-21

Family

ID=26618394

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002315755A Ceased AU2002315755B2 (en) 2001-07-09 2002-07-01 Power module and air conditioner

Country Status (6)

Country Link
US (1) US7003970B2 (en)
EP (1) EP1406303A4 (en)
KR (1) KR20030060888A (en)
CN (1) CN1242474C (en)
AU (1) AU2002315755B2 (en)
WO (1) WO2003007376A1 (en)

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI278975B (en) 2003-03-04 2007-04-11 Siliconware Precision Industries Co Ltd Semiconductor package with heatsink
DE10335197B4 (en) * 2003-07-30 2005-10-27 Kermi Gmbh Cooling device for an electronic component, in particular for a microprocessor
JP2006093404A (en) * 2004-09-24 2006-04-06 Sumitomo Wiring Syst Ltd Electrical connection box
DE102005026662A1 (en) * 2005-05-31 2006-12-07 Karl Storz Gmbh & Co. Kg Light source for endoscopy or microscopy
US7586191B2 (en) * 2005-08-11 2009-09-08 Hall David R Integrated circuit apparatus with heat spreader
JP3985834B2 (en) * 2005-11-07 2007-10-03 ダイキン工業株式会社 Electrical component assembly, outdoor unit of air conditioner including the same, and air conditioner
US20080073070A1 (en) * 2006-09-26 2008-03-27 Chin-Hu Kuo Highly efficient heat dissipating composite material and a heat dissipating device made of such material
JP2009243696A (en) * 2006-10-16 2009-10-22 Panasonic Corp Air conditioner
JP4861840B2 (en) * 2007-01-26 2012-01-25 アイシン・エィ・ダブリュ株式会社 Heating element cooling structure and driving device
DE102007019885B4 (en) * 2007-04-27 2010-11-25 Wieland-Werke Ag Heatsink with matrix-structured surface
JP5243975B2 (en) * 2008-02-04 2013-07-24 新光電気工業株式会社 Semiconductor package heat dissipating part having heat conducting member and method of manufacturing the same
JP2009212390A (en) * 2008-03-05 2009-09-17 Toshiba Corp Attachment structure of heating element mounted component
JPWO2010090326A1 (en) * 2009-02-09 2012-08-09 株式会社安川電機 Semiconductor device cooling structure and power conversion device having the cooling structure
JP5083261B2 (en) * 2009-03-26 2012-11-28 三菱電機株式会社 Semiconductor device and manufacturing method thereof
US7961469B2 (en) * 2009-03-31 2011-06-14 Apple Inc. Method and apparatus for distributing a thermal interface material
US8422229B2 (en) * 2009-06-25 2013-04-16 Oracle America, Inc. Molded heat sink and method of making same
JP5583449B2 (en) * 2010-03-30 2014-09-03 三洋電機株式会社 Cooling storage
CN102624203A (en) * 2011-01-26 2012-08-01 珠海格力电器股份有限公司 Frequency converter and inverter air conditioner
EP3553419A1 (en) * 2011-05-31 2019-10-16 LG Electronics Inc. Refrigerator
US20130000872A1 (en) * 2011-06-29 2013-01-03 Chun-Hung Lin Fin Heat Sink with Improved Structure and Processing Method Thereof
EP2669943A1 (en) * 2012-05-28 2013-12-04 Alcatel Lucent Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver
US9786584B2 (en) * 2012-09-04 2017-10-10 Infineon Technologies Ag Lateral element isolation device
US10914539B2 (en) 2013-05-15 2021-02-09 Osram Sylvania Inc. Two piece aluminum heat sink
EP3041314B1 (en) * 2013-08-30 2019-03-20 Panasonic Intellectual Property Management Co., Ltd. Induction heating cooker
WO2015123585A1 (en) 2014-02-14 2015-08-20 Gentherm Incorporated Conductive convective climate controlled seat
US10161642B2 (en) 2014-02-17 2018-12-25 Marlow Industries, Inc. System for over-molded PCB sealing ring for TEC heat exchangers
US20150338176A1 (en) * 2014-05-25 2015-11-26 Amulaire Thermal Technology, Inc. Compound heat-dissipating device
US11639816B2 (en) 2014-11-14 2023-05-02 Gentherm Incorporated Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system
US11857004B2 (en) 2014-11-14 2024-01-02 Gentherm Incorporated Heating and cooling technologies
CN104486902B (en) * 2014-11-27 2018-01-16 深圳市华星光电技术有限公司 Bending type printed circuit board (PCB)
US10145602B2 (en) * 2015-09-02 2018-12-04 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Active gas-gap heat switch with fast thermal response
KR101713661B1 (en) * 2015-12-10 2017-03-08 현대오트론 주식회사 Power module package
CN107771005B (en) * 2016-08-19 2020-12-15 台达电子工业股份有限公司 Heat radiation module and manufacturing method thereof
US11395440B2 (en) * 2016-08-19 2022-07-19 Delta Electronics, Inc. Heat sink module and manufacturing method thereof
DE112017005498B4 (en) 2016-10-31 2022-01-13 Mitsubishi Electric Corporation Semiconductor device and method of manufacturing the same
DE112016007419B4 (en) 2016-11-08 2022-06-30 Mitsubishi Electric Corporation semiconductor module and semiconductor device
DE112017005953T5 (en) 2016-11-24 2019-08-29 Mitsubishi Electric Corporation SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT
EP3367431A1 (en) * 2017-02-28 2018-08-29 Siemens Aktiengesellschaft Cooling apparatus for cooling a power semiconductor module
DE102017203862B3 (en) * 2017-03-09 2018-01-25 Bayerische Motoren Werke Aktiengesellschaft Heat source with a heat-emitting body and vehicle with a heat source
CN106839164B (en) * 2017-03-27 2022-11-08 广东美的制冷设备有限公司 Outdoor unit and air conditioner
CN108882499A (en) * 2017-05-09 2018-11-23 罗伯特·博世有限公司 Motherboard, power electronic device and equipment including it
CN108054006B (en) * 2017-11-28 2019-02-26 宁波博恩电气有限公司 Convenient for the method for capacitor heat dissipation
CN108317697B (en) * 2018-04-28 2020-10-09 广东美的制冷设备有限公司 Variable frequency air conditioner circuit board and variable frequency air conditioner
CN110594989A (en) * 2018-06-13 2019-12-20 广东美的制冷设备有限公司 Air conditioner and integrated air conditioner controller
US10692795B2 (en) * 2018-11-13 2020-06-23 International Business Machines Corporation Flip chip assembly of quantum computing devices
US11011452B2 (en) * 2018-11-29 2021-05-18 Micron Technology, Inc. Heat spreaders for semiconductor devices, and associated systems and methods
TW202024553A (en) * 2018-12-27 2020-07-01 圓剛科技股份有限公司 Heat dissipation device
US11453160B2 (en) 2020-01-24 2022-09-27 Hamilton Sundstrand Corporation Method of building a heat exchanger
US11703283B2 (en) 2020-01-24 2023-07-18 Hamilton Sundstrand Corporation Radial configuration for heat exchanger core
US11441850B2 (en) * 2020-01-24 2022-09-13 Hamilton Sundstrand Corporation Integral mounting arm for heat exchanger
US11460252B2 (en) 2020-01-24 2022-10-04 Hamilton Sundstrand Corporation Header arrangement for additively manufactured heat exchanger
CN214412924U (en) * 2020-11-20 2021-10-15 京东方科技集团股份有限公司 Network adapter and terminal equipment
CN113097164A (en) * 2021-03-31 2021-07-09 辽宁工程技术大学 Recyclable radiating fin for electric automation experiment
CN113130467B (en) * 2021-04-12 2022-10-18 深圳市科彤科技有限公司 COB display panel with automatically adjusted contrast

Family Cites Families (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57194556A (en) * 1981-05-26 1982-11-30 Toshiba Corp Heat radiating package
US4837129A (en) * 1984-09-14 1989-06-06 Kollmorgen Technologies Corp. Process for producing conductor patterns on three dimensional articles
JPS62222659A (en) * 1986-03-24 1987-09-30 Sharp Corp Power semiconductor device
JPH0713234Y2 (en) * 1986-12-05 1995-03-29 サンケン電気株式会社 Semiconductor device
US5077595A (en) * 1990-01-25 1991-12-31 Mitsubishi Denki Kabushiki Kaisha Semiconductor device
JPH06101636B2 (en) 1990-01-25 1994-12-12 三菱電機株式会社 Semiconductor device
JP2875076B2 (en) * 1990-11-29 1999-03-24 三井化学株式会社 Flexible wiring board
JPH0529499A (en) * 1991-07-18 1993-02-05 Toshiba Corp Multilayer ceramic substrate
US5358604A (en) * 1992-09-29 1994-10-25 Microelectronics And Computer Technology Corp. Method for producing conductive patterns
KR100307465B1 (en) * 1992-10-20 2001-12-15 야기 추구오 Power module
JP2758542B2 (en) * 1992-12-09 1998-05-28 三菱電機株式会社 Low thermal resistance high power semiconductor device
JPH0677260U (en) * 1993-03-29 1994-10-28 住友金属工業株式会社 Power module
US5455738A (en) * 1993-07-28 1995-10-03 E-Systems, Inc. High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit
US5360942A (en) * 1993-11-16 1994-11-01 Olin Corporation Multi-chip electronic package module utilizing an adhesive sheet
JPH0835713A (en) * 1994-07-26 1996-02-06 Fujitsu General Ltd Method and apparatus for controlling air conditioner
US5669813A (en) * 1996-05-03 1997-09-23 Ford Motor Company Apparatus for storing and cooling electronic devices and/or modules in a vehicle
JP3147018B2 (en) * 1997-01-28 2001-03-19 ダイキン工業株式会社 Refrigeration equipment control device
JPH10242385A (en) * 1997-02-27 1998-09-11 Yamaha Motor Co Ltd Power hybrid integrated-circuit device
JP3416450B2 (en) * 1997-03-21 2003-06-16 三菱電機株式会社 Power transistor module mounting structure
JP3577192B2 (en) * 1997-03-27 2004-10-13 三菱電機株式会社 Cooling device for semiconductor device
US6108208A (en) * 1997-12-08 2000-08-22 Unisys Corporation Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules
CN1146988C (en) * 1997-12-08 2004-04-21 东芝株式会社 Package for semiconductor power device and method for assembling the same
JPH11251513A (en) * 1998-03-05 1999-09-17 Sansha Electric Mfg Co Ltd Power semiconductor module
JP2000196011A (en) 1998-12-28 2000-07-14 Mitsubishi Electric Corp Electronic device and manufacture thereof
NL1011261C2 (en) * 1999-02-10 2000-08-11 Lely Research Holding Ag Electronics housing.
JP3547333B2 (en) * 1999-02-22 2004-07-28 株式会社日立産機システム Power converter
DE19959248A1 (en) * 1999-12-08 2001-06-28 Daimler Chrysler Ag Insulation improvement for high-performance semiconductor modules
JP2002064168A (en) 2000-08-17 2002-02-28 Toshiba Eng Co Ltd Cooling device, manufacturing method of cooling device, and semiconductor device

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