AU2002315755A1 - Power module and air conditioner - Google Patents
Power module and air conditionerInfo
- Publication number
- AU2002315755A1 AU2002315755A1 AU2002315755A AU2002315755A AU2002315755A1 AU 2002315755 A1 AU2002315755 A1 AU 2002315755A1 AU 2002315755 A AU2002315755 A AU 2002315755A AU 2002315755 A AU2002315755 A AU 2002315755A AU 2002315755 A1 AU2002315755 A1 AU 2002315755A1
- Authority
- AU
- Australia
- Prior art keywords
- air conditioner
- power module
- module
- power
- conditioner
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001-208421 | 2001-07-09 | ||
JP2001208420 | 2001-07-09 | ||
JP2001-208420 | 2001-07-09 | ||
JP2001208421A JP2003023280A (en) | 2001-07-09 | 2001-07-09 | Power module |
PCT/JP2002/006659 WO2003007376A1 (en) | 2001-07-09 | 2002-07-01 | Power module and air conditioner |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2002315755A1 true AU2002315755A1 (en) | 2003-05-22 |
AU2002315755B2 AU2002315755B2 (en) | 2004-10-21 |
Family
ID=26618394
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002315755A Ceased AU2002315755B2 (en) | 2001-07-09 | 2002-07-01 | Power module and air conditioner |
Country Status (6)
Country | Link |
---|---|
US (1) | US7003970B2 (en) |
EP (1) | EP1406303A4 (en) |
KR (1) | KR20030060888A (en) |
CN (1) | CN1242474C (en) |
AU (1) | AU2002315755B2 (en) |
WO (1) | WO2003007376A1 (en) |
Families Citing this family (54)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI278975B (en) | 2003-03-04 | 2007-04-11 | Siliconware Precision Industries Co Ltd | Semiconductor package with heatsink |
DE10335197B4 (en) * | 2003-07-30 | 2005-10-27 | Kermi Gmbh | Cooling device for an electronic component, in particular for a microprocessor |
JP2006093404A (en) * | 2004-09-24 | 2006-04-06 | Sumitomo Wiring Syst Ltd | Electrical connection box |
DE102005026662A1 (en) * | 2005-05-31 | 2006-12-07 | Karl Storz Gmbh & Co. Kg | Light source for endoscopy or microscopy |
US7586191B2 (en) * | 2005-08-11 | 2009-09-08 | Hall David R | Integrated circuit apparatus with heat spreader |
JP3985834B2 (en) * | 2005-11-07 | 2007-10-03 | ダイキン工業株式会社 | Electrical component assembly, outdoor unit of air conditioner including the same, and air conditioner |
US20080073070A1 (en) * | 2006-09-26 | 2008-03-27 | Chin-Hu Kuo | Highly efficient heat dissipating composite material and a heat dissipating device made of such material |
JP2009243696A (en) * | 2006-10-16 | 2009-10-22 | Panasonic Corp | Air conditioner |
JP4861840B2 (en) * | 2007-01-26 | 2012-01-25 | アイシン・エィ・ダブリュ株式会社 | Heating element cooling structure and driving device |
DE102007019885B4 (en) * | 2007-04-27 | 2010-11-25 | Wieland-Werke Ag | Heatsink with matrix-structured surface |
JP5243975B2 (en) * | 2008-02-04 | 2013-07-24 | 新光電気工業株式会社 | Semiconductor package heat dissipating part having heat conducting member and method of manufacturing the same |
JP2009212390A (en) * | 2008-03-05 | 2009-09-17 | Toshiba Corp | Attachment structure of heating element mounted component |
JPWO2010090326A1 (en) * | 2009-02-09 | 2012-08-09 | 株式会社安川電機 | Semiconductor device cooling structure and power conversion device having the cooling structure |
JP5083261B2 (en) * | 2009-03-26 | 2012-11-28 | 三菱電機株式会社 | Semiconductor device and manufacturing method thereof |
US7961469B2 (en) * | 2009-03-31 | 2011-06-14 | Apple Inc. | Method and apparatus for distributing a thermal interface material |
US8422229B2 (en) * | 2009-06-25 | 2013-04-16 | Oracle America, Inc. | Molded heat sink and method of making same |
JP5583449B2 (en) * | 2010-03-30 | 2014-09-03 | 三洋電機株式会社 | Cooling storage |
CN102624203A (en) * | 2011-01-26 | 2012-08-01 | 珠海格力电器股份有限公司 | Frequency converter and inverter air conditioner |
EP3553419A1 (en) * | 2011-05-31 | 2019-10-16 | LG Electronics Inc. | Refrigerator |
US20130000872A1 (en) * | 2011-06-29 | 2013-01-03 | Chun-Hung Lin | Fin Heat Sink with Improved Structure and Processing Method Thereof |
EP2669943A1 (en) * | 2012-05-28 | 2013-12-04 | Alcatel Lucent | Methods and apparatus for providing transfer of a heat load between a heat source and a heat receiver |
US9786584B2 (en) * | 2012-09-04 | 2017-10-10 | Infineon Technologies Ag | Lateral element isolation device |
US10914539B2 (en) | 2013-05-15 | 2021-02-09 | Osram Sylvania Inc. | Two piece aluminum heat sink |
EP3041314B1 (en) * | 2013-08-30 | 2019-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Induction heating cooker |
WO2015123585A1 (en) | 2014-02-14 | 2015-08-20 | Gentherm Incorporated | Conductive convective climate controlled seat |
US10161642B2 (en) | 2014-02-17 | 2018-12-25 | Marlow Industries, Inc. | System for over-molded PCB sealing ring for TEC heat exchangers |
US20150338176A1 (en) * | 2014-05-25 | 2015-11-26 | Amulaire Thermal Technology, Inc. | Compound heat-dissipating device |
US11639816B2 (en) | 2014-11-14 | 2023-05-02 | Gentherm Incorporated | Heating and cooling technologies including temperature regulating pad wrap and technologies with liquid system |
US11857004B2 (en) | 2014-11-14 | 2024-01-02 | Gentherm Incorporated | Heating and cooling technologies |
CN104486902B (en) * | 2014-11-27 | 2018-01-16 | 深圳市华星光电技术有限公司 | Bending type printed circuit board (PCB) |
US10145602B2 (en) * | 2015-09-02 | 2018-12-04 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Active gas-gap heat switch with fast thermal response |
KR101713661B1 (en) * | 2015-12-10 | 2017-03-08 | 현대오트론 주식회사 | Power module package |
CN107771005B (en) * | 2016-08-19 | 2020-12-15 | 台达电子工业股份有限公司 | Heat radiation module and manufacturing method thereof |
US11395440B2 (en) * | 2016-08-19 | 2022-07-19 | Delta Electronics, Inc. | Heat sink module and manufacturing method thereof |
DE112017005498B4 (en) | 2016-10-31 | 2022-01-13 | Mitsubishi Electric Corporation | Semiconductor device and method of manufacturing the same |
DE112016007419B4 (en) | 2016-11-08 | 2022-06-30 | Mitsubishi Electric Corporation | semiconductor module and semiconductor device |
DE112017005953T5 (en) | 2016-11-24 | 2019-08-29 | Mitsubishi Electric Corporation | SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT |
EP3367431A1 (en) * | 2017-02-28 | 2018-08-29 | Siemens Aktiengesellschaft | Cooling apparatus for cooling a power semiconductor module |
DE102017203862B3 (en) * | 2017-03-09 | 2018-01-25 | Bayerische Motoren Werke Aktiengesellschaft | Heat source with a heat-emitting body and vehicle with a heat source |
CN106839164B (en) * | 2017-03-27 | 2022-11-08 | 广东美的制冷设备有限公司 | Outdoor unit and air conditioner |
CN108882499A (en) * | 2017-05-09 | 2018-11-23 | 罗伯特·博世有限公司 | Motherboard, power electronic device and equipment including it |
CN108054006B (en) * | 2017-11-28 | 2019-02-26 | 宁波博恩电气有限公司 | Convenient for the method for capacitor heat dissipation |
CN108317697B (en) * | 2018-04-28 | 2020-10-09 | 广东美的制冷设备有限公司 | Variable frequency air conditioner circuit board and variable frequency air conditioner |
CN110594989A (en) * | 2018-06-13 | 2019-12-20 | 广东美的制冷设备有限公司 | Air conditioner and integrated air conditioner controller |
US10692795B2 (en) * | 2018-11-13 | 2020-06-23 | International Business Machines Corporation | Flip chip assembly of quantum computing devices |
US11011452B2 (en) * | 2018-11-29 | 2021-05-18 | Micron Technology, Inc. | Heat spreaders for semiconductor devices, and associated systems and methods |
TW202024553A (en) * | 2018-12-27 | 2020-07-01 | 圓剛科技股份有限公司 | Heat dissipation device |
US11453160B2 (en) | 2020-01-24 | 2022-09-27 | Hamilton Sundstrand Corporation | Method of building a heat exchanger |
US11703283B2 (en) | 2020-01-24 | 2023-07-18 | Hamilton Sundstrand Corporation | Radial configuration for heat exchanger core |
US11441850B2 (en) * | 2020-01-24 | 2022-09-13 | Hamilton Sundstrand Corporation | Integral mounting arm for heat exchanger |
US11460252B2 (en) | 2020-01-24 | 2022-10-04 | Hamilton Sundstrand Corporation | Header arrangement for additively manufactured heat exchanger |
CN214412924U (en) * | 2020-11-20 | 2021-10-15 | 京东方科技集团股份有限公司 | Network adapter and terminal equipment |
CN113097164A (en) * | 2021-03-31 | 2021-07-09 | 辽宁工程技术大学 | Recyclable radiating fin for electric automation experiment |
CN113130467B (en) * | 2021-04-12 | 2022-10-18 | 深圳市科彤科技有限公司 | COB display panel with automatically adjusted contrast |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57194556A (en) * | 1981-05-26 | 1982-11-30 | Toshiba Corp | Heat radiating package |
US4837129A (en) * | 1984-09-14 | 1989-06-06 | Kollmorgen Technologies Corp. | Process for producing conductor patterns on three dimensional articles |
JPS62222659A (en) * | 1986-03-24 | 1987-09-30 | Sharp Corp | Power semiconductor device |
JPH0713234Y2 (en) * | 1986-12-05 | 1995-03-29 | サンケン電気株式会社 | Semiconductor device |
US5077595A (en) * | 1990-01-25 | 1991-12-31 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
JPH06101636B2 (en) | 1990-01-25 | 1994-12-12 | 三菱電機株式会社 | Semiconductor device |
JP2875076B2 (en) * | 1990-11-29 | 1999-03-24 | 三井化学株式会社 | Flexible wiring board |
JPH0529499A (en) * | 1991-07-18 | 1993-02-05 | Toshiba Corp | Multilayer ceramic substrate |
US5358604A (en) * | 1992-09-29 | 1994-10-25 | Microelectronics And Computer Technology Corp. | Method for producing conductive patterns |
KR100307465B1 (en) * | 1992-10-20 | 2001-12-15 | 야기 추구오 | Power module |
JP2758542B2 (en) * | 1992-12-09 | 1998-05-28 | 三菱電機株式会社 | Low thermal resistance high power semiconductor device |
JPH0677260U (en) * | 1993-03-29 | 1994-10-28 | 住友金属工業株式会社 | Power module |
US5455738A (en) * | 1993-07-28 | 1995-10-03 | E-Systems, Inc. | High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit |
US5360942A (en) * | 1993-11-16 | 1994-11-01 | Olin Corporation | Multi-chip electronic package module utilizing an adhesive sheet |
JPH0835713A (en) * | 1994-07-26 | 1996-02-06 | Fujitsu General Ltd | Method and apparatus for controlling air conditioner |
US5669813A (en) * | 1996-05-03 | 1997-09-23 | Ford Motor Company | Apparatus for storing and cooling electronic devices and/or modules in a vehicle |
JP3147018B2 (en) * | 1997-01-28 | 2001-03-19 | ダイキン工業株式会社 | Refrigeration equipment control device |
JPH10242385A (en) * | 1997-02-27 | 1998-09-11 | Yamaha Motor Co Ltd | Power hybrid integrated-circuit device |
JP3416450B2 (en) * | 1997-03-21 | 2003-06-16 | 三菱電機株式会社 | Power transistor module mounting structure |
JP3577192B2 (en) * | 1997-03-27 | 2004-10-13 | 三菱電機株式会社 | Cooling device for semiconductor device |
US6108208A (en) * | 1997-12-08 | 2000-08-22 | Unisys Corporation | Testing assembly having a pressed joint with a single layer of thermal conductor which is reused to sequentially test multiple circuit modules |
CN1146988C (en) * | 1997-12-08 | 2004-04-21 | 东芝株式会社 | Package for semiconductor power device and method for assembling the same |
JPH11251513A (en) * | 1998-03-05 | 1999-09-17 | Sansha Electric Mfg Co Ltd | Power semiconductor module |
JP2000196011A (en) | 1998-12-28 | 2000-07-14 | Mitsubishi Electric Corp | Electronic device and manufacture thereof |
NL1011261C2 (en) * | 1999-02-10 | 2000-08-11 | Lely Research Holding Ag | Electronics housing. |
JP3547333B2 (en) * | 1999-02-22 | 2004-07-28 | 株式会社日立産機システム | Power converter |
DE19959248A1 (en) * | 1999-12-08 | 2001-06-28 | Daimler Chrysler Ag | Insulation improvement for high-performance semiconductor modules |
JP2002064168A (en) | 2000-08-17 | 2002-02-28 | Toshiba Eng Co Ltd | Cooling device, manufacturing method of cooling device, and semiconductor device |
-
2002
- 2002-07-01 AU AU2002315755A patent/AU2002315755B2/en not_active Ceased
- 2002-07-01 US US10/399,749 patent/US7003970B2/en not_active Expired - Fee Related
- 2002-07-01 CN CNB028023374A patent/CN1242474C/en not_active Expired - Fee Related
- 2002-07-01 KR KR10-2003-7003450A patent/KR20030060888A/en not_active Application Discontinuation
- 2002-07-01 WO PCT/JP2002/006659 patent/WO2003007376A1/en not_active Application Discontinuation
- 2002-07-01 EP EP02741385A patent/EP1406303A4/en not_active Withdrawn
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