AU2002247609A1 - Method for producing printed circuit boards - Google Patents

Method for producing printed circuit boards

Info

Publication number
AU2002247609A1
AU2002247609A1 AU2002247609A AU2002247609A AU2002247609A1 AU 2002247609 A1 AU2002247609 A1 AU 2002247609A1 AU 2002247609 A AU2002247609 A AU 2002247609A AU 2002247609 A AU2002247609 A AU 2002247609A AU 2002247609 A1 AU2002247609 A1 AU 2002247609A1
Authority
AU
Australia
Prior art keywords
printed circuit
circuit boards
producing printed
producing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002247609A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FRACRAL AG
Original Assignee
FRACRAL AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FRACRAL AG filed Critical FRACRAL AG
Publication of AU2002247609A1 publication Critical patent/AU2002247609A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H05K3/242—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus characterised by using temporary conductors on the printed circuit for electrically connecting areas which are to be electroplated

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
AU2002247609A 2001-02-28 2002-02-28 Method for producing printed circuit boards Abandoned AU2002247609A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE2001109786 DE10109786A1 (en) 2001-02-28 2001-02-28 Process for the production of printed circuit boards
DE10109786.7 2001-02-28
PCT/DE2002/000713 WO2002069678A2 (en) 2001-02-28 2002-02-28 Method for producing printed circuit boards

Publications (1)

Publication Number Publication Date
AU2002247609A1 true AU2002247609A1 (en) 2002-09-12

Family

ID=7675887

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002247609A Abandoned AU2002247609A1 (en) 2001-02-28 2002-02-28 Method for producing printed circuit boards

Country Status (3)

Country Link
AU (1) AU2002247609A1 (en)
DE (1) DE10109786A1 (en)
WO (1) WO2002069678A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004001107B4 (en) * 2004-01-05 2005-12-29 Siemens Ag Structuring on surfaces by means of foil

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3430290A1 (en) * 1984-08-17 1986-02-27 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Method for selective metallisation
JPS6155994A (en) * 1984-08-27 1986-03-20 信越化学工業株式会社 Board for copper-lined flexible printed circuit
JP2811820B2 (en) * 1989-10-30 1998-10-15 株式会社ブリヂストン Continuous surface treatment method and apparatus for sheet material
DE4227085A1 (en) * 1992-08-17 1994-02-24 Bosch Gmbh Robert Process for the production of finely structured electrically conductive layers
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US6242078B1 (en) * 1998-07-28 2001-06-05 Isola Laminate Systems Corp. High density printed circuit substrate and method of fabrication
DE19850592C1 (en) * 1998-11-03 2000-10-12 Lpkf Laser & Electronics Ag Adhesion promoter layer for creating adhesive conductor structures on electronic insulation materials
DE19951721A1 (en) * 1999-10-27 2000-06-15 Lpkf Laser & Electronics Ag Very fine circuit production on polymer involves structurization by erosion with short wavelength electromagnetic radiation using metal coat penetrated by photons and erosion by plasma formed at interface with polymer

Also Published As

Publication number Publication date
WO2002069678A2 (en) 2002-09-06
DE10109786A1 (en) 2002-12-12

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase