AU2002221711A1 - Porous layers and method for production thereof by means of spin-coating - Google Patents
Porous layers and method for production thereof by means of spin-coatingInfo
- Publication number
- AU2002221711A1 AU2002221711A1 AU2002221711A AU2171102A AU2002221711A1 AU 2002221711 A1 AU2002221711 A1 AU 2002221711A1 AU 2002221711 A AU2002221711 A AU 2002221711A AU 2171102 A AU2171102 A AU 2171102A AU 2002221711 A1 AU2002221711 A1 AU 2002221711A1
- Authority
- AU
- Australia
- Prior art keywords
- spin
- coating
- production
- porous layers
- porous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000004528 spin coating Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02112—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer
- H01L21/02123—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon
- H01L21/02126—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer the material containing silicon the material containing Si, O, and at least one of H, N, C, F, or other non-metal elements, e.g. SiOC, SiOC:H or SiONC
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J29/00—Catalysts comprising molecular sieves
- B01J29/03—Catalysts comprising molecular sieves not having base-exchange properties
- B01J29/035—Microporous crystalline materials not having base exchange properties, such as silica polymorphs, e.g. silicalites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
- B01J37/00—Processes, in general, for preparing catalysts; Processes, in general, for activation of catalysts
- B01J37/02—Impregnation, coating or precipitation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
- B05D1/005—Spin coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/022—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being a laminate, i.e. composed of sublayers, e.g. stacks of alternating high-k metal oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02203—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being porous
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02109—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates
- H01L21/02205—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition
- H01L21/02208—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si
- H01L21/02214—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen
- H01L21/02216—Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates the layer being characterised by the precursor material for deposition the precursor containing a compound comprising Si the compound comprising silicon and oxygen the compound being a molecule comprising at least one silicon-oxygen bond and the compound having hydrogen or an organic group attached to the silicon or oxygen, e.g. a siloxane
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02282—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process liquid deposition, e.g. spin-coating, sol-gel techniques, spray coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/314—Inorganic layers
- H01L21/316—Inorganic layers composed of oxides or glassy oxides or oxide based glass
- H01L21/31695—Deposition of porous oxides or porous glassy oxides or oxide based porous glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/02—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a matt or rough surface
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10052075A DE10052075A1 (en) | 2000-10-19 | 2000-10-19 | Porous layers and a process for their production by means of spin coating |
DE10052075.8 | 2000-10-19 | ||
PCT/EP2001/012153 WO2002032589A2 (en) | 2000-10-19 | 2001-10-19 | Porous layers and method for production thereof by means of spin-coating |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002221711A1 true AU2002221711A1 (en) | 2002-04-29 |
Family
ID=7660471
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002221711A Abandoned AU2002221711A1 (en) | 2000-10-19 | 2001-10-19 | Porous layers and method for production thereof by means of spin-coating |
Country Status (5)
Country | Link |
---|---|
US (1) | US20040028809A1 (en) |
EP (1) | EP1333936A2 (en) |
AU (1) | AU2002221711A1 (en) |
DE (1) | DE10052075A1 (en) |
WO (1) | WO2002032589A2 (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2827856B1 (en) * | 2001-07-25 | 2004-06-04 | Saint Gobain Quartz | MINERAL FIBER PROVIDED WITH A MICROPOROUS OR MESOPOROUS COATING |
DE10146687C1 (en) * | 2001-09-21 | 2003-06-26 | Flabeg Solarglas Gmbh & Co Kg | Glass with a porous anti-reflective surface coating and method for producing the glass and use of such a glass |
US6932851B2 (en) | 2001-11-02 | 2005-08-23 | The Trustees Of Princeton University | Methods for the preparation of metallic alloy nanoparticles and compositions thereof |
US7303985B2 (en) * | 2003-11-17 | 2007-12-04 | Intel Corporation | Zeolite-carbon doped oxide composite low k dielectric |
DE602004021085D1 (en) * | 2004-03-11 | 2009-06-25 | Corning Inc | Ceramic composition with a silsesquioxane polymer |
DE102004028305B3 (en) * | 2004-06-11 | 2006-01-12 | J. Eberspächer GmbH & Co. KG | Porous vaporizer medium used in vaporizing burners in vehicle heating devices comprises a body having a pore structure and preferred pore orientation consisting of long chain particles made from magnetizable or magnetized material |
DE102004032962B4 (en) * | 2004-07-07 | 2007-11-29 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Device with a zeolite coating applied to a support and method for producing this zeolite coating |
US7303989B2 (en) * | 2004-11-22 | 2007-12-04 | Intel Corporation | Using zeolites to improve the mechanical strength of low-k interlayer dielectrics |
US7955645B2 (en) * | 2004-11-24 | 2011-06-07 | Sensirion Ag | Method for applying selectively a layer to a structured substrate by the usage of a temperature gradient in the substrate |
DE102005020168A1 (en) * | 2005-04-28 | 2006-11-02 | Schott Ag | Coating glass or ceramic substrate with anti-reflective layer using sol-gel process, employs e.g. silicon-aluminum mixed oxide with adsorbed hydrophobe present in sol-gel binder |
US8399057B2 (en) * | 2005-06-08 | 2013-03-19 | The Regents Of The University Of California | Ordered vertically oriented porous inorganic films produced through solution processing |
DE102005038044A1 (en) * | 2005-08-10 | 2007-02-15 | Sortech Ag | Layered composite and its production |
US7427570B2 (en) * | 2005-09-01 | 2008-09-23 | Micron Technology, Inc. | Porous organosilicate layers, and vapor deposition systems and methods for preparing same |
DE102006041469B3 (en) | 2006-09-02 | 2008-01-31 | Schott Ag | Coating anti-reflection layer containing silicon dioxide on a borosilicate glass body comprises wetting the body containing e.g. silicon dioxide with a coating solution containing e.g. hydrochloric acid, followed by drying and annealing |
DE102007010544A1 (en) | 2007-03-05 | 2008-09-11 | Wacker Chemie Ag | Layers of heterosubstituted silsesquioxanes |
EP2230545A1 (en) | 2009-03-19 | 2010-09-22 | BRITISH TELECOMMUNICATIONS public limited company | Passive remote air flow and cable detection |
EP2430653B1 (en) * | 2009-05-08 | 2019-03-13 | 1366 Technologies Inc. | Porous lift-off layer for selective removal of deposited films |
US8491962B2 (en) * | 2010-04-02 | 2013-07-23 | National Taiwan University | Method for manufacturing a low-k layer |
EP2424270B1 (en) * | 2010-08-23 | 2014-05-21 | Knowles Electronics Asia PTE. Ltd. | Loudspeaker system with improved sound |
DE102010054858C5 (en) | 2010-12-17 | 2024-04-11 | Interpane Entwicklungs- Und Beratungsgesellschaft Mbh | Method and device for producing a reflection-reducing coating |
CN102774851A (en) * | 2012-08-06 | 2012-11-14 | 黑龙江省科学院高技术研究院 | Method for preparing nano sillicalite-1 type total-silicalite molecular sieve |
US8794373B1 (en) * | 2013-03-15 | 2014-08-05 | Bose Corporation | Three-dimensional air-adsorbing structure |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4795543A (en) * | 1987-05-26 | 1989-01-03 | Transducer Research, Inc. | Spin coating of electrolytes |
US5151110A (en) * | 1990-09-11 | 1992-09-29 | University Of New Mexico | Molecular sieve sensors for selective detection at the nanogram level |
JPH05115828A (en) * | 1991-10-30 | 1993-05-14 | Canon Inc | Coating device |
FR2708482B1 (en) * | 1993-07-29 | 1995-09-29 | Inst Francais Du Petrole | Process for the manufacture of catalysts on supports including a step of centrifuging the support after coating. |
US5591517A (en) * | 1993-08-31 | 1997-01-07 | Sumitomo Osaka Cement Co., Ltd. | Antireflection film |
CN1057611C (en) * | 1993-08-31 | 2000-10-18 | 住友水泥株式会社 | Antireflection film |
GB9413863D0 (en) * | 1994-07-08 | 1994-08-24 | Exxon Chemical Patents Inc | Molecular sieves and processes for their manufacture |
SE9600970D0 (en) * | 1996-03-14 | 1996-03-14 | Johan Sterte | Process for making very thin films of molecular sieves |
US6066401A (en) * | 1998-02-25 | 2000-05-23 | National Research Council Of Canada | Wide-band two-layer antireflection coating for optical surfaces |
US6528034B1 (en) * | 1999-11-09 | 2003-03-04 | Board Of Trustees Of Michigan State University | Ultra-stable lamellar mesoporous silica compositions and process for the prepration thereof |
JP2004504716A (en) * | 2000-07-13 | 2004-02-12 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | Silica zeolite low dielectric constant thin film |
-
2000
- 2000-10-19 DE DE10052075A patent/DE10052075A1/en not_active Withdrawn
-
2001
- 2001-10-19 WO PCT/EP2001/012153 patent/WO2002032589A2/en not_active Application Discontinuation
- 2001-10-19 AU AU2002221711A patent/AU2002221711A1/en not_active Abandoned
- 2001-10-19 US US10/399,100 patent/US20040028809A1/en not_active Abandoned
- 2001-10-19 EP EP01987698A patent/EP1333936A2/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE10052075A1 (en) | 2002-05-02 |
WO2002032589A3 (en) | 2003-06-05 |
US20040028809A1 (en) | 2004-02-12 |
EP1333936A2 (en) | 2003-08-13 |
WO2002032589A2 (en) | 2002-04-25 |
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