AU2002216776A1 - Semiconductor processing equipment having improved particle performance - Google Patents

Semiconductor processing equipment having improved particle performance

Info

Publication number
AU2002216776A1
AU2002216776A1 AU2002216776A AU1677602A AU2002216776A1 AU 2002216776 A1 AU2002216776 A1 AU 2002216776A1 AU 2002216776 A AU2002216776 A AU 2002216776A AU 1677602 A AU1677602 A AU 1677602A AU 2002216776 A1 AU2002216776 A1 AU 2002216776A1
Authority
AU
Australia
Prior art keywords
processing equipment
semiconductor processing
improved particle
particle performance
performance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002216776A
Inventor
William Frederick Bosch
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2002216776A1 publication Critical patent/AU2002216776A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/0054Plasma-treatment, e.g. with gas-discharge plasma
    • CCHEMISTRY; METALLURGY
    • C04CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04BLIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4401Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
    • C23C16/4404Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Structural Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Drying Of Semiconductors (AREA)
AU2002216776A 2000-06-30 2001-06-25 Semiconductor processing equipment having improved particle performance Abandoned AU2002216776A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/607,922 US6890861B1 (en) 2000-06-30 2000-06-30 Semiconductor processing equipment having improved particle performance
US09/607922 2000-06-30
PCT/US2001/020284 WO2002003427A2 (en) 2000-06-30 2001-06-25 Semiconductor processing equipment having improved particle performance

Publications (1)

Publication Number Publication Date
AU2002216776A1 true AU2002216776A1 (en) 2002-01-14

Family

ID=24434265

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002216776A Abandoned AU2002216776A1 (en) 2000-06-30 2001-06-25 Semiconductor processing equipment having improved particle performance

Country Status (7)

Country Link
US (2) US6890861B1 (en)
EP (1) EP1295317A2 (en)
KR (2) KR100807138B1 (en)
CN (2) CN100545304C (en)
AU (1) AU2002216776A1 (en)
TW (1) TW557473B (en)
WO (1) WO2002003427A2 (en)

Families Citing this family (109)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100454122B1 (en) * 2002-04-09 2004-10-26 (주) 디에스테크노 Producting Method of a Porous SiC Guide Ring For CVD Apparatus
EP1497849B1 (en) * 2002-04-17 2010-06-23 Lam Research Corporation Method of manufacturing a silicon electrode for plasma reaction chambers
US6846726B2 (en) 2002-04-17 2005-01-25 Lam Research Corporation Silicon parts having reduced metallic impurity concentration for plasma reaction chambers
US20030233977A1 (en) * 2002-06-20 2003-12-25 Yeshwanth Narendar Method for forming semiconductor processing components
US20040134427A1 (en) * 2003-01-09 2004-07-15 Derderian Garo J. Deposition chamber surface enhancement and resulting deposition chambers
US20060226003A1 (en) * 2003-01-22 2006-10-12 John Mize Apparatus and methods for ionized deposition of a film or thin layer
JP4472372B2 (en) 2003-02-03 2010-06-02 株式会社オクテック Plasma processing apparatus and electrode plate for plasma processing apparatus
US6825123B2 (en) * 2003-04-15 2004-11-30 Saint-Goban Ceramics & Plastics, Inc. Method for treating semiconductor processing components and components formed thereby
US7267741B2 (en) * 2003-11-14 2007-09-11 Lam Research Corporation Silicon carbide components of semiconductor substrate processing apparatuses treated to remove free-carbon
US7220497B2 (en) * 2003-12-18 2007-05-22 Lam Research Corporation Yttria-coated ceramic components of semiconductor material processing apparatuses and methods of manufacturing the components
US7501370B2 (en) * 2004-01-06 2009-03-10 Saint-Gobain Ceramics & Plastics, Inc. High purity silicon carbide wafer boats
US20050205211A1 (en) * 2004-03-22 2005-09-22 Vikram Singh Plasma immersion ion implantion apparatus and method
JP4632290B2 (en) * 2004-03-23 2011-02-16 日本碍子株式会社 Cleaning method for aluminum nitride susceptor
US20050221020A1 (en) * 2004-03-30 2005-10-06 Tokyo Electron Limited Method of improving the wafer to wafer uniformity and defectivity of a deposited dielectric film
US7790633B1 (en) 2004-10-26 2010-09-07 Novellus Systems, Inc. Sequential deposition/anneal film densification method
JP2006140238A (en) * 2004-11-10 2006-06-01 Tokyo Electron Ltd Component for substrate treatment device and its manufacturing method
US8058186B2 (en) * 2004-11-10 2011-11-15 Tokyo Electron Limited Components for substrate processing apparatus and manufacturing method thereof
US9659758B2 (en) * 2005-03-22 2017-05-23 Honeywell International Inc. Coils utilized in vapor deposition applications and methods of production
US20060278520A1 (en) * 2005-06-13 2006-12-14 Lee Eal H Use of DC magnetron sputtering systems
US7511287B2 (en) * 2005-09-21 2009-03-31 Axcelis Technologies, Inc. Systems and methods that mitigate contamination and modify surface characteristics during ion implantation processes through the introduction of gases
US20070079936A1 (en) * 2005-09-29 2007-04-12 Applied Materials, Inc. Bonded multi-layer RF window
EP1772901B1 (en) * 2005-10-07 2012-07-25 Rohm and Haas Electronic Materials, L.L.C. Wafer holding article and method for semiconductor processing
JP5065660B2 (en) * 2005-12-02 2012-11-07 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. Semiconductor processing
US8057603B2 (en) * 2006-02-13 2011-11-15 Tokyo Electron Limited Method of cleaning substrate processing chamber, storage medium, and substrate processing chamber
US7737035B1 (en) * 2006-03-31 2010-06-15 Novellus Systems, Inc. Dual seal deposition process chamber and process
JP2007305890A (en) * 2006-05-15 2007-11-22 Elpida Memory Inc Semiconductor manufacturing apparatus
JP2008047869A (en) * 2006-06-13 2008-02-28 Hokuriku Seikei Kogyo Kk Shower plate and its fabrication process, plasma processing equipment employing it, plasma processing method and process for fabricating electronic device
US7514125B2 (en) * 2006-06-23 2009-04-07 Applied Materials, Inc. Methods to improve the in-film defectivity of PECVD amorphous carbon films
US7875824B2 (en) * 2006-10-16 2011-01-25 Lam Research Corporation Quartz guard ring centering features
US7482550B2 (en) * 2006-10-16 2009-01-27 Lam Research Corporation Quartz guard ring
US7854820B2 (en) * 2006-10-16 2010-12-21 Lam Research Corporation Upper electrode backing member with particle reducing features
JP5010234B2 (en) * 2006-10-23 2012-08-29 北陸成型工業株式会社 Shower plate in which gas discharge hole member is integrally sintered and manufacturing method thereof
US7655571B2 (en) * 2006-10-26 2010-02-02 Applied Materials, Inc. Integrated method and apparatus for efficient removal of halogen residues from etched substrates
JP5008957B2 (en) * 2006-11-30 2012-08-22 東京エレクトロン株式会社 Silicon nitride film forming method, forming apparatus, forming apparatus processing method, and program
US7993457B1 (en) 2007-01-23 2011-08-09 Novellus Systems, Inc. Deposition sub-chamber with variable flow
CN100577866C (en) * 2007-02-27 2010-01-06 中微半导体设备(上海)有限公司 Gas sprayer assembly applied in plasma reaction chamber, manufacture method and renewing reutilization method thereof
US8069817B2 (en) * 2007-03-30 2011-12-06 Lam Research Corporation Showerhead electrodes and showerhead electrode assemblies having low-particle performance for semiconductor material processing apparatuses
US8435379B2 (en) * 2007-05-08 2013-05-07 Applied Materials, Inc. Substrate cleaning chamber and cleaning and conditioning methods
US20080311294A1 (en) * 2007-06-15 2008-12-18 Hideki Ito Vapor-phase growth apparatus and vapor-phase growth method
US8034410B2 (en) 2007-07-17 2011-10-11 Asm International N.V. Protective inserts to line holes in parts for semiconductor process equipment
US7807222B2 (en) * 2007-09-17 2010-10-05 Asm International N.V. Semiconductor processing parts having apertures with deposited coatings and methods for forming the same
US8673080B2 (en) 2007-10-16 2014-03-18 Novellus Systems, Inc. Temperature controlled showerhead
JP5567486B2 (en) * 2007-10-31 2014-08-06 ラム リサーチ コーポレーション Silicon nitride-silicon dioxide high life consumable plasma processing components
US20090142247A1 (en) * 2007-12-03 2009-06-04 Applied Materials, Inc. Chemical treatment to reduce machining-induced sub-surface damage in semiconductor processing components comprising silicon carbide
US8418649B2 (en) * 2007-12-19 2013-04-16 Lam Research Corporation Composite showerhead electrode assembly for a plasma processing apparatus
SG187387A1 (en) 2007-12-19 2013-02-28 Lam Res Corp Film adhesive for semiconductor vacuum processing apparatus
US8058174B2 (en) * 2007-12-20 2011-11-15 Coorstek, Inc. Method for treating semiconductor processing components and components formed thereby
US20090194414A1 (en) * 2008-01-31 2009-08-06 Nolander Ira G Modified sputtering target and deposition components, methods of production and uses thereof
CN101521143B (en) * 2008-02-25 2012-12-26 北京北方微电子基地设备工艺研究中心有限责任公司 Lining mechanism for semiconductor processing equipment and manufacturing method thereof
FR2930561B1 (en) * 2008-04-28 2011-01-14 Altatech Semiconductor DEVICE AND METHOD FOR CHEMICAL TREATMENT IN STEAM PHASE.
JP2011524634A (en) 2008-06-09 2011-09-01 ポコ グラファイト、インコーポレイテッド Method to increase production and reduce downtime in semiconductor manufacturing units by pre-processing components using sub-aperture reactive atomic etching
JP5710591B2 (en) * 2009-04-20 2015-04-30 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Enhanced removal of residual fluorine radicals using a silicon coating on the process chamber walls
JP5415853B2 (en) 2009-07-10 2014-02-12 東京エレクトロン株式会社 Surface treatment method
TW201129719A (en) * 2009-10-20 2011-09-01 Saint Gobain Ceramics Microelectronic processing component having corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer
JP2011225949A (en) 2010-04-21 2011-11-10 Ibiden Co Ltd Carbon component and method of manufacturing the same
US11171008B2 (en) 2011-03-01 2021-11-09 Applied Materials, Inc. Abatement and strip process chamber in a dual load lock configuration
US8992689B2 (en) 2011-03-01 2015-03-31 Applied Materials, Inc. Method for removing halogen-containing residues from substrate
CN203205393U (en) 2011-03-01 2013-09-18 应用材料公司 Hoop assembly for transferring substrate and limiting free radical
US8845816B2 (en) 2011-03-01 2014-09-30 Applied Materials, Inc. Method extending the service interval of a gas distribution plate
JP6114698B2 (en) 2011-03-01 2017-04-12 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Detoxification and stripping chamber in a dual load lock configuration
SG192967A1 (en) 2011-03-04 2013-09-30 Novellus Systems Inc Hybrid ceramic showerhead
CN102994977B (en) * 2011-09-08 2015-01-14 北京北方微电子基地设备工艺研究中心有限责任公司 Cavity apparatus, and substrate processing device possessing same
US10224182B2 (en) 2011-10-17 2019-03-05 Novellus Systems, Inc. Mechanical suppression of parasitic plasma in substrate processing chamber
US9293305B2 (en) 2011-10-31 2016-03-22 Lam Research Corporation Mixed acid cleaning assemblies
KR102068186B1 (en) 2012-02-29 2020-02-11 어플라이드 머티어리얼스, 인코포레이티드 Abatement and strip process chamber in a load lock configuration
US20140097752A1 (en) * 2012-10-09 2014-04-10 Varian Semiconductor Equipment Associates, Inc. Inductively Coupled Plasma ION Source Chamber with Dopant Material Shield
US9449795B2 (en) * 2013-02-28 2016-09-20 Novellus Systems, Inc. Ceramic showerhead with embedded RF electrode for capacitively coupled plasma reactor
US9353439B2 (en) 2013-04-05 2016-05-31 Lam Research Corporation Cascade design showerhead for transient uniformity
US9123661B2 (en) 2013-08-07 2015-09-01 Lam Research Corporation Silicon containing confinement ring for plasma processing apparatus and method of forming thereof
US20150062772A1 (en) * 2013-08-27 2015-03-05 Varian Semiconductor Equipment Associates, Inc Barrier Layer For Electrostatic Chucks
US9837250B2 (en) * 2013-08-30 2017-12-05 Applied Materials, Inc. Hot wall reactor with cooled vacuum containment
CN103681246B (en) * 2013-12-30 2017-10-17 国家电网公司 A kind of SiC material cleaning method
WO2015134135A1 (en) * 2014-03-05 2015-09-11 Applied Materials, Inc. Critical chamber component surface improvement to reduce chamber particles
US10741365B2 (en) * 2014-05-05 2020-08-11 Lam Research Corporation Low volume showerhead with porous baffle
CN105097423B (en) * 2014-05-12 2018-09-18 中芯国际集成电路制造(上海)有限公司 Plasma reactor and the method for removing plasma reaction chamber particle contamination
KR101559112B1 (en) * 2014-05-13 2015-10-13 주식회사 펨빅스 Ceramic coating film of parts surface & manufacture method thereof
DE102014007903A1 (en) 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Electrostatic holding device with nubbed electrodes and method for their production
DE102014008031B4 (en) * 2014-05-28 2020-06-25 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co. Electrostatic holding device with a ceramic electrode and method for producing such a holding device
DE102014008029B4 (en) 2014-05-28 2023-05-17 Asml Netherlands B.V. Electrostatic chuck having an electrode support disc and method of making the chuck
DE102014008030A1 (en) 2014-05-28 2015-12-03 Berliner Glas Kgaa Herbert Kubatz Gmbh & Co Method of making an electrostatic chuck
US9534289B2 (en) * 2014-06-18 2017-01-03 Applied Materials, Inc. Plasma process chambers employing distribution grids having focusing surfaces thereon enabling angled fluxes to reach a substrate, and related methods
US10249511B2 (en) * 2014-06-27 2019-04-02 Lam Research Corporation Ceramic showerhead including central gas injector for tunable convective-diffusive gas flow in semiconductor substrate processing apparatus
US20160056059A1 (en) * 2014-08-22 2016-02-25 Applied Materials, Inc. Component for semiconductor process chamber having surface treatment to reduce particle emission
US10388820B2 (en) 2015-02-03 2019-08-20 Lg Electronics Inc. Metal organic chemical vapor deposition apparatus for solar cell
US10049862B2 (en) * 2015-04-17 2018-08-14 Lam Research Corporation Chamber with vertical support stem for symmetric conductance and RF delivery
JP2016207788A (en) * 2015-04-20 2016-12-08 東京エレクトロン株式会社 Surface treatment method for upper electrode, plasma processing apparatus, and upper electrode
US10378107B2 (en) 2015-05-22 2019-08-13 Lam Research Corporation Low volume showerhead with faceplate holes for improved flow uniformity
US10023959B2 (en) 2015-05-26 2018-07-17 Lam Research Corporation Anti-transient showerhead
US20160362782A1 (en) * 2015-06-15 2016-12-15 Taiwan Semiconductor Manufacturing Co., Ltd. Gas dispenser and deposition apparatus using the same
CN107393845A (en) * 2016-05-17 2017-11-24 北大方正集团有限公司 A kind of carborundum crystals crystal column surface separates out the removal system and method for carbon
US9947558B2 (en) * 2016-08-12 2018-04-17 Lam Research Corporation Method for conditioning silicon part
CN106206385A (en) * 2016-09-27 2016-12-07 上海华力微电子有限公司 A kind of chamber in-vivo metal that reduces pollutes etching polysilicon chamber and the method for content
KR101941232B1 (en) * 2016-12-20 2019-01-22 주식회사 티씨케이 Part for semiconductor manufactoring, part for semiconductor manufactoring including complex coating layer and method of manufacturning the same
USD852442S1 (en) 2017-04-25 2019-06-25 Samsung Electronics Co., Ltd. Pulsator for washing machine
USD878689S1 (en) 2017-04-25 2020-03-17 Samsung Electronics Co., Ltd. Washing machine
US11183373B2 (en) 2017-10-11 2021-11-23 Honeywell International Inc. Multi-patterned sputter traps and methods of making
US10760158B2 (en) * 2017-12-15 2020-09-01 Lam Research Corporation Ex situ coating of chamber components for semiconductor processing
CN111954801B (en) * 2018-05-04 2023-12-01 应用材料公司 Nanoparticle measurement for a processing chamber
DE102018124576A1 (en) * 2018-10-05 2020-04-09 Osram Opto Semiconductors Gmbh METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT WITH IMPLEMENTATION OF A PLASMA TREATMENT AND SEMICONDUCTOR COMPONENT
KR20200040537A (en) * 2018-10-10 2020-04-20 엘지디스플레이 주식회사 Source for vertical type vacuum deposition, source assembly and vertical type vacuum deposition apparatus using the same
KR102218433B1 (en) * 2018-11-29 2021-02-22 (주)디에스테크노 Semiconductor manufacturing equipment with showerhead using SiC with improved etching properties
US20210013000A1 (en) * 2019-07-09 2021-01-14 Entegris, Inc. Porous carbonaceous vacuum chamber liners
KR102200315B1 (en) * 2019-07-29 2021-01-08 세메스 주식회사 Substrate supporting device and substrate treating apparatus including the same
CN113097041B (en) * 2019-12-23 2023-10-31 中微半导体设备(上海)股份有限公司 Method for treating parts and components to prevent generation of pollutant and plasma treatment apparatus
USD979524S1 (en) 2020-03-19 2023-02-28 Applied Materials, Inc. Confinement liner for a substrate processing chamber
USD943539S1 (en) 2020-03-19 2022-02-15 Applied Materials, Inc. Confinement plate for a substrate processing chamber
US11380524B2 (en) 2020-03-19 2022-07-05 Applied Materials, Inc. Low resistance confinement liner for use in plasma chamber
CN111634916B (en) * 2020-06-24 2022-05-24 吴剑荣 Single crystal silicon layer efficient recovery process based on silicon rapid synthesis technology
TWI746222B (en) 2020-10-21 2021-11-11 財團法人工業技術研究院 Deposition apparatus

Family Cites Families (67)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3951587A (en) 1974-12-06 1976-04-20 Norton Company Silicon carbide diffusion furnace components
JPS6024290B2 (en) 1977-06-24 1985-06-12 川崎重工業株式会社 2-cycle engine blowback prevention device
US4401689A (en) 1980-01-31 1983-08-30 Rca Corporation Radiation heated reactor process for chemical vapor deposition on substrates
US4340462A (en) 1981-02-13 1982-07-20 Lam Research Corporation Adjustable electrode plasma processing chamber
US4518349A (en) 1983-12-01 1985-05-21 Better Semiconductor Processes (Bsp) Cantilevered boat-free semiconductor wafer handling system
JPS60138915A (en) 1983-12-26 1985-07-23 Toshiba Ceramics Co Ltd Furnace core tube of silicon carbide
JPS60200519A (en) 1984-03-26 1985-10-11 Hitachi Ltd Heating element
JPS61284301A (en) 1985-06-07 1986-12-15 Toshiba Corp Built-up tool
JPS6335452A (en) 1986-07-31 1988-02-16 東芝セラミツクス株式会社 Manufacture of structural member for semiconductor diffusion furnace
JP2550037B2 (en) 1986-12-01 1996-10-30 株式会社日立製作所 Dry etching method
JP2532227B2 (en) 1987-01-29 1996-09-11 電気興業株式会社 Carbon film vapor phase synthesizer
US4761134B1 (en) 1987-03-30 1993-11-16 Silicon carbide diffusion furnace components with an impervious coating thereon
JPH0741153Y2 (en) 1987-10-26 1995-09-20 東京応化工業株式会社 Sample processing electrode
US4999228A (en) 1988-05-06 1991-03-12 Shin-Etsu Chemical Co., Ltd. Silicon carbide diffusion tube for semi-conductor
US5262029A (en) 1988-05-23 1993-11-16 Lam Research Method and system for clamping semiconductor wafers
US4883703A (en) * 1988-08-29 1989-11-28 Riccio Louis M Method of adhering thermal spray to substrate and product formed thereby
US5182059A (en) 1989-01-17 1993-01-26 Ngk Insulators, Ltd. Process for producing high density SiC sintered bodies
US5252892A (en) 1989-02-16 1993-10-12 Tokyo Electron Limited Plasma processing apparatus
CA2065399C (en) 1989-08-09 2001-07-31 Stephen George Szirmai Producing electrosuspensions
US4948458A (en) 1989-08-14 1990-08-14 Lam Research Corporation Method and apparatus for producing magnetically-coupled planar plasma
IE73477B1 (en) * 1989-10-26 1997-06-04 Advanced Materials Enterprise Dense siC ceramic products
JP2597018B2 (en) 1989-12-26 1997-04-02 日本原子力研究所 Insulating member and electrical component using the same
DE4002327A1 (en) 1990-01-26 1991-08-01 Wacker Chemitronic METHOD FOR THE WET-CHEMICAL TREATMENT OF SEMICONDUCTOR SURFACES AND SOLUTION FOR ITS IMPLEMENTATION
US5391275A (en) 1990-03-02 1995-02-21 Applied Materials, Inc. Method for preparing a shield to reduce particles in a physical vapor deposition chamber
US5292399A (en) 1990-04-19 1994-03-08 Applied Materials, Inc. Plasma etching apparatus with conductive means for inhibiting arcing
JP2581268B2 (en) 1990-05-22 1997-02-12 日本電気株式会社 Semiconductor substrate processing method
US5074456A (en) 1990-09-18 1991-12-24 Lam Research Corporation Composite electrode for plasma processes
US5200232A (en) 1990-12-11 1993-04-06 Lam Research Corporation Reaction chamber design and method to minimize particle generation in chemical vapor deposition reactors
US5296288A (en) * 1992-04-09 1994-03-22 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Protective coating for ceramic materials
FR2695410B1 (en) 1992-09-04 1994-11-18 France Telecom Process for pretreatment of a substrate for the selective deposition of tungsten.
US5800618A (en) * 1992-11-12 1998-09-01 Ngk Insulators, Ltd. Plasma-generating electrode device, an electrode-embedded article, and a method of manufacturing thereof
US5460684A (en) 1992-12-04 1995-10-24 Tokyo Electron Limited Stage having electrostatic chuck and plasma processing apparatus using same
JP3250628B2 (en) 1992-12-17 2002-01-28 東芝セラミックス株式会社 Vertical semiconductor heat treatment jig
US5578129A (en) 1993-03-17 1996-11-26 Tokyo Electron Limited Gas supplying head and load lock chamber of semiconductor processing system
US5482673A (en) * 1994-05-27 1996-01-09 Martin Marietta Energy Systems, Inc. Method for preparing ceramic composite
JP3361385B2 (en) 1994-06-30 2003-01-07 東芝機械株式会社 heater
US5538230A (en) 1994-08-08 1996-07-23 Sibley; Thomas Silicon carbide carrier for wafer processing
US5516730A (en) 1994-08-26 1996-05-14 Memc Electronic Materials, Inc. Pre-thermal treatment cleaning process of wafers
JP2914555B2 (en) 1994-08-30 1999-07-05 信越半導体株式会社 Cleaning method for semiconductor silicon wafer
ATE300630T1 (en) 1994-09-26 2005-08-15 Steris Inc ACID TREATMENT OF STAINLESS STEEL
JP3778299B2 (en) 1995-02-07 2006-05-24 東京エレクトロン株式会社 Plasma etching method
JPH08264552A (en) 1995-03-24 1996-10-11 Toshiba Ceramics Co Ltd Production of silicon wafer
US5569356A (en) 1995-05-19 1996-10-29 Lam Research Corporation Electrode clamping assembly and method for assembly and use thereof
US5838529A (en) 1995-12-22 1998-11-17 Lam Research Corporation Low voltage electrostatic clamp for substrates such as dielectric substrates
US6159297A (en) 1996-04-25 2000-12-12 Applied Materials, Inc. Semiconductor process chamber and processing method
JP3360265B2 (en) 1996-04-26 2002-12-24 東京エレクトロン株式会社 Plasma processing method and plasma processing apparatus
US5863376A (en) 1996-06-05 1999-01-26 Lam Research Corporation Temperature controlling method and apparatus for a plasma processing chamber
US5820723A (en) 1996-06-05 1998-10-13 Lam Research Corporation Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and/or cantilevered substrate support
JP3524679B2 (en) 1996-06-21 2004-05-10 東芝セラミックス株式会社 High purity CVD-SiC semiconductor heat treatment member and method of manufacturing the same
US5904778A (en) 1996-07-26 1999-05-18 Applied Materials, Inc. Silicon carbide composite article particularly useful for plasma reactors
US6120640A (en) * 1996-12-19 2000-09-19 Applied Materials, Inc. Boron carbide parts and coatings in a plasma reactor
JPH10209106A (en) 1997-01-20 1998-08-07 Toshiba Corp Method and equipment for cleaning semiconductor substrate
US5843239A (en) 1997-03-03 1998-12-01 Applied Materials, Inc. Two-step process for cleaning a substrate processing chamber
US5861086A (en) 1997-03-10 1999-01-19 Applied Materials, Inc. Method and apparatus for sputter etch conditioning a ceramic body
TW416100B (en) 1997-07-02 2000-12-21 Applied Materials Inc Control of oxygen to silane ratio in a seasoning process to improve particle performance in an HDP-CVD system
US5892236A (en) 1997-07-09 1999-04-06 Bridgestone Corporation Part for ion implantation device
US6268014B1 (en) * 1997-10-02 2001-07-31 Chris Eberspacher Method for forming solar cell materials from particulars
US6379575B1 (en) 1997-10-21 2002-04-30 Applied Materials, Inc. Treatment of etching chambers using activated cleaning gas
JP3201322B2 (en) 1997-12-09 2001-08-20 日本電気株式会社 Email billing system
US5837662A (en) 1997-12-12 1998-11-17 Memc Electronic Materials, Inc. Post-lapping cleaning process for silicon wafers
ATE345577T1 (en) 1998-03-31 2006-12-15 Lam Res Corp PLASMA PROCESSING CHAMBER AND METHOD FOR CONTROLLING IMPURITIES
US6267121B1 (en) * 1999-02-11 2001-07-31 Taiwan Semiconductor Manufacturing Company Process to season and determine condition of a high density plasma etcher
JP3207833B2 (en) * 1999-10-15 2001-09-10 三菱重工業株式会社 Method for producing spent fuel storage member and mixed powder
US6506254B1 (en) 2000-06-30 2003-01-14 Lam Research Corporation Semiconductor processing equipment having improved particle performance
JP3207841B1 (en) * 2000-07-12 2001-09-10 三菱重工業株式会社 Aluminum composite powder and method for producing the same, aluminum composite material, spent fuel storage member and method for producing the same
US6706319B2 (en) * 2001-12-05 2004-03-16 Siemens Westinghouse Power Corporation Mixed powder deposition of components for wear, erosion and abrasion resistant applications
US6814813B2 (en) * 2002-04-24 2004-11-09 Micron Technology, Inc. Chemical vapor deposition apparatus

Also Published As

Publication number Publication date
CN1440563A (en) 2003-09-03
CN1702193A (en) 2005-11-30
EP1295317A2 (en) 2003-03-26
CN1230868C (en) 2005-12-07
WO2002003427A2 (en) 2002-01-10
WO2002003427A3 (en) 2002-04-11
TW557473B (en) 2003-10-11
US20050181617A1 (en) 2005-08-18
KR100807138B1 (en) 2008-02-27
CN100545304C (en) 2009-09-30
KR20060081724A (en) 2006-07-13
US6890861B1 (en) 2005-05-10
KR20030010760A (en) 2003-02-05
US7802539B2 (en) 2010-09-28
KR100834324B1 (en) 2008-06-02

Similar Documents

Publication Publication Date Title
AU2002216776A1 (en) Semiconductor processing equipment having improved particle performance
AUPR174800A0 (en) Semiconductor processing
AU2001234973A1 (en) Semiconductor devices
AU2002256126A1 (en) Semiconductor back side processing
AU2000224587A1 (en) Semiconductor device
AU2001236028A1 (en) Semiconductor device
AU2319600A (en) Semiconductor device
AU5488400A (en) High performance nanocomposites
AU2002316979A1 (en) Semiconductor device
EP1102327A3 (en) Field effect semiconductor device
AU2002221142A1 (en) Semiconductor photocathode
AU2001290329A1 (en) Vacuum processing device
AU2002346536A1 (en) Integrated circuit processing system
EP1220450B8 (en) Semiconductor integrated circuit
AU2002338003A1 (en) Semiconductor Devices
AU2001227876A1 (en) Circuit breaker with particle trap
AU2001253513A1 (en) Substrate processing system
AU2002338574A1 (en) Compensation-data processing
AU2002330511A1 (en) Semiconductor calculation device
AU2002345831A1 (en) Magnetic devices comprising magnetic meta-materials
AU2002215217A1 (en) Semiconductor photocathode
AU2000274531A1 (en) Semiconductor device
AU2001274345A1 (en) Processing an object
AU2001216493A1 (en) Semiconductor device
AUPR174900A0 (en) Semiconductor processing 2