AU2001295702A1 - Device for fast and uniform heating of a substrate with infrared radiation - Google Patents
Device for fast and uniform heating of a substrate with infrared radiationInfo
- Publication number
- AU2001295702A1 AU2001295702A1 AU2001295702A AU9570201A AU2001295702A1 AU 2001295702 A1 AU2001295702 A1 AU 2001295702A1 AU 2001295702 A AU2001295702 A AU 2001295702A AU 9570201 A AU9570201 A AU 9570201A AU 2001295702 A1 AU2001295702 A1 AU 2001295702A1
- Authority
- AU
- Australia
- Prior art keywords
- substrate
- lamps
- infrared radiation
- heating
- uniform heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000010438 heat treatment Methods 0.000 title abstract 5
- 239000000758 substrate Substances 0.000 title abstract 5
- 230000005855 radiation Effects 0.000 title abstract 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Furnace Details (AREA)
- Physical Vapour Deposition (AREA)
- Light Receiving Elements (AREA)
- Drying Of Solid Materials (AREA)
- Resistance Heating (AREA)
- Control Of Resistance Heating (AREA)
Abstract
A heating device comprises infrared radiation lamps 24, 26 designed to perform rapid thermal processing of the substrate 12 inside a reaction chamber 14 with a transparent window 34. The infrared lamps 24, 26 are arranged in two superposed stages A, B extending on a single side of the substrate 12, the lamps 24 of the lower stage A being arranged perpendicularly with respect to the lamps 26 of the upper stage B. Means for adjusting the supply power by group of lamps provide greater heating on the edges than in the centre of the substrate 12. A reflector 36 in the form of a distribution grid 38 is designed to reflect the infrared radiation to control the power ratios between the different heating zones. This results in uniform heating of the substrate 12 regardless of the geometry and dimensions thereof.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR00/13182 | 2000-10-13 | ||
FR0013182A FR2815395B1 (en) | 2000-10-13 | 2000-10-13 | DEVICE FOR QUICK AND UNIFORM HEATING OF A SUBSTRATE BY INFRARED RADIATION |
PCT/FR2001/003171 WO2002031862A2 (en) | 2000-10-13 | 2001-10-12 | Device for fast and uniform heating of a substrate with infrared radiation |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001295702A1 true AU2001295702A1 (en) | 2002-04-22 |
Family
ID=8855352
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001295702A Abandoned AU2001295702A1 (en) | 2000-10-13 | 2001-10-12 | Device for fast and uniform heating of a substrate with infrared radiation |
Country Status (11)
Country | Link |
---|---|
US (1) | US6759632B2 (en) |
EP (1) | EP1250711B1 (en) |
JP (1) | JP2004511907A (en) |
KR (1) | KR100832273B1 (en) |
CN (1) | CN1404623A (en) |
AT (1) | ATE392710T1 (en) |
AU (1) | AU2001295702A1 (en) |
CA (1) | CA2394426C (en) |
DE (1) | DE60133628T2 (en) |
FR (1) | FR2815395B1 (en) |
WO (1) | WO2002031862A2 (en) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6734457B2 (en) * | 2001-11-27 | 2004-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device |
US20060164614A1 (en) * | 2005-01-21 | 2006-07-27 | Hua-Kuo Chen | Exposing machine for a printed circuit board |
US20070017395A1 (en) * | 2005-07-22 | 2007-01-25 | Neri Joel D | Method and apparatus for uniformly heating a substrate |
JP2008071787A (en) * | 2006-09-12 | 2008-03-27 | Ushio Inc | Heating device of light irradiation type and heating method of light irradiation type |
US7598150B2 (en) * | 2006-11-20 | 2009-10-06 | Applied Materials, Inc. | Compensation techniques for substrate heating processes |
ITMO20060389A1 (en) * | 2006-11-22 | 2008-05-23 | Viv Int Spa | EQUIPMENT AND METHOD FOR DECORATING OBJECTS |
WO2008069041A1 (en) * | 2006-12-01 | 2008-06-12 | Teijin Fibers Limited | Method of imparting function to molded polymer and apparatus therefor |
US20080197493A1 (en) * | 2007-02-16 | 2008-08-21 | Stefan Geyer | Integrated circuit including conductive bumps |
US7896053B2 (en) * | 2007-09-27 | 2011-03-01 | Babcock & Wilcox Services Y-12, LLC | Non-destructive component separation using infrared radiant energy |
KR20100139092A (en) * | 2008-03-26 | 2010-12-31 | 지티 솔라 인코퍼레이티드 | Gold-coated polysilicon reactor system and method |
KR101535547B1 (en) * | 2008-09-05 | 2015-07-10 | 주성엔지니어링(주) | Substrate processing apparatus |
US8232114B2 (en) * | 2009-01-27 | 2012-07-31 | Taiwan Semiconductor Manufacturing Co., Ltd. | RTP spike annealing for semiconductor substrate dopant activation |
US8404572B2 (en) * | 2009-02-13 | 2013-03-26 | Taiwan Semiconductor Manufacturing Co., Ltd | Multi-zone temperature control for semiconductor wafer |
US20110217848A1 (en) * | 2010-03-03 | 2011-09-08 | Bergman Eric J | Photoresist removing processor and methods |
TWI399863B (en) * | 2010-05-26 | 2013-06-21 | Inventec Solar Energy Corp | Rapid thermal annealing apparatus for selective heat treatment and method for selective emitter solar cell fabrication using the same |
NL2009189A (en) | 2011-08-17 | 2013-02-19 | Asml Netherlands Bv | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method. |
EP3514700A1 (en) | 2013-02-20 | 2019-07-24 | Hartford Steam Boiler Inspection and Insurance Company | Dynamic outlier bias reduction system and method |
WO2015043890A1 (en) | 2013-09-27 | 2015-04-02 | Asml Netherlands B.V. | Support table for a lithographic apparatus, lithographic apparatus and device manufacturing method |
US11015244B2 (en) | 2013-12-30 | 2021-05-25 | Advanced Material Solutions, Llc | Radiation shielding for a CVD reactor |
KR101809141B1 (en) * | 2014-05-29 | 2018-01-19 | 에이피시스템 주식회사 | Apparatus for heating substrate and heater block |
RU2580353C1 (en) * | 2014-12-24 | 2016-04-10 | Общество с ограниченной ответственностью "Теркон-КТТ" | Method of conducting precision thermal processes in infrared heating furnace and infrared heating furnace for implementation for conducting thermal processes |
JP6687436B2 (en) * | 2015-04-30 | 2020-04-22 | 芝浦メカトロニクス株式会社 | Substrate processing apparatus and substrate processing method |
KR101860631B1 (en) * | 2015-04-30 | 2018-05-23 | 시바우라 메카트로닉스 가부시끼가이샤 | Substrate treatment device and substrate treatment method |
US10727094B2 (en) * | 2016-01-29 | 2020-07-28 | Taiwan Semiconductor Manufacturing Co., Ltd | Thermal reflector device for semiconductor fabrication tool |
JP6622617B2 (en) * | 2016-02-18 | 2019-12-18 | 株式会社Screenホールディングス | Heat treatment equipment |
CN116705669B (en) * | 2023-08-04 | 2023-10-20 | 盛吉盛半导体科技(北京)有限公司 | Heating lamp panel for semiconductor equipment with uniform cooling effect and cooling method |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL8602356A (en) * | 1985-10-07 | 1987-05-04 | Epsilon Ltd Partnership | APPARATUS AND METHOD FOR AN AXIAL SYMMETRICAL REACTOR FOR THE CHEMICAL VAPORIZATION. |
US5155336A (en) * | 1990-01-19 | 1992-10-13 | Applied Materials, Inc. | Rapid thermal heating apparatus and method |
US5444814A (en) * | 1993-11-01 | 1995-08-22 | Hofius, Sr.; David V. | Method of infrared welding on thermoplastic parts utilizing contoured energy reflecting shields |
US5740314A (en) * | 1995-08-25 | 1998-04-14 | Edison Welding Institute | IR heating lamp array with reflectors modified by removal of segments thereof |
US5951896A (en) * | 1996-12-04 | 1999-09-14 | Micro C Technologies, Inc. | Rapid thermal processing heater technology and method of use |
KR100223549B1 (en) * | 1996-12-28 | 1999-10-15 | 양재신 | Spare tire mounting apparatus of a car |
JP4436565B2 (en) * | 1998-03-02 | 2010-03-24 | シュテアク エルテーペー システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | Apparatus for heat treating a substrate |
US6108491A (en) * | 1998-10-30 | 2000-08-22 | Applied Materials, Inc. | Dual surface reflector |
WO2000030157A1 (en) * | 1998-11-16 | 2000-05-25 | Fsi International, Inc. | Equipment for uv wafer heating and photochemical processing |
US6310328B1 (en) * | 1998-12-10 | 2001-10-30 | Mattson Technologies, Inc. | Rapid thermal processing chamber for processing multiple wafers |
US6465761B2 (en) * | 2000-07-24 | 2002-10-15 | Asm America, Inc. | Heat lamps for zone heating |
-
2000
- 2000-10-13 FR FR0013182A patent/FR2815395B1/en not_active Expired - Fee Related
-
2001
- 2001-10-12 JP JP2002535156A patent/JP2004511907A/en not_active Withdrawn
- 2001-10-12 AT AT01976424T patent/ATE392710T1/en not_active IP Right Cessation
- 2001-10-12 KR KR1020027007453A patent/KR100832273B1/en not_active IP Right Cessation
- 2001-10-12 CA CA2394426A patent/CA2394426C/en not_active Expired - Fee Related
- 2001-10-12 US US10/148,339 patent/US6759632B2/en not_active Expired - Fee Related
- 2001-10-12 DE DE60133628T patent/DE60133628T2/en not_active Expired - Lifetime
- 2001-10-12 CN CN01803119A patent/CN1404623A/en active Pending
- 2001-10-12 WO PCT/FR2001/003171 patent/WO2002031862A2/en active IP Right Grant
- 2001-10-12 EP EP01976424A patent/EP1250711B1/en not_active Expired - Lifetime
- 2001-10-12 AU AU2001295702A patent/AU2001295702A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
DE60133628D1 (en) | 2008-05-29 |
KR20020059853A (en) | 2002-07-13 |
DE60133628T2 (en) | 2009-05-28 |
WO2002031862A2 (en) | 2002-04-18 |
KR100832273B1 (en) | 2008-05-26 |
FR2815395B1 (en) | 2004-06-18 |
FR2815395A1 (en) | 2002-04-19 |
ATE392710T1 (en) | 2008-05-15 |
US6759632B2 (en) | 2004-07-06 |
CA2394426C (en) | 2011-09-27 |
EP1250711B1 (en) | 2008-04-16 |
WO2002031862A3 (en) | 2002-07-25 |
JP2004511907A (en) | 2004-04-15 |
EP1250711A2 (en) | 2002-10-23 |
CA2394426A1 (en) | 2002-04-18 |
CN1404623A (en) | 2003-03-19 |
US20040052511A1 (en) | 2004-03-18 |
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