AU2001288930A1 - Wafer carrier for cmp system - Google Patents

Wafer carrier for cmp system

Info

Publication number
AU2001288930A1
AU2001288930A1 AU2001288930A AU8893001A AU2001288930A1 AU 2001288930 A1 AU2001288930 A1 AU 2001288930A1 AU 2001288930 A AU2001288930 A AU 2001288930A AU 8893001 A AU8893001 A AU 8893001A AU 2001288930 A1 AU2001288930 A1 AU 2001288930A1
Authority
AU
Australia
Prior art keywords
wafer carrier
cmp system
cmp
wafer
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001288930A
Inventor
Yehiel Gotkis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of AU2001288930A1 publication Critical patent/AU2001288930A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
AU2001288930A 2000-09-26 2001-09-06 Wafer carrier for cmp system Abandoned AU2001288930A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/670,469 US6454637B1 (en) 2000-09-26 2000-09-26 Edge instability suppressing device and system
US09670469 2000-09-26
PCT/US2001/028158 WO2002026444A1 (en) 2000-09-26 2001-09-06 Wafer carrier for cmp system

Publications (1)

Publication Number Publication Date
AU2001288930A1 true AU2001288930A1 (en) 2002-04-08

Family

ID=24690518

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001288930A Abandoned AU2001288930A1 (en) 2000-09-26 2001-09-06 Wafer carrier for cmp system

Country Status (7)

Country Link
US (1) US6454637B1 (en)
EP (1) EP1320440A1 (en)
JP (1) JP2004510336A (en)
KR (1) KR20030034209A (en)
AU (1) AU2001288930A1 (en)
TW (1) TW506010B (en)
WO (1) WO2002026444A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3797861B2 (en) * 2000-09-27 2006-07-19 株式会社荏原製作所 Polishing device
JP4025960B2 (en) * 2001-08-08 2007-12-26 信越化学工業株式会社 Polishing method for square photomask substrate, square photomask substrate, photomask blanks and photomask
US6916226B2 (en) * 2002-05-28 2005-07-12 Ebara Technologies, Inc. Chemical mechanical polishing apparatus having a stepped retaining ring and method for use thereof
JP2007088143A (en) * 2005-09-21 2007-04-05 Elpida Memory Inc Edge grinding device
US7666068B2 (en) * 2007-05-21 2010-02-23 Taiwan Semiconductor Manufacturing Company, Ltd. Retainer ring
KR101775464B1 (en) * 2011-05-31 2017-09-07 삼성전자주식회사 Retainer ring in Chemical Mechanical Polishing machine
US9227297B2 (en) * 2013-03-20 2016-01-05 Applied Materials, Inc. Retaining ring with attachable segments
JP2018133393A (en) * 2017-02-14 2018-08-23 東芝メモリ株式会社 Semiconductor manufacturing apparatus and semiconductor device manufacturing method
JP7083722B2 (en) * 2018-08-06 2022-06-13 株式会社荏原製作所 Polishing equipment and polishing method
JP7162465B2 (en) 2018-08-06 2022-10-28 株式会社荏原製作所 Polishing device and polishing method
JP7049984B2 (en) * 2018-12-27 2022-04-07 株式会社荏原製作所 How to control the tilt of the grinder and the stationary ring
JP7178259B2 (en) * 2018-12-27 2022-11-25 株式会社荏原製作所 Polishing device and polishing method
US11691244B2 (en) * 2020-07-08 2023-07-04 Applied Materials, Inc. Multi-toothed, magnetically controlled retaining ring

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07230973A (en) * 1994-02-18 1995-08-29 Toshiba Corp Semiconductor processing equipment
JP3158934B2 (en) * 1995-02-28 2001-04-23 三菱マテリアル株式会社 Wafer polishing equipment
US5597346A (en) * 1995-03-09 1997-01-28 Texas Instruments Incorporated Method and apparatus for holding a semiconductor wafer during a chemical mechanical polish (CMP) process
JP3106418B2 (en) * 1996-07-30 2000-11-06 株式会社東京精密 Polishing equipment
JP2800802B2 (en) * 1996-09-20 1998-09-21 日本電気株式会社 Semiconductor wafer CMP equipment
JP3807807B2 (en) * 1997-02-27 2006-08-09 株式会社荏原製作所 Polishing device
US6077385A (en) 1997-04-08 2000-06-20 Ebara Corporation Polishing apparatus
US6030487A (en) 1997-06-19 2000-02-29 International Business Machines Corporation Wafer carrier assembly
US6080040A (en) * 1997-11-05 2000-06-27 Aplex Group Wafer carrier head with inflatable bladder and attack angle control for polishing
JP3065016B2 (en) * 1998-02-17 2000-07-12 日本電気株式会社 Polishing apparatus and polishing method
JP2917992B1 (en) * 1998-04-10 1999-07-12 日本電気株式会社 Polishing equipment
KR100306824B1 (en) * 1998-05-06 2001-11-30 윤종용 Wafer holder for chemical-mechanical planarization apparatus
JPH11333712A (en) * 1998-05-21 1999-12-07 Nikon Corp Polishing head and polishing device using it
US6089961A (en) * 1998-12-07 2000-07-18 Speedfam-Ipec Corporation Wafer polishing carrier and ring extension therefor
US6110012A (en) * 1998-12-24 2000-08-29 Lucent Technologies Inc. Chemical-mechanical polishing apparatus and method
US6066030A (en) * 1999-03-04 2000-05-23 International Business Machines Corporation Electroetch and chemical mechanical polishing equipment
TW383644U (en) * 1999-03-23 2000-03-01 Vanguard Int Semiconduct Corp Dressing apparatus
US6290584B1 (en) 1999-08-13 2001-09-18 Speedfam-Ipec Corporation Workpiece carrier with segmented and floating retaining elements
JP2002018699A (en) * 2000-07-07 2002-01-22 Tokyo Seimitsu Co Ltd Wafer polisher

Also Published As

Publication number Publication date
WO2002026444A1 (en) 2002-04-04
JP2004510336A (en) 2004-04-02
US6454637B1 (en) 2002-09-24
EP1320440A1 (en) 2003-06-25
TW506010B (en) 2002-10-11
KR20030034209A (en) 2003-05-01

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